System On Chip (SoC)
Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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M2S090T-1FGG676IC SOC CORTEX-M3 166MHZ 676FBGA |
3,813 |
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Datasheet | SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090T-FG676IIC SOC CORTEX-M3 166MHZ 676FBGA |
2,242 |
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Datasheet | SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090T-FGG676IIC SOC CORTEX-M3 166MHZ 676FBGA |
2,773 |
|
Datasheet | SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090TS-FG676IC SOC CORTEX-M3 166MHZ 676FBGA |
2,140 |
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Datasheet | SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090TS-FGG676IC SOC CORTEX-M3 166MHZ 676FBGA |
1,378 |
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Datasheet | SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
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5CSXFC5D6F31C7NIC SOC CORTEX-A9 800MHZ 896FBGA |
3,474 |
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Datasheet | Cyclone® V SX | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 85K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 896-FBGA (31x31) |
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M2S090T-1FG484IIC SOC CORTEX-M3 166MHZ 484FBGA |
4,236 |
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Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 484-FPBGA (23x23) |
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M2S090T-1FGG484IIC SOC CORTEX-M3 166MHZ 484FBGA |
1,757 |
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Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 484-FPBGA (23x23) |
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M2S090TS-1FG484IC SOC CORTEX-M3 166MHZ 484FBGA |
3,080 |
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Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FPBGA (23x23) |
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M2S090TS-1FGG484IC SOC CORTEX-M3 166MHZ 484FBGA |
1,129 |
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Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FPBGA (23x23) |
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M2S090TS-FG484IIC SOC CORTEX-M3 166MHZ 484FBGA |
3,406 |
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Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 484-FPBGA (23x23) |
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M2S090TS-FGG484IIC SOC CORTEX-M3 166MHZ 484FBGA |
4,641 |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 484-FPBGA (23x23) |
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SOM-2569BN0C-S3A1SBC 1.3GHZ 2 CORE 8GB/0GB RAM |
3,987 |
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Datasheet | - | Module | Bulk | Active | MPU | Intel® Atom® x5-E3930 | - | 8GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 1.3GHz | - | 0°C ~ 60°C | - | - | - |
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XCZU2EG-1UBVA530EIC ZUP MPSOC A53 FPGA 530BGA |
1,015 |
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Datasheet | Zynq® UltraScale+™ MPSoC EG | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
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XCZU1EG-1SFVC784EIC ZUP MPSOC A53 FPGA 784BGA |
4,115 |
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Datasheet | Zynq® UltraScale+™ | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | - | 500MHz, 600MHz, 1.2GHz | - | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
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5CSEBA6U19C6NIC SOC CORTEX-A9 925MHZ 484UBGA |
4,530 |
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Datasheet | Cyclone® V SE | 484-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 484-UBGA (19x19) |
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5CSEBA6U23I7SNIC SOC CORTEX-A9 800MHZ 672UBGA |
1,307 |
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Datasheet | Cyclone® V SE | 672-FBGA | Tray | Active | MCU, FPGA | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 110K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 672-UBGA (23x23) |
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M2S090-1FG676IIC SOC CORTEX-M3 166MHZ 676FBGA |
3,945 |
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Datasheet | SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090-1FGG676IIC SOC CORTEX-M3 166MHZ 676FBGA |
2,805 |
|
Datasheet | SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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XCZU1CG-L1UBVA494IIC ZUP MPSOC CG A53 FPGA 494BGA |
1,190 |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 494-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 494-FCBGA (14x14) |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.