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Microcontrollers, Microprocessor, FPGA Modules

Explore Microcontrollers, Microprocessor, FPGA Modules parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0803-04-5DE11-A Trenz Electronic GmbH

TE0803-04-5DE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

1,094
Datasheet TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU5EV-1SFVC784E - - 128MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0813-01-5DE11-A Trenz Electronic GmbH

TE0813-01-5DE11-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,502
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU5EV-1SFVC784E - - 128MB 2GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0817-01-4AI21-A Trenz Electronic GmbH

TE0817-01-4AI21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

4,229
Datasheet Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq UltraScale+ XCZU4CG-1FBVB900I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0813-02-5DE81-A Trenz Electronic GmbH

TE0813-02-5DE81-A

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

4,640
Datasheet Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-9BE81-L Trenz Electronic GmbH

TE0808-05-9BE81-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,513
Datasheet TE0808 Bulk Active MPU Core - - - 128MB 4GB - 2.990" L x 2.050" W (76.00mm x 52.00mm) -
TE0808-05-9BE21-L Trenz Electronic GmbH

TE0808-05-9BE21-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

4,646
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU9EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-9BE21-F Trenz Electronic GmbH

TE0808-05-9BE21-F

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

1,690
Datasheet - Bulk Active - - - - - - - - -
TE0818-01-9BE21-A Trenz Electronic GmbH

TE0818-01-9BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,513
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU9EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
AM0010-02-5DE21MA Trenz Electronic GmbH

AM0010-02-5DE21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

1,495
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU5EV-1E - - 128MB 4GB Board-to-Board (BTB) Socket 2.220" L x 1.575" W (56.40mm x 40.00mm) 0°C ~ 85°C
TE0808-05-9BE81-A Trenz Electronic GmbH

TE0808-05-9BE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,938
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core - - - 128MB 4GB - 2.990" L x 2.050" W (76.00mm x 52.00mm) -
TE0808-05-9BE21-E Trenz Electronic GmbH

TE0808-05-9BE21-E

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

4,206
Datasheet - Bulk Active - - - - - - - - -
TE0807-03-4AI21-A Trenz Electronic GmbH

TE0807-03-4AI21-A

MPSOC ZYNQ USCALE 4GB DDR4

Trenz Electronic GmbH

2,217
Datasheet TE0807 Box Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU4CG-1FBVB900I - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0808-04-9BE21-L Trenz Electronic GmbH

TE0808-04-9BE21-L

IC MOD SOM MPSOC 4GB XCZU9EG

Trenz Electronic GmbH

1,468
Datasheet TE0808 Box Active MPU Core - - - 128MB 4GB B2B - -
TE0808-05-9BE21-LZ Trenz Electronic GmbH

TE0808-05-9BE21-LZ

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

3,688
Datasheet Zynq UltraScale+ Bulk Obsolete MPU Core Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0818-02-9BE81-A Trenz Electronic GmbH

TE0818-02-9BE81-A

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

1,036
Datasheet Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-9BE81-AK Trenz Electronic GmbH

TE0808-05-9BE81-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,118
Datasheet - Bulk Discontinued at Digi-Key - - - - - - - - -
ME-AA1-480-2I3-D12E-NFX3-R2 Enclustra FPGA Solutions

ME-AA1-480-2I3-D12E-NFX3-R2

SOM ARRIA 10 10AS048 4GB

Enclustra FPGA Solutions

1,484
Datasheet - Bulk Active - - - - - - - - -
TE0807-03-7DI21-A Trenz Electronic GmbH

TE0807-03-7DI21-A

MPSOC ZYNQ USCALE 4GB DDR4

Trenz Electronic GmbH

3,063
Datasheet TE0807 Box Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU7EV-1FBVB900I - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0741-05-G2C-1-A Trenz Electronic GmbH

TE0741-05-G2C-1-A

MODULE FPGA KINTEX

Trenz Electronic GmbH

1,865
Datasheet Kintex™-7 Bulk Active FPGA Xilinx Kintex-7 FPGA XC7K410T-2FBG676C - - 32MB - Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 70°C
TE0841-02-31C21-A Trenz Electronic GmbH

TE0841-02-31C21-A

IC MODULE

Trenz Electronic GmbH

3,136
Datasheet TE0841 Bulk Discontinued at Digi-Key FPGA Core Kintex UltraScale KU035 - - 64MB 2GB B2B 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 70°C
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FAQ

Frequently Asked Questions

What are Microcontrollers, Microprocessor, FPGA Modules components used for?

Microcontrollers, Microprocessor, FPGA Modules components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Microcontrollers, Microprocessor, FPGA Modules part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Microcontrollers, Microprocessor, FPGA Modules parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

BOM & COMPONENT SOURCING

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