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FILTERED COMPONENT SELECTION

Memory

Review Memory Memory components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Programmable Memory Type Memory Format Technology Memory Size Memory Organization Memory Interface Clock Frequency Write Cycle Time - Word, Page Access Time Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
W66CQ2NQQAGJ TR Winbond Electronics

W66CQ2NQQAGJ TR

IC DRAM 4GBIT LVSTL 200TFBGA

Winbond Electronics

1,255
Datasheet - 200-TFBGA Tape & Reel (TR) Active - Volatile DRAM SDRAM - Mobile LPDDR4X 4Gbit 128M x 32 LVSTL_11 1.867 GHz 18ns 3.6 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-TFBGA (10x14.5)
W66CP2NQQAGJ TR Winbond Electronics

W66CP2NQQAGJ TR

IC DRAM 4GBIT LVSTL 200TFBGA

Winbond Electronics

1,759
Datasheet - 200-TFBGA Tape & Reel (TR) Active - Volatile DRAM SDRAM - Mobile LPDDR4 4Gbit 128M x 32 LVSTL_11 1.867 GHz 18ns 3.6 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-TFBGA (10x14.5)
W632GG8NB11I Winbond Electronics

W632GG8NB11I

IC DRAM 2GBIT PAR 78VFBGA

Winbond Electronics

2,169
Datasheet - 78-VFBGA Tray Last Time Buy Not Verified Volatile DRAM SDRAM - DDR3 2Gbit 256M x 8 Parallel 933 MHz 15ns 20 ns 1.425V ~ 1.575V -40°C ~ 95°C (TC) - - Surface Mount 78-VFBGA (8x10.5)
W29N02GZBIBF Winbond Electronics

W29N02GZBIBF

IC FLASH 2GBIT PARALLEL 63VFBGA

Winbond Electronics

1,155
Datasheet SpiFlash® 63-VFBGA Tray Active - Non-Volatile FLASH FLASH - NAND (SLC) 2Gbit 256M x 8 Parallel - 35ns 25 ns 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 63-VFBGA (9x11)
W66CP2NQQAHJ TR Winbond Electronics

W66CP2NQQAHJ TR

IC DRAM 4GBIT LVSTL 200TFBGA

Winbond Electronics

3,488
Datasheet - 200-TFBGA Tape & Reel (TR) Active - Volatile DRAM SDRAM - Mobile LPDDR4 4Gbit 128M x 32 LVSTL_11 2.133 GHz 18ns 3.6 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-TFBGA (10x14.5)
W66CQ2NQQAHJ TR Winbond Electronics

W66CQ2NQQAHJ TR

IC DRAM 4GBIT LVSTL 200TFBGA

Winbond Electronics

2,180
Datasheet - 200-TFBGA Tape & Reel (TR) Active - Volatile DRAM SDRAM - Mobile LPDDR4X 4Gbit 128M x 32 LVSTL_11 2.133 GHz 18ns 3.6 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-TFBGA (10x14.5)
W631GU6MB11I Winbond Electronics

W631GU6MB11I

IC DRAM 1GBIT PAR 96VFBGA

Winbond Electronics

4,906
Datasheet - 96-VFBGA Tray Obsolete Not Verified Volatile DRAM SDRAM - DDR3L 1Gbit 64M x 16 Parallel 933 MHz - 20 ns 1.283V ~ 1.45V -40°C ~ 95°C (TC) - - Surface Mount 96-VFBGA (7.5x13)
W66BQ2NQQAGJ Winbond Electronics

W66BQ2NQQAGJ

IC DRAM 2GBIT LVSTL 06 200TFBGA

Winbond Electronics

3,509
Datasheet - 200-TFBGA Tray Active - Volatile DRAM SDRAM - Mobile LPDDR4X 2Gbit 64M x 32 LVSTL_06 1.867 GHz 18ns 3.6 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-TFBGA (10x14.5)
W66BP2NQQAGJ Winbond Electronics

W66BP2NQQAGJ

IC DRAM 2GBIT LVSTL 11 200TFBGA

Winbond Electronics

3,506
Datasheet - 200-TFBGA Tray Active - Volatile DRAM SDRAM - Mobile LPDDR4 2Gbit 64M x 32 LVSTL_11 1.867 GHz 18ns 3.6 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-TFBGA (10x14.5)
W25Q512JVEIN TR Winbond Electronics

W25Q512JVEIN TR

IC FLASH 512MBIT SPI/QUAD 8WSON

Winbond Electronics

4,813
Datasheet SpiFlash® 8-WDFN Exposed Pad Tape & Reel (TR) Active - Non-Volatile FLASH FLASH - NOR (SLC) 512Mbit 64M x 8 SPI - Quad I/O, QPI 133 MHz 3.5ms 6.5 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 8-WSON (8x6)
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FAQ

Frequently Asked Questions

What are Memory components used for?

Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Memory part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

PART MATCHING & SOURCING

Need Help Narrowing Down the Right Memory Part?

Send your target specifications, preferred manufacturer, quantity or reference part number. Our team can help check matching options, availability and quotation details for your sourcing requirement.

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