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Microcontrollers, Microprocessor, FPGA Modules

Explore Microcontrollers, Microprocessor, FPGA Modules parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0820-05-3BI21ML Trenz Electronic GmbH

TE0820-05-3BI21ML

MOD MPSOC 2GB DDR4

Trenz Electronic GmbH

1,446
Datasheet TE0820 Bulk Last Time Buy MPU Core - - - 8GB eMMC, 128MB QSPI 2GB - - -
20-101-1314 Digi

20-101-1314

MODULE ETHERNET OP7300

Digi

1,372
Datasheet - Bulk Obsolete - - - - - - - - -
5CSX-H5-4YA-RI Critical Link LLC

5CSX-H5-4YA-RI

IC MOD CORTEX-A9 800MHZ 1GB 32MB

Critical Link LLC

1,522
Datasheet MitySOM Bulk Active MPU, FPGA Core ARM® Cortex®-A9, Cyclone V SX/SE NEON™ SIMD 800MHz 32MB 1GB Edge Connector 3.200" L x 1.500" W (82.00mm x 39.00mm) -40°C ~ 85°C
TE0821-01-3AE31PA Trenz Electronic GmbH

TE0821-01-3AE31PA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,492
Datasheet TE0823 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU3CG-1SFVC784E ARM® Cortex®-A53, ARM® Cortex®-R5 - 128MB 4GB 2 x 100 Pin 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 85°C
5CSX-H6-53B-RC Critical Link LLC

5CSX-H6-53B-RC

IC MOD CORTEX-A9 800MHZ 512MB

Critical Link LLC

2,895
Datasheet MitySOM Bulk Active MPU, FPGA Core ARM® Cortex®-A9, Cyclone V SX/SE NEON™ SIMD 800MHz 48MB 512MB Edge Connector 3.200" L x 1.500" W (82.00mm x 39.00mm) 0°C ~ 70°C
AM0010-02-3BE21MA Trenz Electronic GmbH

AM0010-02-3BE21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

1,999
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU3EG-1E - - 128MB 4GB Board-to-Board (BTB) Socket 2.205" L x 1.575" W (56.00mm x 40.00mm) 0°C ~ 85°C
TE0745-02-71I31-AK Trenz Electronic GmbH

TE0745-02-71I31-AK

MOD SOM DDR3L 1GB HEAT SPREADER

Trenz Electronic GmbH

4,312
Datasheet TE0745 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7030) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.990" L x 2.130" W (76.00mm x 54.00mm) -40°C ~ 85°C
TE0803-02-03EG-1EB Trenz Electronic GmbH

TE0803-02-03EG-1EB

IC MODULE ZYNQ USCALE 4GB 128MB

Trenz Electronic GmbH

2,564
Datasheet TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0813-01-4DE11-AZ Trenz Electronic GmbH

TE0813-01-4DE11-AZ

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,883
Datasheet - Bulk Obsolete - - - - - - - - -
TE0745-03-71I31-AK Trenz Electronic GmbH

TE0745-03-71I31-AK

SOM WITH AMD ZYNQ 7030-1I AND HE

Trenz Electronic GmbH

1,724
Datasheet Zynq Bulk Active MPU Core ARM Cortex-A9 Xilinx Zynq 7030 SoC XC7Z030-1FBG676I - 64MB 1GB Samtec ST5 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0803-04-4DE11-A Trenz Electronic GmbH

TE0803-04-4DE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

2,972
Datasheet TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU4EV-1SFVC784E - - 128MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0821-01-3BI21MA Trenz Electronic GmbH

TE0821-01-3BI21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

4,690
Datasheet TE0823 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ XCZU3EG-1SFVC784I ARM® Cortex®-A53, ARM® Cortex®-R5 - 128MB 2GB 2 x 160 Pin 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0820-05-4DE81MA Trenz Electronic GmbH

TE0820-05-4DE81MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

1,532
Datasheet - Bulk Active - - - - - - - - -
TE0813-01-4DE11-A Trenz Electronic GmbH

TE0813-01-4DE11-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

4,590
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU4EV-1SFVC784E - - 128MB 2GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0813-02-4DE81-A Trenz Electronic GmbH

TE0813-02-4DE81-A

TE0813-02-4DE81-A STARTER KIT

Trenz Electronic GmbH

1,355
Datasheet Kintex™-7 Bulk Active FPGA Zynq™ UltraScale+™ ZU4EV - - 128MB 4GB BGA 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
AM0010-02-3BI21MA Trenz Electronic GmbH

AM0010-02-3BI21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

4,005
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU3EG-1I - - 128MB 4GB Board-to-Board (BTB) Socket 2.205" L x 1.575" W (56.00mm x 40.00mm) -40°C ~ 85°C
L138-DG-325-RI Critical Link LLC

L138-DG-325-RI

MITYDSP-L138F SOM W/ OMAP-L138

Critical Link LLC

2,963
Datasheet MityDSP-L138F Bag Obsolete MPU, DSP, FPGA Core ARM926EJ-S, OMAP-L138 TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) 375MHz 256MB (NAND), 16MB (NOR) 128MB SO-DIMM-200 2.660" L x 2.000" W (67.60mm x 50.80mm) -40°C ~ 85°C
AM0010-02-4DE21MA Trenz Electronic GmbH

AM0010-02-4DE21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

1,797
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU4EV - - 128MB 4GB Board-to-Board (BTB) Socket 2.220" L x 1.575" W (56.40mm x 40.00mm) 0°C ~ 85°C
TE0803-01-04CG-1EA Trenz Electronic GmbH

TE0803-01-04CG-1EA

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

3,099
Datasheet TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU4CG-1SFVC784E - - 128MB 2GB B2B 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
EC-VA-H264-10B-60-1080-MD00C-A200T System-On-Chip (SOC) Technologies Inc.

EC-VA-H264-10B-60-1080-MD00C-A200T

MOD H264 ENC 60FPS 1080 SODIMM

System-On-Chip (SOC) Technologies Inc.

1,106
Datasheet - Box Active DSP, FPGA Core - Xilinx Artix-7 XC7A200T - 32MB 512MB SO-DIMM - -
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FAQ

Frequently Asked Questions

What are Microcontrollers, Microprocessor, FPGA Modules components used for?

Microcontrollers, Microprocessor, FPGA Modules components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Microcontrollers, Microprocessor, FPGA Modules part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Microcontrollers, Microprocessor, FPGA Modules parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

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