System On Chip (SoC)
Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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M2S150-1FCSG536IIC SOC CORTEX-M3 166MHZ 536BGA |
3,755 |
|
Datasheet | SmartFusion®2 | 536-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 536-CSPBGA (16x16) |
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XAZU2EG-L1SFVA625IIC SOC CORTEX-A53 625FCBGA |
3,004 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 625-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 1.2MB | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
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M2S100T-1FC1152IC SOC CORTEX-M3 166MHZ 1152BGA |
2,755 |
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Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 100K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 1152-FCBGA (35x35) |
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M2S100T-1FCG1152IC SOC CORTEX-M3 166MHZ 1152BGA |
3,763 |
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Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Obsolete | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 100K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 1152-FCBGA (35x35) |
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XCZU2EG-2SFVC784EIC SOC CORTEX-A53 784FCBGA |
1,551 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
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XCZU2EG-L1SFVC784IIC SOC CORTEX-A53 784FCBGA |
3,465 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
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XCZU2EG-L2UBVA530EIC ZUP MPSOC A53 FPGA LP 530BGA |
3,672 |
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Datasheet | Zynq® UltraScale+™ MPSoC EG | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
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M2S150TS-FCS536IC SOC CORTEX-M3 166MHZ 536BGA |
2,968 |
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Datasheet | SmartFusion®2 | 536-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 536-CSPBGA (16x16) |
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M2S150TS-FCSG536IC SOC CORTEX-M3 166MHZ 536BGA |
2,821 |
|
Datasheet | SmartFusion®2 | 536-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 536-CSPBGA (16x16) |
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XCZU1EG-L2SFVC784EIC ZUP MPSOC LP A53 FPGA 784BGA |
4,205 |
|
Datasheet | Zynq® UltraScale+™ | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | - | 533MHz, 600MHz, 1.333GHz | - | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
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XC7Z030-3FBG676EIC SOC CORTEX-A9 1GHZ 676FCBGA |
3,562 |
|
Datasheet | Zynq®-7000 | 676-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1GHz | Kintex™-7 FPGA, 125K Logic Cells | 0°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
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XC7Z030-L2FBG676IIC SOC CORTEX-A9 800MHZ 676FCBGA |
4,195 |
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Datasheet | Zynq®-7000 | 676-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
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XAZU2EG-L1SFVC784IIC SOC CORTEX-A53 784FCBGA |
1,291 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 1.2MB | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
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5CSXFC6C6U23A7NIC SOC CORTEX-A9 700MHZ 672UBGA |
4,869 |
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Datasheet | Cyclone® V SE | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 700MHz | FPGA - 110K Logic Elements | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 672-UBGA (23x23) |
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SOM-2569CNCCA-S2A1SBC 1.1GHZ 4 CORE 8GB/0GB RAM |
3,471 |
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Datasheet | - | Module | Bulk | Active | MPU | Intel® Pentium® N4200 | 64GB | 8GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 1.1GHz | - | 0°C ~ 60°C | - | - | - |
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XCZU3EG-1SBVA484EIC SOC CORTEX-A53 484FCBGA |
1,748 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 484-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
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5CSXFC6D6F31I7IC SOC CORTEX-A9 800MHZ 896FBGA |
1,331 |
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Datasheet | Cyclone® V SX | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 110K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 896-FBGA (31x31) |
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SOM-2532CNBC-U0A1SBC 2.0GHZ 4 CORE 16GB/64GB RAM |
4,409 |
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Datasheet | - | Module | Bulk | Active | MPU | Intel® Pentium® J6426 | 32GB | 8GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | 2GHz | - | 0°C ~ 60°C | - | - | - |
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SOM-2532BCBX-S0A1SBC 1.0GHZ 2 CORE 16GB/64GB RAM |
1,054 |
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Datasheet | - | Module | Bulk | Active | MPU | Intel® Atom® x6200FE | 32GB | 4GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | 3GHz | - | -40°C ~ 85°C | - | - | - |
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BCM53570B0KFSBG24X10G L2 SWITCH |
3,044 |
|
Datasheet | - | - | Tray | Active | MPU | ARM® Cortex®-A9, ARM® Cortex®-R5 | - | - | SERDES | ACL, MAC, QSGMII | 1.25GHz | - | - | - | - | - |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.