System On Chip (SoC)
Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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M2S050T-1FG484MIC SOC CORTEX-M3 166MHZ 484FBGA |
3,443 |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 50K Logic Modules | -55°C ~ 125°C (TJ) | - | - | 484-FPBGA (23x23) |
|
M2S050T-1FGG484MIC SOC CORTEX-M3 166MHZ 484FBGA |
3,159 |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 50K Logic Modules | -55°C ~ 125°C (TJ) | - | - | 484-FPBGA (23x23) |
|
5CSEMA6U23C6NIC SOC CORTEX-A9 925MHZ 672UBGA |
4,465 |
|
Datasheet | Cyclone® V SE | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 672-UBGA (23x23) |
|
5CSXFC5C6U23I7LNIC SOC CORTEX-A9 925MHZ 672UBGA |
3,850 |
|
Datasheet | Cyclone® V SX | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 85K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 672-UBGA (23x23) |
|
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XCZU1CG-2SFVA625EIC ZUP MPSOC A53 FPGA 625BGA |
4,855 |
|
Datasheet | Zynq® UltraScale+™ | 625-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 533MHz, 1.333GHz | - | 0°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
|
|
XCZU1CG-L1SFVA625IIC ZUP MPSOC LP A53 FPGA 625BGA |
3,724 |
|
Datasheet | Zynq® UltraScale+™ | 625-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 500MHz, 1.2GHz | - | -40°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
|
XCZU2EG-1SFVC784EIC SOC CORTEX-A53 784FCBGA |
3,055 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
M2S150-FC1152IC SOC CORTEX-M3 166MHZ 1152BGA |
3,105 |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
M2S150-FCG1152IC SOC CORTEX-M3 166MHZ 1152BGA |
1,360 |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
SOM-2569BNBC-S6A1SBC 1.6GHZ 4 CORE 8GB/0GB RAM |
4,485 |
|
Datasheet | - | Module | Bulk | Active | MPU | Intel® Atom® X5-E3940 | 32GB | 8GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 1.6GHz | - | 0°C ~ 60°C | - | - | - |
|
|
XCZU2CG-1SFVA625IIC SOC CORTEX-A53 625FCBGA |
1,345 |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 625-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
|
5CSXFC6C6U23C7NIC SOC CORTEX-A9 800MHZ 672UBGA |
4,269 |
|
Datasheet | Cyclone® V SX | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 672-UBGA (23x23) |
|
XCZU1EG-1SBVA484IIC ZUP MPSOC A53 FPGA 484BGA |
4,312 |
|
Datasheet | Zynq® UltraScale+™ | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | - | 500MHz, 600MHz, 1.2GHz | - | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
|
M2S060T-1FG484MIC SOC CORTEX-M3 166MHZ 484FBGA |
3,753 |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | -55°C ~ 125°C (TJ) | - | - | 484-FPBGA (23x23) |
|
M2S060T-1FGG484MIC SOC CORTEX-M3 166MHZ 484FBGA |
4,831 |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | -55°C ~ 125°C (TJ) | - | - | 484-FPBGA (23x23) |
|
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XCZU2CG-L1UBVA530IIC ZUP MPSOC A53 FPGA LP 530BGA |
3,895 |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
|
XCZU1CG-L1SFVC784IIC ZUP MPSOC LP A53 FPGA 784BGA |
3,983 |
|
Datasheet | Zynq® UltraScale+™ | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 500MHz, 1.2GHz | - | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
XCZU1CG-2SFVC784EIC ZUP MPSOC A53 FPGA 784BGA |
3,231 |
|
Datasheet | Zynq® UltraScale+™ | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 533MHz, 1.333GHz | - | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
XC7Z030-2FBG484EIC SOC CORTEX-A9 800MHZ 484FCBGA |
3,205 |
|
Datasheet | Zynq®-7000 | 484-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 125K Logic Cells | 0°C ~ 100°C (TJ) | - | - | 484-FCBGA (23x23) |
|
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XCZU1CG-L2UBVA494EIC ZUP MPSOC CG A53 FPGA 494BGA |
1,333 |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 494-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 494-FCBGA (14x14) |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.