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Microcontrollers, Microprocessor, FPGA Modules

Explore Microcontrollers, Microprocessor, FPGA Modules parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0745-02-91C31-A Trenz Electronic GmbH

TE0745-02-91C31-A

MOD SOM DDR3L 1GB

Trenz Electronic GmbH

1,730
Datasheet TE0745 Bulk Obsolete MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0817-01-4BE21-A Trenz Electronic GmbH

TE0817-01-4BE21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

4,324
Datasheet Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
IW-G30M-C4CG-4E002G-E008G-BIA iWave Global

IW-G30M-C4CG-4E002G-E008G-BIA

ZU4CG (-1 Speed) MPSoC SOM

iWave Global

1,676
Datasheet Zynq® UltraScale+™ Bulk Active MPU, FPG ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) ARM® Mali 400 MP2 1.5GHz, 600MHz 8GB eMMC 4GB, 1GB 2 x 240 Pin 4.330" L x 2.950" W (110.00mm x 75.00mm) -40°C ~ 85°C
TE0820-05-4DI81MA Trenz Electronic GmbH

TE0820-05-4DI81MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

3,430
Datasheet - Bulk Active - - - - - - - - -
TE0807-03-4BE21-A Trenz Electronic GmbH

TE0807-03-4BE21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

3,177
Datasheet TE0807 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0807-03-4BE21-AK Trenz Electronic GmbH

TE0807-03-4BE21-AK

MPSOC MODULE TE0807 WITH ZYNQ UL

Trenz Electronic GmbH

4,598
Datasheet TE0807 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ XCZU4EG-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE21-L Trenz Electronic GmbH

TE0808-05-6BE21-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

4,459
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE81-L Trenz Electronic GmbH

TE0808-05-6BE81-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

3,500
Datasheet - Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE21-F Trenz Electronic GmbH

TE0808-05-6BE21-F

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

3,124
Datasheet - Bulk Active MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0818-01-6BE21-A Trenz Electronic GmbH

TE0818-01-6BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

4,121
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0818-02-6BE81-A Trenz Electronic GmbH

TE0818-02-6BE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

2,233
Datasheet Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE21-A Trenz Electronic GmbH

TE0808-05-6BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,803
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE81-A Trenz Electronic GmbH

TE0808-05-6BE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,315
Datasheet - Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE81-E Trenz Electronic GmbH

TE0808-05-6BE81-E

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

4,167
Datasheet - Bulk Active - - - - - - - - -
TE0808-04-6BE21-L Trenz Electronic GmbH

TE0808-04-6BE21-L

IC MOD SOM MPSOC 4GB XCZU6EG

Trenz Electronic GmbH

3,891
Datasheet TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0808-05-6BE81-AK Trenz Electronic GmbH

TE0808-05-6BE81-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,954
Datasheet - Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE21-AK Trenz Electronic GmbH

TE0808-05-6BE21-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,098
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-04-6BE21-AK Trenz Electronic GmbH

TE0808-04-6BE21-AK

IC MOD SOM MPSOC 4GB ZU6EG

Trenz Electronic GmbH

2,627
Datasheet TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0807-03-5AI21-A Trenz Electronic GmbH

TE0807-03-5AI21-A

MPSOC ZYNQ USCALE 4GB DDR4

Trenz Electronic GmbH

4,840
Datasheet - Box Active - - - - - - - - -
MOD5270BXX NXP USA Inc.

MOD5270BXX

IC MOD COLDFIRE 95MHZ 2.064MB

NXP USA Inc.

3,323
Datasheet - Bulk Obsolete MCU, Ethernet Core ColdFire 5270 - 95MHz 512KB 2.064MB RJ-45, 2x50 Header 2.600" L x 2.000" W (66.04mm x 50.80mm) 0°C ~ 70°C
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FAQ

Frequently Asked Questions

What are Microcontrollers, Microprocessor, FPGA Modules components used for?

Microcontrollers, Microprocessor, FPGA Modules components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Microcontrollers, Microprocessor, FPGA Modules part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Microcontrollers, Microprocessor, FPGA Modules parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

BOM & COMPONENT SOURCING

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