Memory
Review Memory Memory components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.
If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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W25N02JWSFIF TRIC FLASH 2GBIT SPI/QUAD 16SOIC |
2,906 |
|
Datasheet | SpiFlash® | 16-SOIC (0.295", 7.50mm Width) | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | SPI - Quad I/O, QPI, DTR | 166 MHz | 700µs | 6 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 16-SOIC |
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W25N02JWSFIC TRIC FLASH 2GBIT SPI/QUAD 16SOIC |
2,570 |
|
Datasheet | SpiFlash® | 16-SOIC (0.295", 7.50mm Width) | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | SPI - Quad I/O, QPI, DTR | 166 MHz | 700µs | 6 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 16-SOIC |
|
W66BQ2NQUAGJIC DRAM 2GBIT LVSTL 06 200WFBGA |
1,264 |
|
Datasheet | - | 200-WFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 64M x 32 | LVSTL_06 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
|
W66BP2NQUAGJIC DRAM 2GBIT LVSTL 11 200TFBGA |
1,754 |
|
Datasheet | - | 200-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | 64M x 32 | LVSTL_11 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
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|
W25R512JVFINIC FLASH 512MBIT SPI 16SOIC |
2,830 |
|
Datasheet | - | - | Tray | Active | - | - | FLASH | - | 512Mbit | 64M x 8 | SPI | 133 MHz | - | - | - | - | - | - | - | 16-SOIC |
|
|
W25R512JVFIQ TRIC FLASH 512MBIT SPI 16SOIC |
3,713 |
|
Datasheet | - | 16-SOIC (0.295", 7.50mm Width) | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 512Mbit | 64M x 8 | SPI | 133 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | - | - | Surface Mount | 16-SOIC |
|
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W66BP2NQUAHJIC DRAM 2GBIT LVSTL 11 200TFBGA |
4,594 |
|
Datasheet | - | 200-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | 64M x 32 | LVSTL_11 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
|
W66BQ2NQUAHJIC DRAM 2GBIT LVSTL 06 200WFBGA |
1,297 |
|
Datasheet | - | 200-WFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 64M x 32 | LVSTL_06 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W66CQ2NQUAFJ TRIC DRAM 4GBIT LVSTL 11 200WFBGA |
1,999 |
|
Datasheet | - | 200-WFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | 128M x 32 | LVSTL_11 | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
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W66CP2NQUAFJ TRIC DRAM 4GBIT LVSTL 11 200WFBGA |
2,365 |
|
Datasheet | - | 200-WFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | 128M x 32 | LVSTL_11 | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
Frequently Asked Questions
What are Memory components used for?
Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Memory part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
