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Microcontrollers, Microprocessor, FPGA Modules

Explore Microcontrollers, Microprocessor, FPGA Modules parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0783-02-92I33MA Trenz Electronic GmbH

TE0783-02-92I33MA

HIGH-PERFORMANCE SOM WITH XILINX

Trenz Electronic GmbH

3,537
Datasheet TE0782 Bulk Active MPU Core Zynq™ 7000 XC7Z045-2FFG900I ARM Cortex-A9 - 32MB 1GB Board-to-Board (BTB) Socket 3.350" L x 3.350" W (85.00mm x 85.00mm) -40°C ~ 85°C
TE0782-02-92I33MA Trenz Electronic GmbH

TE0782-02-92I33MA

IC MODULE CORTEX

Trenz Electronic GmbH

3,900
Datasheet TE0782 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 32MB 1GB Board-to-Board (BTB) Socket 3.350" L x 3.350" W (85.00mm x 85.00mm) -40°C ~ 85°C
TE0807-03-7AI21-A Trenz Electronic GmbH

TE0807-03-7AI21-A

MPSOC ZYNQ USCALE 4GB DDR4

Trenz Electronic GmbH

3,887
Datasheet TE0807 Box Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU7CG-1FBVB900I - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0817-01-7DI21-A Trenz Electronic GmbH

TE0817-01-7DI21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,736
Datasheet Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq UltraScale+ XCZU7EV-1FBVB900I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0807-03-7DI21-AZ Trenz Electronic GmbH

TE0807-03-7DI21-AZ

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

1,021
Datasheet Zynq UltraScale+ Bulk Obsolete MPU Core Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900I - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 160 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
DC-VA-H264-10B-60-4K-OPVIC-0000 System-On-Chip (SOC) Technologies Inc.

DC-VA-H264-10B-60-4K-OPVIC-0000

DECODER H264 4K VID/AUD 10BIT

System-On-Chip (SOC) Technologies Inc.

3,898
Datasheet * Box Active - - - - - - - - -
EC-VA-H265-10B-60-1080-OPVIC-0000 System-On-Chip (SOC) Technologies Inc.

EC-VA-H265-10B-60-1080-OPVIC-0000

ENCODER H265 HD VID/AUD 10BIT

System-On-Chip (SOC) Technologies Inc.

3,428
Datasheet - Box Active - - - - - - - - -
EC-VA-H264-10B-60-4K-OPVIC-0000 System-On-Chip (SOC) Technologies Inc.

EC-VA-H264-10B-60-4K-OPVIC-0000

ENCODER H264 4K VID/AUD 10BIT

System-On-Chip (SOC) Technologies Inc.

4,446
Datasheet - Box Active - - - - - - - - -
A5EB-B9-C7F-RC-SBC Critical Link LLC

A5EB-B9-C7F-RC-SBC

AGILEX 5E SINGLE BOARD COMPUTER,

Critical Link LLC

2,945
Datasheet - Bulk Active MPU Core ARM® Cortex®-A55, ARM® Cortex®-A76 - 1.8GHz 64GB eMMC, 32MB QSPI 8GB RJ45 8.500" L x 6.000" W (215.90mm x 152.40mm) 0°C ~ 70°C
A5EB-B9-C7F-RC-SBC-X Critical Link LLC

A5EB-B9-C7F-RC-SBC-X

AGILEX 5E SINGLE BOARD COMPUTER

Critical Link LLC

4,387
Datasheet - Bulk Active MPU Core ARM® Cortex®-A55, ARM® Cortex®-A76 - 1.8GHz 64GB eMMC, 32MB QSPI 8GB RJ45 8.500" L x 6.000" W (215.90mm x 152.40mm) 0°C ~ 70°C
EC-VA-H265-10B-60-4K-OPVIC-0000 System-On-Chip (SOC) Technologies Inc.

EC-VA-H265-10B-60-4K-OPVIC-0000

ENCODER H265 4K VID/AUD 10BIT

System-On-Chip (SOC) Technologies Inc.

4,102
Datasheet * Box Active - - - - - - - - -
TEC0850-03-BBEX1-A Trenz Electronic GmbH

TEC0850-03-BBEX1-A

IC MODULE

Trenz Electronic GmbH

2,351
Datasheet * Bulk Active - - - - - - - - -
TE0865-02-ABI21MA Trenz Electronic GmbH

TE0865-02-ABI21MA

MPSOC MODULE WITH ZYNQ ULTRASCAL

Trenz Electronic GmbH

2,447
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I - - 256MB 4GB Board-to-Board (BTB) Socket 3.937" L x 2.953" W (100.00mm x 75.00mm) 0°C ~ 85°C
CC-9C-V223-RJ-25 Digi

CC-9C-V223-RJ-25

IC MODULE ARM926EJ-S 155MHZ

Digi

4,185
Datasheet ConnectCore® Bulk Obsolete MPU Core ARM926EJ-S, NS9360 - 155MHz - - SO-DIMM-144 2.060" L x 3.590" W (52.20mm x 91.20mm) -40°C ~ 85°C
TE0865-02-FBE23MA Trenz Electronic GmbH

TE0865-02-FBE23MA

MPSOC MODULE WITH ZYNQ ULTRASCAL

Trenz Electronic GmbH

4,582
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E - - 256MB 4GB Board-to-Board (BTB) Socket 3.937" L x 2.953" W (100.00mm x 75.00mm) 0°C ~ 85°C
ME-XU7-15EG-2I-D12E-R5.0 Enclustra FPGA Solutions

ME-XU7-15EG-2I-D12E-R5.0

SOM ZYNQ XU7 US+ ZU15EG

Enclustra FPGA Solutions

1,355
Datasheet Mercury+ XU7 Bulk Active MPU Core ARM® Cortex®-A53, ARM® Cortex®-R5 Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I - 16GB 2GB 168 Pin 2.910" L x 2.130" W (74.00mm x 54.00mm) -40°C ~ 85°C
TE0865-02-DGE23MA Trenz Electronic GmbH

TE0865-02-DGE23MA

MPSOC MODULE WITH ZYNQ ULTRASCAL

Trenz Electronic GmbH

4,028
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E - - 256MB 4GB Board-to-Board (BTB) Socket 3.937" L x 2.953" W (100.00mm x 75.00mm) 0°C ~ 85°C
TE0835-02-MXE21-A Trenz Electronic GmbH

TE0835-02-MXE21-A

RFSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

3,079
Datasheet Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E ARM® Cortex®-A53, ARM® Cortex®-R5 1.3GHz 128MB 4GB Board-to-Board (BTB) Socket 3.543" L x 2.559" W (90.00mm x 65.00mm) 0°C ~ 85°C
IW-G35M-19EG-4E004G-E008G-BEF iWave Global

IW-G35M-19EG-4E004G-E008G-BEF

ZU19EG (-3 SPEED) MPSOC SOM

iWave Global

2,727
Datasheet - Bulk Active - - - - - - - - -
TE0835-02-TXE21-A Trenz Electronic GmbH

TE0835-02-TXE21-A

RFSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,310
Datasheet Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E ARM® Cortex®-A53 1.3GHz 512MB 4GB Board-to-Board (BTB) Socket 3.543" L x 2.559" W (90.00mm x 65.00mm) 0°C ~ 85°C
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FAQ

Frequently Asked Questions

What are Microcontrollers, Microprocessor, FPGA Modules components used for?

Microcontrollers, Microprocessor, FPGA Modules components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Microcontrollers, Microprocessor, FPGA Modules part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Microcontrollers, Microprocessor, FPGA Modules parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

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