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Microcontrollers, Microprocessor, FPGA Modules

Explore Microcontrollers, Microprocessor, FPGA Modules parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0818-01-9GI21-AK Trenz Electronic GmbH

TE0818-01-9GI21-AK

ULTRASOM+ MPSOC-MODUL WITH ZYNQ

Trenz Electronic GmbH

4,082
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU9EG-2FFVC900I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0818-02-9GI81-AK Trenz Electronic GmbH

TE0818-02-9GI81-AK

ULTRASOM+ MPSOC-MODULE WITH AMD

Trenz Electronic GmbH

1,242
Datasheet - Bulk Active FPGA Zynq UltraScale+ XCZU9EG-2FFVC900I - - 128MB 4GB Board-to-Board (BTB) 4 x 240 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0745-03-92I31-AK Trenz Electronic GmbH

TE0745-03-92I31-AK

SOM WITH AMD ZYNQ 7045-2I AND HE

Trenz Electronic GmbH

4,967
Datasheet Zynq Bulk Active MPU Core ARM Cortex-A9 Xilinx Zynq 7045 SoC XC7Z045-2FBG676I - 64MB 1GB Samtec ST5 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0808-05-9GI21-AK Trenz Electronic GmbH

TE0808-05-9GI21-AK

ULTRASOM+ MPSOC-MODULE WITH ZYNQ

Trenz Electronic GmbH

4,108
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU9EG-2FFVC900I - - 128MB 4GB 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0808-05-9GI81-AK Trenz Electronic GmbH

TE0808-05-9GI81-AK

ULTRASOM+ MPSOC-MODULE WITH ZYNQ

Trenz Electronic GmbH

4,640
Datasheet - Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-BBE21-AK Trenz Electronic GmbH

TE0808-05-BBE21-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,878
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU15EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-BBE81-AK Trenz Electronic GmbH

TE0808-05-BBE81-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

2,470
Datasheet - Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-9GI21-EK Trenz Electronic GmbH

TE0808-05-9GI21-EK

ULTRASOM+ MPSOC-MODULE WITH AMD

Trenz Electronic GmbH

1,715
Datasheet - Bulk Obsolete - - - - - - - - -
EC-VA-H265-10B-60-1080-MD00C-SX660 System-On-Chip (SOC) Technologies Inc.

EC-VA-H265-10B-60-1080-MD00C-SX660

MOD H265 ENC 60FPS 1080 SODIMM

System-On-Chip (SOC) Technologies Inc.

4,167
Datasheet H.265-HD Encoder Box Active FPGA Core Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 1.5GHz 128KB 512MB - - -
EC-VA-H264-10B-60-4K-MD00C-SX660 System-On-Chip (SOC) Technologies Inc.

EC-VA-H264-10B-60-4K-MD00C-SX660

MOD H264 EN 60FPS 4K SX660 SODIM

System-On-Chip (SOC) Technologies Inc.

2,691
Datasheet H.264-HD Encoder Box Active FPGA Core Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 1.5GHz 128KB 512MB - - -
DC-VA-H264-10B-60-4K-MD00C-SX660 System-On-Chip (SOC) Technologies Inc.

DC-VA-H264-10B-60-4K-MD00C-SX660

MOD H264 DE 60FPS 4K SX660 SODIM

System-On-Chip (SOC) Technologies Inc.

3,952
Datasheet H.264-HD Encoder Box Active FPGA Core Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 1.5GHz 128KB 512MB - - -
TE0841-02-41I21-L Trenz Electronic GmbH

TE0841-02-41I21-L

IC MODULE

Trenz Electronic GmbH

2,688
Datasheet TE0841 Bulk Discontinued at Digi-Key FPGA Core Kintex UltraScale KU040 - - 64MB 2GB B2B 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0808-04-BBE21-A Trenz Electronic GmbH

TE0808-04-BBE21-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

4,584
Datasheet TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU15EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0808-04-BBE21-AK Trenz Electronic GmbH

TE0808-04-BBE21-AK

IC MOD SOM MPSOC 4GB ZU15G

Trenz Electronic GmbH

1,858
Datasheet TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU15EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0841-02-41C21-A Trenz Electronic GmbH

TE0841-02-41C21-A

IC MODULE USCALE 2GB

Trenz Electronic GmbH

2,536
Datasheet TE0841 Bulk Discontinued at Digi-Key MCU, FPGA Kintex UltraScale KU40 - - 64MB 2GB B2B 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 70°C
TE0808-05-9GI21-A Trenz Electronic GmbH

TE0808-05-9GI21-A

USOM+ MPSOC ZYNQ USCALE FPGA

Trenz Electronic GmbH

2,110
Datasheet TE0808 Box Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU9EG-2FFVC900I - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
2DC-VA-H264-10B-30-4K-MD00C-SX660 System-On-Chip (SOC) Technologies Inc.

2DC-VA-H264-10B-30-4K-MD00C-SX660

MOD H264 DE 30FPS 4K SX660 SODIM

System-On-Chip (SOC) Technologies Inc.

1,939
Datasheet H.264-HD Encoder Box Active FPGA Core Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 1.5GHz 128KB 512MB - - -
2EC-VA-H264-10B-30-4K-MD00C-SX660 System-On-Chip (SOC) Technologies Inc.

2EC-VA-H264-10B-30-4K-MD00C-SX660

MOD H264 EN 30FPS 4K SX660 SODIM

System-On-Chip (SOC) Technologies Inc.

2,368
Datasheet H.264-HD Encoder Box Active FPGA Core Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 1.5GHz 128KB 512MB - - -
EC-VA-H265-10B-60-4K-MD00C-SX660 System-On-Chip (SOC) Technologies Inc.

EC-VA-H265-10B-60-4K-MD00C-SX660

MOD H265 EN 60FPS 4K SX660 SODIM

System-On-Chip (SOC) Technologies Inc.

1,024
Datasheet H.265-HD Encoder Box Active FPGA Core Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 1.5GHz 128KB 512MB - - -
TE0807-03-7DE21-AZ Trenz Electronic GmbH

TE0807-03-7DE21-AZ

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

1,017
Datasheet Zynq UltraScale+ Bulk Obsolete MPU Core Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
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FAQ

Frequently Asked Questions

What are Microcontrollers, Microprocessor, FPGA Modules components used for?

Microcontrollers, Microprocessor, FPGA Modules components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Microcontrollers, Microprocessor, FPGA Modules part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Microcontrollers, Microprocessor, FPGA Modules parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

BOM & COMPONENT SOURCING

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