JIEXIN Electronics — Your one-stop global supplier of chips and electronic components.
FILTERED COMPONENT SELECTION

Memory

Review Memory Memory components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Programmable Memory Type Memory Format Technology Memory Size Memory Organization Memory Interface Clock Frequency Write Cycle Time - Word, Page Access Time Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
W632GG6NB11I Winbond Electronics

W632GG6NB11I

IC DRAM 2GBIT PAR 96VFBGA

Winbond Electronics

2,650
Datasheet - 96-VFBGA Tray Last Time Buy Not Verified Volatile DRAM SDRAM - DDR3 2Gbit 128M x 16 Parallel 933 MHz 15ns 20 ns 1.425V ~ 1.575V -40°C ~ 95°C (TC) - - Surface Mount 96-VFBGA (7.5x13)
W66BP2NQQAHJ Winbond Electronics

W66BP2NQQAHJ

IC DRAM 2GBIT LVSTL 11 200TFBGA

Winbond Electronics

1,126
Datasheet - 200-TFBGA Tray Active - Volatile DRAM SDRAM - Mobile LPDDR4 2Gbit 64M x 32 LVSTL_11 2.133 GHz 18ns 3.6 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-TFBGA (10x14.5)
W66BQ2NQQAHJ Winbond Electronics

W66BQ2NQQAHJ

IC DRAM 2GBIT LVSTL 06 200TFBGA

Winbond Electronics

1,982
Datasheet - 200-TFBGA Tray Active - Volatile DRAM SDRAM - Mobile LPDDR4X 2Gbit 64M x 32 LVSTL_06 2.133 GHz 18ns 3.6 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-TFBGA (10x14.5)
W632GG8NB09I Winbond Electronics

W632GG8NB09I

IC DRAM 2GBIT PAR 78VFBGA

Winbond Electronics

4,148
Datasheet - 78-VFBGA Tray Last Time Buy Not Verified Volatile DRAM SDRAM - DDR3 2Gbit 256M x 8 Parallel 1.067 GHz 15ns 20 ns 1.425V ~ 1.575V -40°C ~ 95°C (TC) - - Surface Mount 78-VFBGA (8x10.5)
W632GG6NB09I Winbond Electronics

W632GG6NB09I

IC DRAM 2GBIT PAR 96VFBGA

Winbond Electronics

1,345
Datasheet - 96-VFBGA Tray Last Time Buy Not Verified Volatile DRAM SDRAM - DDR3 2Gbit 128M x 16 Parallel 1.067 GHz 15ns 20 ns 1.425V ~ 1.575V -40°C ~ 95°C (TC) - - Surface Mount 96-VFBGA (7.5x13)
W25Q512JVFIN TR Winbond Electronics

W25Q512JVFIN TR

IC FLASH 512MBIT SPI/QUAD 16SOIC

Winbond Electronics

2,880
Datasheet SpiFlash® 16-SOIC (0.295", 7.50mm Width) Tape & Reel (TR) Active - Non-Volatile FLASH FLASH - NOR (SLC) 512Mbit 64M x 8 SPI - Quad I/O, QPI 133 MHz 3.5ms 6.5 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 16-SOIC
W25Q512JVEIQ TR Winbond Electronics

W25Q512JVEIQ TR

IC FLASH 512MBIT SPI/QUAD 8WSON

Winbond Electronics

2,390
Datasheet SpiFlash® 8-WDFN Exposed Pad Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH - NOR 512Mbit 64M x 8 SPI - Quad I/O 133 MHz - - 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 8-WSON (8x6)
W25Q512JVEIM TR Winbond Electronics

W25Q512JVEIM TR

IC FLASH 512MBIT SPI/QUAD 8WSON

Winbond Electronics

3,537
Datasheet SpiFlash® 8-WDFN Exposed Pad Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH - NOR 512Mbit 64M x 8 SPI - Quad I/O 133 MHz - - 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 8-WSON (8x6)
W66BQ2NQUAFJ Winbond Electronics

W66BQ2NQUAFJ

IC DRAM 2GBIT LVSTL 06 200WFBGA

Winbond Electronics

1,776
Datasheet - 200-WFBGA Tray Active - Volatile DRAM SDRAM - Mobile LPDDR4X 2Gbit 64M x 32 LVSTL_06 1.6 GHz 18ns 3.6 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-WFBGA (10x14.5)
W66BP2NQUAFJ Winbond Electronics

W66BP2NQUAFJ

IC DRAM 2GBIT LVSTL 11 200TFBGA

Winbond Electronics

1,865
Datasheet - 200-TFBGA Tray Active - Volatile DRAM SDRAM - Mobile LPDDR4 2Gbit 64M x 32 LVSTL_11 1.6 GHz 18ns 3.6 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-TFBGA (10x14.5)
Total 2899 Record«Prev1... 129130131132133134135136...290Next»
FAQ

Frequently Asked Questions

What are Memory components used for?

Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Memory part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

PART MATCHING & SOURCING

Need Help Narrowing Down the Right Memory Part?

Send your target specifications, preferred manufacturer, quantity or reference part number. Our team can help check matching options, availability and quotation details for your sourcing requirement.

BOM BOM Phone +86-138 0989 9356 Email info@jx-icsource.com Cart Shopping Cart Account My Account Back To Top