System On Chip (SoC)
Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MPFS095T-FCVG484IIC SOC RISC-V 484FCBGA |
3,967 |
|
Datasheet | PolarFire® | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 857.6kB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 93K Logic Modules | -40°C ~ 100°C | - | - | 484-FCBGA (19x19) |
|
SOM-2533AN0C-S0A1SMARC N50 4GLPDDR5 EDP 32GEMMC 1 |
4,582 |
|
Datasheet | SMARC | Module | Box | Active | MPU | Intel® N50 | - | 4GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | 3.4GHz | - | 0°C ~ 60°C | - | - | - |
|
|
SOM-2533BN0C-U0A1SMARC I3-N305 8GLPDDR5 32GEMMC 2 |
2,011 |
|
Datasheet | SMARC | Module | Box | Active | MPU | Intel® N97 | - | 4GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | 3.6GHz | - | 0°C ~ 60°C | - | - | - |
|
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MPFS160T-FCVG484IIC SOC RISC-V 484FCBGA |
3,310 |
|
Datasheet | PolarFire® | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 1.4125MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 161K Logic Modules | -40°C ~ 100°C | - | - | 484-FCBGA (19x19) |
|
|
SOM-2533CCBC-S5A1SMARC X7425E 8GLPDDR5 32GEMMC 2* |
1,517 |
|
Datasheet | SMARC | Module | Box | Active | MPU | Intel® Atom® x7425E | 32GB | 8GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | 3.4GHz | - | 0°C ~ 60°C | - | - | - |
|
|
MPFS160T-FCVG784IIC SOC RISC-V 784FCBGA |
3,520 |
|
Datasheet | PolarFire® | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 1.4125MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 161K Logic Modules | -40°C ~ 100°C | - | - | 784-FCBGA (23x23) |
|
|
SOM-2533BN0C-S0A1SMARC N200 4GLPDDR5 32GEMMC 2*LA |
4,657 |
|
Datasheet | SMARC | Module | Box | Active | MPU | Intel® N200 | - | 4GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | 3.7GHz | - | 0°C ~ 60°C | - | - | - |
|
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MPFS160T-1FCVG784IIC SOC RISC-V 784FCBGA |
2,787 |
|
Datasheet | PolarFire® | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 1.4125MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 161K Logic Modules | -40°C ~ 100°C | - | - | 784-FCBGA (23x23) |
|
SOM-2533DNCC-S8A1SMARC I3-N305 16GLPDDR5 64GEMMC |
2,377 |
|
Datasheet | SMARC | Module | Box | Active | MPU | Intel® i3-N305 | 64GB | 16GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | 3.8GHz | - | 0°C ~ 60°C | - | - | - |
|
XC7Z035-1FFG676IIC SOC CORTEX-A9 667MHZ 676FCBGA |
2,524 |
|
Datasheet | Zynq®-7000 | 676-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 275K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
|
TE0835-03-TXE81-ARFSOC MODULE WITH XILINX ZYNQ UL |
1,733 |
|
Datasheet | - | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
SLG7NT41204VGEMINI LAKE RVP |
1,696 |
|
Datasheet | - | 20-UFQFN | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - | -40°C ~ 85°C (TA) | - | - | 20-STQFN (2x3) |
|
QCC-743-1-MQFN40-MT-00-0QCC-743-1-MQFN40-MT-00-0. |
2,279 |
|
Datasheet | Qualcomm® QCC740 | 40-VFQFN | Tray | Active | DSP, MCU | RISC-V | 128KB | 484KB | I2S, PWM | CANbus, I2C, SDIO, SPI, UART/USART | 325MHz | - | -40°C ~ 105°C | - | - | 40-QFN (5x5) |
|
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QCC-743-1-MQFN40-TR-00-0QCC-743-1-MQFN40-TR-00-0. |
1,308 |
|
Datasheet | Qualcomm® QCC740 | 40-VFQFN | Tape & Reel (TR) | Active | DSP, MCU | RISC-V | 128KB | 484KB | I2S, PWM | CANbus, I2C, SDIO, SPI, UART/USART | 325MHz | - | -40°C ~ 105°C | - | - | 40-QFN (5x5) |
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BCM58101LB0KFBGLYNX - 100MHZ |
2,704 |
|
Datasheet | * | - | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
|
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BCM60321KMLGBCM60321: 200MBPS POWERLINE |
4,597 |
|
Datasheet | * | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
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QCC-744-2-MQFN56-TR-00-0QCC-744-2-MQFN56-TR-00-0. |
1,874 |
|
Datasheet | Qualcomm® QCC740 | 56-VFQFN | Tape & Reel (TR) | Active | DSP, MCU | RISC-V | 128KB | 484KB | I2S, PWM | CANbus, I2C, SDIO, SPI, UART/USART | 325MHz | - | -40°C ~ 105°C | - | - | 56-QFN (7x7) |
|
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QCC-744-2-MQFN56-MT-00-0QCC-744-2-MQFN56-MT-00-0. |
2,578 |
|
Datasheet | Qualcomm® QCC740 | 56-VFQFN | Tray | Active | DSP, MCU | RISC-V | 128KB | 484KB | I2S, PWM | CANbus, I2C, SDIO, SPI, UART/USART | 325MHz | - | -40°C ~ 105°C | - | - | 56-QFN (7x7) |
|
MAX32655GXG+TM4 CORE 100MHZ, 512KB/128KB, NO |
2,270 |
|
Datasheet | DARWIN | 81-LFBGA | Tape & Reel (TR) | Active | MCU | ARM® Cortex®-M4F | 512KB | 128kB | DMA, I2S, PWM, WDT | Bluetooth, I2C, SPI, UART | 100MHz | - | -40°C ~ 105°C (TA) | - | - | 81-CTBGA (8x8) |
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BCM58101B0KFBGLYNX |
2,617 |
|
Datasheet | * | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
