Memory
Review Memory Memory components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.
If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W66CQ2NQQAGJ TRIC DRAM 4GBIT LVSTL 200TFBGA |
1,255 |
|
Datasheet | - | 200-TFBGA | Tape & Reel (TR) | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | 128M x 32 | LVSTL_11 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W66CP2NQQAGJ TRIC DRAM 4GBIT LVSTL 200TFBGA |
1,759 |
|
Datasheet | - | 200-TFBGA | Tape & Reel (TR) | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | 128M x 32 | LVSTL_11 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W632GG8NB11IIC DRAM 2GBIT PAR 78VFBGA |
2,169 |
|
Datasheet | - | 78-VFBGA | Tray | Last Time Buy | Not Verified | Volatile | DRAM | SDRAM - DDR3 | 2Gbit | 256M x 8 | Parallel | 933 MHz | 15ns | 20 ns | 1.425V ~ 1.575V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 78-VFBGA (8x10.5) |
|
W29N02GZBIBFIC FLASH 2GBIT PARALLEL 63VFBGA |
1,155 |
|
Datasheet | SpiFlash® | 63-VFBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | Parallel | - | 35ns | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 63-VFBGA (9x11) |
|
W66CP2NQQAHJ TRIC DRAM 4GBIT LVSTL 200TFBGA |
3,488 |
|
Datasheet | - | 200-TFBGA | Tape & Reel (TR) | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | 128M x 32 | LVSTL_11 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W66CQ2NQQAHJ TRIC DRAM 4GBIT LVSTL 200TFBGA |
2,180 |
|
Datasheet | - | 200-TFBGA | Tape & Reel (TR) | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | 128M x 32 | LVSTL_11 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W631GU6MB11IIC DRAM 1GBIT PAR 96VFBGA |
4,906 |
|
Datasheet | - | 96-VFBGA | Tray | Obsolete | Not Verified | Volatile | DRAM | SDRAM - DDR3L | 1Gbit | 64M x 16 | Parallel | 933 MHz | - | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 96-VFBGA (7.5x13) |
|
W66BQ2NQQAGJIC DRAM 2GBIT LVSTL 06 200TFBGA |
3,509 |
|
Datasheet | - | 200-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 64M x 32 | LVSTL_06 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W66BP2NQQAGJIC DRAM 2GBIT LVSTL 11 200TFBGA |
3,506 |
|
Datasheet | - | 200-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | 64M x 32 | LVSTL_11 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W25Q512JVEIN TRIC FLASH 512MBIT SPI/QUAD 8WSON |
4,813 |
|
Datasheet | SpiFlash® | 8-WDFN Exposed Pad | Tape & Reel (TR) | Active | - | Non-Volatile | FLASH | FLASH - NOR (SLC) | 512Mbit | 64M x 8 | SPI - Quad I/O, QPI | 133 MHz | 3.5ms | 6.5 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WSON (8x6) |
Frequently Asked Questions
What are Memory components used for?
Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Memory part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.