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ELECTRONIC COMPONENTS

System On Chip (SoC)

Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
M2S150-1FCVG484I Microchip Technology

M2S150-1FCVG484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

4,413
Datasheet SmartFusion®2 484-BFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules -40°C ~ 100°C (TJ) - - 484-FBGA (19x19)
XCZU1EG-L2UBVA494E AMD

XCZU1EG-L2UBVA494E

IC ZUP MPSOC EG A53 FPGA 494BGA

AMD

4,570
Datasheet Zynq® UltraScale+™ MPSoC EG 494-WFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT - 533MHz, 600MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 81K+ Logic Cells 0°C ~ 100°C (TJ) - - 494-FCBGA (14x14)
M2S150TS-FCV484 Microchip Technology

M2S150TS-FCV484

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

4,611
Datasheet SmartFusion®2 484-BFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ) - - 484-FBGA (19x19)
M2S150TS-FCVG484 Microchip Technology

M2S150TS-FCVG484

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

4,344
Datasheet SmartFusion®2 484-BFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ) - - 484-FBGA (19x19)
XCZU2EG-1SFVC784I AMD

XCZU2EG-1SFVC784I

IC SOC CORTEX-A53 784FCBGA

AMD

2,891
Datasheet Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 103K+ Logic Cells -40°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XAZU1EG-L1SFVC784I AMD

XAZU1EG-L1SFVC784I

ZUP MPSOC A53 FPGA Q LP 784BGA

AMD

4,421
Datasheet Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 82K Logic Cells -40°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
5CSEMA6F31A7N Intel

5CSEMA6F31A7N

IC SOC CORTEX-A9 700MHZ 896FBGA

Intel

4,433
Datasheet Cyclone® V SE 896-BGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 64KB DMA, POR, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 700MHz FPGA - 110K Logic Elements -40°C ~ 125°C (TJ) Automotive AEC-Q100 896-FBGA (31x31)
XCZU3CG-1SFVA625E AMD

XCZU3CG-1SFVA625E

IC SOC CORTEX-A53 625FCBGA

AMD

3,901
Datasheet Zynq® UltraScale+™ MPSoC CG 625-BFBGA, FCBGA Bulk Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 0°C ~ 100°C (TJ) - - 625-FCBGA (21x21)
XCZU2CG-2SFVA625I AMD

XCZU2CG-2SFVA625I

IC SOC CORTEX-A53 625FCBGA

AMD

1,207
Datasheet Zynq® UltraScale+™ MPSoC CG 625-BFBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 103K+ Logic Cells -40°C ~ 100°C (TJ) - - 625-FCBGA (21x21)
XCZU2CG-L2SFVA625E AMD

XCZU2CG-L2SFVA625E

IC SOC CORTEX-A53 625FCBGA

AMD

1,333
Datasheet Zynq® UltraScale+™ MPSoC CG 625-BFBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 103K+ Logic Cells 0°C ~ 100°C (TJ) - - 625-FCBGA (21x21)
XCZU1EG-L2SBVA484E AMD

XCZU1EG-L2SBVA484E

IC ZUP MPSOC LP A53 FPGA 484BGA

AMD

2,044
Datasheet Zynq® UltraScale+™ 484-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT - 533MHz, 600MHz, 1.333GHz - 0°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
SOM-2532CNBC-S8A1 Advantech Corp

SOM-2532CNBC-S8A1

SBC 1.8GHZ 4 CORE 16GB/64GB RAM

Advantech Corp

1,222
Datasheet SMARC  Module Bulk Active MPU Intel® Celeron® J6413 32GB 8GB HDMI, LCD, LVDS, SATA CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB 1.8GHz - 0°C ~ 60°C - - -
M2S150T-1FC1152 Microchip Technology

M2S150T-1FC1152

IC SOC CORTEX-M3 166MHZ 1152BGA

Microchip Technology

2,979
Datasheet SmartFusion®2 1152-BBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ) - - 1152-FCBGA (35x35)
M2S150T-1FCG1152 Microchip Technology

M2S150T-1FCG1152

IC SOC CORTEX-M3 166MHZ 1152BGA

Microchip Technology

2,229
Datasheet SmartFusion®2 1152-BBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ) - - 1152-FCBGA (35x35)
M2S150T-FC1152I Microchip Technology

M2S150T-FC1152I

IC SOC CORTEX-M3 166MHZ 1152BGA

Microchip Technology

1,209
Datasheet SmartFusion®2 1152-BBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules -40°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
5CSXFC6C6U23I7LN Intel

5CSXFC6C6U23I7LN

IC SOC CORTEX-A9 925MHZ 672UBGA

Intel

2,358
Datasheet Cyclone® V SX 672-FBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 64KB DMA, POR, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 925MHz FPGA - 110K Logic Elements -40°C ~ 100°C (TJ) - - 672-UBGA (23x23)
M2S150T-1FCV484I Microchip Technology

M2S150T-1FCV484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

3,163
Datasheet SmartFusion®2 484-BFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules -40°C ~ 100°C (TJ) - - 484-FBGA (19x19)
M2S150T-1FCVG484I Microchip Technology

M2S150T-1FCVG484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

3,743
Datasheet SmartFusion®2 484-BFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules -40°C ~ 100°C (TJ) - - 484-FBGA (19x19)
XCZU2CG-2SFVC784I AMD

XCZU2CG-2SFVC784I

IC SOC CORTEX-A53 784FCBGA

AMD

4,228
Datasheet Zynq® UltraScale+™ MPSoC CG 784-BFBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 103K+ Logic Cells -40°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
M2S150T-1FCS536 Microchip Technology

M2S150T-1FCS536

IC SOC CORTEX-M3 166MHZ 536BGA

Microchip Technology

4,909
Datasheet SmartFusion®2 536-LFBGA, CSPBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ) - - 536-CSPBGA (16x16)
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FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

BOM & COMPONENT SOURCING

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