Microcontrollers, Microprocessor, FPGA Modules
Explore Microcontrollers, Microprocessor, FPGA Modules parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Module/Board Type | Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
FORLINX-FETMX8MM-C+182GSE8GCA10NXP i.MX8M MiniSOM,2G DDR4,8GB e |
1,596 |
|
Datasheet | - | Tape & Box (TB) | Active | MPU | ARM Cortex-A53, ARM® Cortex®-M4F | - | 1.8GHz | 8GB eMMC | 2GB | Board-to-Board (BTB) Socket - 240 | 2.200" L x 1.417" W (56.00mm x 36.00mm) | 0°C ~ 70°C |
|
FORLINX-FET7110-C+154GSE32GCF11StarFive JH7110, SOM, 4GB LPDDR4 |
4,870 |
|
Datasheet | StarFive JH7110 | Tape & Box (TB) | Active | MPU | JH7110 Quad +RISC-V | - | 1.5GHz | 32GB eMMC | 4GB | Board-to-Board (BTB) 3 x 80 Pin | 2.360" L x 1.496" W (60.00mm x 38.00mm) | 0°C ~ 80°C |
|
FORLINX-FET-G2LD-C+122GOE16M16GIB11Renesas RZ/G2L (R9A07G044Lxx)SOM |
2,565 |
|
Datasheet | - | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55, ARM® Cortex®-M33 | - | 1.2GHz | 16GB eMMC,16MB (NOR) | 2GB | Board-to-Board (BTB) Socket - 240 | 1.496" L x 2.360" W (38.00mm x 60.00mm) | -40°C ~ 85°C |
|
FORLINX-FET527N-C+182GSE16GIA11Allwinner T527N, SOM, 2GB LPDDR4 |
1,216 |
|
Datasheet | Allwinner T527N | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55 8-Core | - | 1.8GHz | 16GB eMMC | 2GB | Board-to-Board (BTB) Socket - 4 x 80 | 2.756" L x 1.811" W (70.00mm x 46.00mm) | -40°C ~ 85°C |
|
FORLINX-FET3568J-C+182GSE16GIB10Rockchip RK3568SOM, 2GB DDR4, 16 |
1,382 |
|
Datasheet | - | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55 | - | 1.8GHz | 16GB eMMC | 2GB | Board-to-Board (BTB) 4 x 80 Pin | 1.770" L x 2.756" W (45.00mm x 70.00mm) | -40°C ~ 85°C |
|
FORLINX-FET3576-C+232GSE32GCA11Rockchip 35676, SOM, 2GB LPDDDR4 |
2,266 |
|
Datasheet | RK3576 | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A53 Quad, ARM® Cortex®-A72 | - | 2.3GHz | 32GB eMMC | 2GB | Board-to-Board (BTB) Socket - 4 x 100 | 2.677" L x 1.969" W (68.00mm x 50.00mm) | 0°C ~ 80°C |
|
|
FORLINX-FET3576-C+234GSE32GCA11Rockchip 35676, SOM, 4GB LPDDDR4 |
2,182 |
|
Datasheet | RK3576 | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A53 Quad, ARM® Cortex®-A72 | - | 2.3GHz | 32GB eMMC | 4GB | Board-to-Board (BTB) Socket - 4 x 100 | 2.677" L x 1.969" W (68.00mm x 50.00mm) | 0°C ~ 80°C |
|
FORLINX-FET-D9360-C+204GSE32GIB11SemiDrive D9 Pro, SOM, 4GB LPDDR |
3,113 |
|
Datasheet | SemiDrive D9 Pro | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55 6-Core | - | 2.0GHz | 32GB eMMC | 4GB | Board-to-Board (BTB) 4 x 100 Pin | 2.559" L x 1.732" W (65.00mm x 44.00mm) | -40°C ~ 85°C |
|
|
FORLINX-FET527N-C+184GSE32GIB11Allwinner T527N, SOM, 4GB LPDDR4 |
4,020 |
|
