System On Chip (SoC)
Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XCZU1EG-1SFVC784IIC ZUP MPSOC A53 FPGA 784BGA |
4,448 |
|
Datasheet | Zynq® UltraScale+™ | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | - | 500MHz, 600MHz, 1.2GHz | - | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
5CSXFC6D6F31C7NIC SOC CORTEX-A9 800MHZ 896FBGA |
4,575 |
|
Datasheet | Cyclone® V SX | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 896-FBGA (31x31) |
|
M2S150-1FCV484IC SOC CORTEX-M3 166MHZ 484FBGA |
4,533 |
|
Datasheet | SmartFusion®2 | 484-BFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FBGA (19x19) |
|
M2S150-1FCVG484IC SOC CORTEX-M3 166MHZ 484FBGA |
3,941 |
|
Datasheet | SmartFusion®2 | 484-BFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FBGA (19x19) |
|
M2S150-FCV484IIC SOC CORTEX-M3 166MHZ 484FBGA |
1,107 |
|
Datasheet | SmartFusion®2 | 484-BFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 484-FBGA (19x19) |
|
5CSEBA6U23A7NIC SOC CORTEX-A9 700MHZ 672UBGA |
4,712 |
|
Datasheet | Cyclone® V SE | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 700MHz | FPGA - 110K Logic Elements | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 672-UBGA (23x23) |
|
XC7Z030-1FB484IIC SOC CORTEX-A9 667MHZ 484FCBGA |
1,877 |
|
Datasheet | Zynq®-7000 | 484-BBGA, FCBGA | Bulk | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (23x23) |
|
M2S060TS-1FG484MIC SOC CORTEX-M3 166MHZ 484FBGA |
3,239 |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | -55°C ~ 125°C (TJ) | - | - | 484-FPBGA (23x23) |
|
M2S060TS-1FGG484MIC SOC CORTEX-M3 166MHZ 484FBGA |
1,061 |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | -55°C ~ 125°C (TJ) | - | - | 484-FPBGA (23x23) |
|
|
XCZU2CG-L1SFVA625IIC SOC CORTEX-A53 625FCBGA |
2,587 |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 625-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
|
SOM-2532BCBC-S0A1SBC 1.0GHZ 2 CORE 16GB/64GB RAM |
4,753 |
|
Datasheet | - | Module | Bulk | Active | MPU | Intel® Atom® x6200FE | 32GB | 4GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | 1GHz | - | 0°C ~ 60°C | - | - | - |
|
XC7Z030-2SBG485EIC SOC CORTEX-A9 800MHZ 485FCBGA |
3,004 |
|
Datasheet | Zynq®-7000 | 484-FBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 125K Logic Cells | 0°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
|
M2S100-FC1152IC SOC CORTEX-M3 166MHZ 1152BGA |
3,763 |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 100K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
M2S100-FCG1152IC SOC CORTEX-M3 166MHZ 1152BGA |
4,804 |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 100K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
|
XCZU1CG-L2SFVA625EIC ZUP MPSOC LP A53 FPGA 625BGA |
3,732 |
|
Datasheet | Zynq® UltraScale+™ | 625-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 533MHz, 1.333GHz | - | 0°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
|
|
XCZU1CG-2SFVA625IIC ZUP MPSOC A53 FPGA 625BGA |
3,248 |
|
Datasheet | Zynq® UltraScale+™ | 625-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 533MHz, 1.333GHz | - | -40°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
|
XCZU1EG-L1SBVA484IIC ZUP MPSOC LP A53 FPGA 484BGA |
4,043 |
|
Datasheet | Zynq® UltraScale+™ | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | - | 500MHz, 600MHz, 1.2GHz | - | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
|
XCZU1EG-2SBVA484EIC ZUP MPSOC A53 FPGA 484BGA |
1,472 |
|
Datasheet | Zynq® UltraScale+™ | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | - | 533MHz, 600MHz, 1.333GHz | - | 0°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
|
5CSEMA6U23A7NIC SOC CORTEX-A9 700MHZ 672UBGA |
2,232 |
|
Datasheet | Cyclone® V SE | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 700MHz | FPGA - 110K Logic Elements | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 672-UBGA (23x23) |
|
RB69-6740-2211-I2-VSBC 1.8GHZ 2 CORE 4GB/0GB RAM |
1,746 |
|
Datasheet | - | Module | Box | Obsolete | MPU | Intel® Atom® x5-E3930 | 32GB | 4GB | LVDS | Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 1.8GHz | - | -40°C ~ 85°C | - | - | - |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.