System On Chip (SoC)
Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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XC7Z030-2FBG484IIC SOC CORTEX-A9 800MHZ 484FCBGA |
4,058 |
|
Datasheet | Zynq®-7000 | 484-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (23x23) |
|
5CSXFC6D6F31I7NIC SOC CORTEX-A9 800MHZ 896FBGA |
2,492 |
|
Datasheet | Cyclone® V SX | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 110K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 896-FBGA (31x31) |
|
XC7Z030-2FFG676IIC SOC CORTEX-A9 800MHZ 676FCBGA |
1,929 |
|
Datasheet | Zynq®-7000 | 676-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
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XA7Z010-1CLG225QIC SOC CORTEX-A9 667MHZ 225BGA |
4,470 |
|
Datasheet | Zynq®-7000 XA | 225-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix™-7 FPGA, 28K Logic Cells | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 225-CSPBGA (13x13) |
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MPFS250TLS-FCVG484IIC SOC RISC-V 484FCBGA |
3,565 |
|
Datasheet | PolarFire® | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 100°C | - | - | 484-FCBGA (19x19) |
|
XCZU5EG-2SFVC784IIC SOC CORTEX-A53 784FCBGA |
3,414 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
XCZU7EV-2FFVC1156IIC SOC CORTEX-A53 1156FCBGA |
1,374 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EV | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
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XCZU2CG-1UBVA530IIC SOC CORTEX-A53 530BGA |
3,631 |
|
Datasheet | - | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
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XCZU2CG-2SBVA484IIC SOC CORTEX-A53 484FCBGA |
4,608 |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 484-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
|
SOM-2532CCBC-S9A1SBC 1.9GHZ 4 CORE 0GB/8GB RAM |
2,565 |
|
Datasheet | SMARC | Module | Bulk | Active | MPU | Intel® Atom® x6425RE | 32GB | 8GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 1.9GHz | - | 0°C ~ 60°C | - | - | - |
|
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XCZU3CG-1UBVA530IIC SOC CORTEX-A53 530BGA |
1,032 |
|
Datasheet | - | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
|
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SOM-2532CCBX-S9A1SBC 1.9GHZ 4 CORE 0GB/8GB RAM |
1,998 |
|
Datasheet | SMARC | Module | Bulk | Active | MPU | Intel® Atom® x6425RE | 32GB | 8GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 1.9GHz | - | -40°C ~ 85°C | - | - | - |
|
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XAZU5EV-1SFVC784IIC FPGA SOC ZU EV Q100 784SBGA |
1,270 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EV | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | - | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
M2S025T-1FCSG158IM2S025T-1FCSG158I |
2,251 |
|
Datasheet | - | 158-BGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 158-FCBGA |
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SOM-2532CCBC-S3A1SBC 1.3GHZ 2 CORE 0GB/8GB RAM |
1,299 |
|
Datasheet | SMARC | Module | Bulk | Active | MPU | Intel® Atom® x6211E | 32GB | 8GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 1.3GHz | - | 0°C ~ 60°C | - | - | - |
|
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SOM-2532CNBC-S2A1SBC 1.2GHZ 4 CORE 0GB/8GB RAM |
3,500 |
|
Datasheet | SMARC | Module | Bulk | Active | MPU | Pentium® N6415 | 32GB | 8GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 1.2GHz | - | 0°C ~ 60°C | - | - | - |
|
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XCZU3EG-2UBVA530IIC SOC CORTEX-A53 530BGA |
2,448 |
|
Datasheet | - | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
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10AS027E4F29E3SGIC SOC CORTEX-A9 1.5GHZ 780FBGA |
4,604 |
|
Datasheet | Arria 10 SX | 780-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 270K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 780-FBGA, FC (29x29) |
|
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AP510NFA-CBRMCU 250MHZ M55 4MB FLSH 225BGA |
4,485 |
|
Datasheet | - | 183-BGA | Tape & Reel (TR) | Active | MCU | ARM® Cortex®-M55 | 4MB | 3.75MB | I2S, WDT | I2C, SPI, UART/USART, USB | 250MHz | - | -20°C ~ 70°C | - | - | 183-BGA (6.5x6.5) |
|
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AP510NFA-CCRMCU 250MHZ M55 4MB FLSH 182CSP |
2,085 |
|
Datasheet | - | 144-BGA, WLCSP | Tape & Reel (TR) | Active | MCU | ARM® Cortex®-M55 | 4MB | 3.75MB | I2S, WDT | I2C, SPI, UART/USART, USB | 250MHz | - | -20°C ~ 70°C | - | - | 144-WLCSP (4.9x4.7) |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