Datasheet | Allwinner T527N | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55 8-Core | - | 1.8GHz | 32GB eMMC | 4GB | Board-to-Board (BTB) Socket - 4 x 80 | 2.756" L x 1.811" W (70.00mm x 46.00mm) | -40°C ~ 85°C |
|
FORLINX-FETMX8MPQ-C+164GOE16(16G)IA10NXP i.MX8M PlusSOM,4G LPDDR4, 16 |
1,761 |
|
Datasheet | - | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A53, ARM® Cortex®-M7 | - | 1.6GHz | 16GB eMMC, 16MB (NOR) | 4GB | Board-to-Board (BTB) 4 x 80 Pin | 2.441" L x 0.118" W (62.00mm x 32.00mm) | -40°C ~ 85°C |
|
FORLINX-FET1028A-C+152GOE16M8GIA12NXP LS1028ASOM,2GB DDR4,8GB eMMC |
3,748 |
|
Datasheet | - | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A72 | - | 1.5GHz | 8GB eMMC, 16Mb QSPI | 2GB | Board-to-Board (BTB) Socket - 160 | 1.653" L x 2.559" W (42.00mm x 65.00mm) | -40°C ~ 85°C |
|
FORLINX-OK7110-C+152GSE32GCE11C11ARM DEVELOPMENT BOARD,StarFive |
4,455 |
|
Datasheet | StarFive JH7110 | Tape & Box (TB) | Active | MPU | JH7110 Quad +RISC-V | - | 1.5GHz | 32GB eMMC | 2GB | Board-to-Board (BTB) 3 x 80 Pin | 7.480" L x 5.118" W (190.00mm x 130.00mm) | 0°C ~ 80°C |
|
FORLINX-FET3588-C+244GSE32GCC11Rockchip RK3588 SOM,4GBLPDDR4x,3 |
2,032 |
|
Datasheet | RK3588 | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55, ARM® Cortex®-A76 | - | 2.4GHz | 32GB eMMC | 4GB | 4 x 100 Pin | 1.970" L x 2.677" W (50.00mm x 68.00mm) | 0°C ~ 70°C |
|
|
FORLINX-FET3588-C+248GSE64GCD11Rockchip RK3588 SOM,8GBLPDDR4x,6 |
3,797 |
|
Datasheet | RK3588 | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55, ARM® Cortex®-A76 | - | 2.4GHz | 64GB eMMC | 8GB | 4 x 100 Pin | 1.970" L x 2.677" W (50.00mm x 68.00mm) | 0°C ~ 70°C |
|
FORLINX-FET3588J-C+224GSE32GIA11Rockchip RK3588J SOM,4GBLPDDR4x, |
3,887 |
|
Datasheet | - | Tape & Box (TB) | Active | - | - | - | - | - | - | - | - | - |
|
FORLINX-FET1046A-C+182GQE01IA13NXP LS1046ASOM,2GB DDR4,8GB eMMC |
3,046 |
|
Datasheet | - | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A72 | - | 1.8GHz | 8GB eMMC, 16Mb QSPI | 2GB | Board-to-Board (BTB) 2 x 110 Pin | 3.307" L x 2.165" W (84.00mm x 55.00mm) | -40°C ~ 75°C |
|
B13500-DIM-001-0001Highly compact DIMMBoard with ex |
2,563 |
|
Datasheet | DIMM-PC® | Retail Package | Active | MPU Core | Vortex86DX | - | 1GHz | - | 256MB | USB | 3.386" L x 1.575" W (86.00mm x 40.00mm) | 0°C ~ 60°C |
Frequently Asked Questions
What are Microcontrollers, Microprocessor, FPGA Modules components used for?
Microcontrollers, Microprocessor, FPGA Modules components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Microcontrollers, Microprocessor, FPGA Modules part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find Microcontrollers, Microprocessor, FPGA Modules parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
