System On Chip (SoC)
Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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XCZU1CG-2UBVA494EIC ZUP MPSOC CG A53 FPGA 494BGA |
4,536 |
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Datasheet | Zynq® UltraScale+™ MPSoC CG | 494-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 494-FCBGA (14x14) |
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XCZU1CG-1SFVC784IIC ZUP MPSOC A53 FPGA 784BGA |
2,110 |
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Datasheet | Zynq® UltraScale+™ | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 500MHz, 1.2GHz | - | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
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5CSXFC5C6U23C6NIC SOC CORTEX-A9 925MHZ 672UBGA |
3,941 |
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Datasheet | Cyclone® V SX | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 85K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 672-UBGA (23x23) |
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SOM-2569BCBC-S1A1SBC 1.1GHZ 2 CORE 8GB/0GB RAM |
4,377 |
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Datasheet | - | Module | Bulk | Active | MPU | Celeron N3350 | 32GB | 8GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 1.1GHz | - | 0°C ~ 60°C | - | - | - |
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M2S150-FCV484IC SOC CORTEX-M3 166MHZ 484FBGA |
1,062 |
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Datasheet | SmartFusion®2 | 484-BFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FBGA (19x19) |
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M2S150-FCVG484IC SOC CORTEX-M3 166MHZ 484FBGA |
3,180 |
|
Datasheet | SmartFusion®2 | 484-BFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FBGA (19x19) |
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XCZU2EG-1SBVA484EIC SOC CORTEX-A53 484FCBGA |
3,714 |
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Datasheet | Zynq® UltraScale+™ MPSoC EG | 484-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
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XCZU1CG-2SBVA484EIC ZUP MPSOC A53 FPGA 484BGA |
4,031 |
|
Datasheet | Zynq® UltraScale+™ | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 533MHz, 1.333GHz | - | 0°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
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XCZU1CG-L1SBVA484IIC ZUP MPSOC LP A53 FPGA 484BGA |
4,014 |
|
Datasheet | Zynq® UltraScale+™ | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 500MHz, 1.2GHz | - | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
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M2S090T-1FGG676IIC SOC CORTEX-M3 166MHZ 676FBGA |
2,976 |
|
Datasheet | SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
|
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M2S090T-1FG676IIC SOC CORTEX-M3 166MHZ 676FBGA |
1,837 |
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Datasheet | SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090TS-1FG676IC SOC CORTEX-M3 166MHZ 676FBGA |
3,260 |
|
Datasheet | SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090TS-1FGG676IC SOC CORTEX-M3 166MHZ 676FBGA |
1,788 |
|
Datasheet | SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090TS-FG676IIC SOC CORTEX-M3 166MHZ 676FBGA |
2,162 |
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Datasheet | SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090TS-FGG676IIC SOC CORTEX-M3 166MHZ 676FBGA |
4,444 |
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Datasheet | SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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5CSEBA6U19I7LNIC SOC CORTEX-A9 925MHZ 484UBGA |
2,736 |
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Datasheet | Cyclone® V SE | 484-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 110K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 484-UBGA (19x19) |
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5CSEMA5F31A7NIC SOC CORTEX-A9 700MHZ 896FBGA |
3,350 |
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Datasheet | Cyclone® V SE | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 700MHz | FPGA - 85K Logic Elements | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 896-FBGA (31x31) |
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RC12-5520-2311-I2-VSBC 1.5GHZ 10 CORE 2GB/0GB RAM |
3,543 |
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Datasheet | - | Module | Box | Active | MPU | ARM® Cortex®-A53, ARM® Cortex®-M4 | - | 2GB | HDMI, LVDS | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 1.5GHz | - | -40°C ~ 85°C | - | - | - |
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XCZU2EG-1SFVA625EIC SOC CORTEX-A53 625FCBGA |
2,663 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 625-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
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XCZU1EG-1UBVA494IIC ZUP MPSOC EG A53 FPGA 494BGA |
1,686 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 494-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | - | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 494-FCBGA (14x14) |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.