System On Chip (SoC)

Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Package/Case	Packaging	Product Status	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Grade	Qualification	Supplier Device Package
M2S150-1FCG1152 IC SOC CORTEX-M3 166MHZ 1152BGA Microchip Technology	1,368	447.83	RFQ	Datasheet	SmartFusion®2	1152-BBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 150K Logic Modules	0°C ~ 85°C (TJ)	-	-	1152-FCBGA (35x35)
M2S150-FC1152I IC SOC CORTEX-M3 166MHZ 1152BGA Microchip Technology	3,168	447.83	RFQ	Datasheet	SmartFusion®2	1152-BBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 150K Logic Modules	-40°C ~ 100°C (TJ)	-	-	1152-FCBGA (35x35)
M2S150-FCG1152I IC SOC CORTEX-M3 166MHZ 1152BGA Microchip Technology	2,736	447.83	RFQ	Datasheet	SmartFusion®2	1152-BBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 150K Logic Modules	-40°C ~ 100°C (TJ)	-	-	1152-FCBGA (35x35)
XAZU1EG-L1SFVA625I ZUP MPSOC A53 FPGA Q LP 625BGA AMD	3,178	412.10	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC EG	625-BFBGA, FCBGA	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	500MHz, 600MHz, 1.2GHz	Zynq®UltraScale+™ FPGA, 82K Logic Cells	-40°C ~ 100°C (TJ)	-	-	625-FCBGA (21x21)
XCZU3CG-1SBVA484E IC SOC CORTEX-A53 484FCBGA AMD	2,682	391.14	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC CG	484-BFBGA, FCBGA	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	500MHz, 1.2GHz	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	0°C ~ 100°C (TJ)	-	-	484-FCBGA (19x19)
XCZU2EG-2UBVA530E IC ZUP MPSOC A53 FPGA 530BGA AMD	2,876	391.14	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC EG	530-WFBGA, FCBGA	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 600MHz, 1.333GHz	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	0°C ~ 100°C (TJ)	-	-	530-FCBGA (16x9.5)
XCZU2EG-L1UBVA530I IC ZUP MPSOC A53 FPGA LP 530BGA AMD	1,334	391.14	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC EG	530-WFBGA, FCBGA	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	500MHz, 600MHz, 1.2GHz	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	-40°C ~ 100°C (TJ)	-	-	530-FCBGA (16x9.5)
XCZU2EG-3SBVA484E IC SOC CORTEX-A53 484FCBGA AMD	1,044	0.00	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC EG	484-BFBGA, FCBGA	Tray	Obsolete	MCU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 667MHz, 1.5GHz	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	0°C ~ 100°C (TJ)	-	-	484-FCBGA (19x19)
M2S150-1FCS536 IC SOC CORTEX-M3 166MHZ 536BGA Microchip Technology	4,219	452.27	RFQ	Datasheet	SmartFusion®2	536-LFBGA, CSPBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 150K Logic Modules	0°C ~ 85°C (TJ)	-	-	536-CSPBGA (16x16)
M2S150-1FCSG536 IC SOC CORTEX-M3 166MHZ 536BGA Microchip Technology	4,964	452.27	RFQ	Datasheet	SmartFusion®2	536-LFBGA, CSPBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 150K Logic Modules	0°C ~ 85°C (TJ)	-	-	536-CSPBGA (16x16)
M2S150-FCS536I IC SOC CORTEX-M3 166MHZ 536BGA Microchip Technology	3,164	452.27	RFQ	Datasheet	SmartFusion®2	536-LFBGA, CSPBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 150K Logic Modules	-40°C ~ 100°C (TJ)	-	-	536-CSPBGA (16x16)
M2S150-FCSG536I IC SOC CORTEX-M3 166MHZ 536BGA Microchip Technology	3,928	452.27	RFQ	Datasheet	SmartFusion®2	536-LFBGA, CSPBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 150K Logic Modules	-40°C ~ 100°C (TJ)	-	-	536-CSPBGA (16x16)
XC7Z030-1SB485I IC SOC CORTEX-A9 667MHZ 485FCBGA AMD	1,150	392.37	RFQ	Datasheet	Zynq®-7000	484-FBGA, FCBGA	Bulk	Active	MCU, FPGA	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	667MHz	Kintex™-7 FPGA, 125K Logic Cells	-40°C ~ 100°C (TJ)	-	-	484-FCBGA (19x19)
XCZU1EG-2SFVC784E IC ZUP MPSOC A53 FPGA 784BGA AMD	4,964	392.37	RFQ	Datasheet	Zynq® UltraScale+™	784-BFBGA, FCBGA	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	-	533MHz, 600MHz, 1.333GHz	-	0°C ~ 100°C (TJ)	-	-	784-FCBGA (23x23)
XCZU1EG-L1SFVC784I IC ZUP MPSOC LP A53 FPGA 784BGA AMD	4,372	392.37	RFQ	Datasheet	Zynq® UltraScale+™	784-BFBGA, FCBGA	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	-	500MHz, 600MHz, 1.2GHz	-	-40°C ~ 100°C (TJ)	-	-	784-FCBGA (23x23)
M2S100T-FC1152 IC SOC CORTEX-M3 166MHZ 1152BGA Microsemi Corporation	1,969	0.00	RFQ	Datasheet	SmartFusion®2	1152-BBGA, FCBGA	Tray	Obsolete	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 100K Logic Modules	0°C ~ 85°C (TJ)	-	-	1152-FCBGA (35x35)
M2S100T-FCG1152 IC SOC CORTEX-M3 166MHZ 1152BGA Microsemi Corporation	3,727	0.00	RFQ	Datasheet	SmartFusion®2	1152-BBGA, FCBGA	Tray	Obsolete	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 100K Logic Modules	0°C ~ 85°C (TJ)	-	-	1152-FCBGA (35x35)
XC7Z030-3FBG484E IC SOC CORTEX-A9 1GHZ 484FCBGA AMD	3,730	394.83	RFQ	Datasheet	Zynq®-7000	484-BBGA, FCBGA	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1GHz	Kintex™-7 FPGA, 125K Logic Cells	0°C ~ 100°C (TJ)	-	-	484-FCBGA (23x23)
XC7Z030-L2FBG484I IC SOC CORTEX-A9 800MHZ 484FCBGA AMD	2,471	394.83	RFQ	Datasheet	Zynq®-7000	484-BBGA, FCBGA	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	Kintex™-7 FPGA, 125K Logic Cells	-40°C ~ 100°C (TJ)	-	-	484-FCBGA (23x23)
M2S150-1FCV484I IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	4,165	454.70	RFQ	Datasheet	SmartFusion®2	484-BFBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 150K Logic Modules	-40°C ~ 100°C (TJ)	-	-	484-FBGA (19x19)

FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.