System On Chip (SoC)
Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MPFS160TLS-FCSG536IIC SOC RISC-V 536LFBGA |
2,577 |
|
Datasheet | PolarFire® | 536-LFBGA, CSPBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 1.4125MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 161K Logic Modules | -40°C ~ 100°C | - | - | 536-LFBGA |
|
XCZU3EG-1SFVC784EIC SOC CORTEX-A53 784FCBGA |
3,573 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
M2S150TS-1FC1152IIC SOC CORTEX-M3 166MHZ 1152BGA |
2,869 |
|
Datasheet | SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
XC7Z030-3FFG676EIC SOC CORTEX-A9 1GHZ 676FCBGA |
2,205 |
|
Datasheet | Zynq®-7000 | 676-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1GHz | Kintex™-7 FPGA, 125K Logic Cells | 0°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
|
A5ED065BB23AE5SR0IC MPU FPGA AGILEX5E ES 839BGA |
4,952 |
|
Datasheet | Agilex E | 839-FBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ | - | 512kB | DDR, DMA, PCIe, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz, 1.8GHz | FPGA - 656K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 839-VPBGA (23x23) |
|
|
A5ED065BB32AE4SR0IC MPU FPGA AGILEX5E ES 1591BGA |
4,141 |
|
Datasheet | Agilex E | 839-FBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ | - | 512kB | DDR, DMA, PCIe, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz, 1.8GHz | FPGA - 656K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 1591-VPBGA (32x32) |
|
XC7Z045-1FFG900IIC SOC CORTEX-A9 667MHZ 900FCBGA |
1,700 |
|
Datasheet | Zynq®-7000 | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 350K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
|
|
XCZU17EG-2FFVC1760EIC SOC CORTEX-A53 1760FCBGA |
3,141 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1760-FCBGA (42.5x42.5) |
|
UPD72874AGC-YEB-ASOC / AV LINK |
4,490 |
|
Datasheet | * | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
KS8695CENTAUR MULTI-PORT GATEWAY |
3,046 |
|
Datasheet | - | 208-BFQFP | Bulk | Active | MPU | ARM922T | - | - | DMA, WDT | Ethernet | 166MHz | - | - | - | - | 208-PQFP (28x28) |
|
UPD72893BGD-LML-ASOC / AV LINK |
3,134 |
|
Datasheet | * | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
PLCHIP-P10-51220X1P10 PLC ON A CHIP SINGLE, LQFP- |
2,294 |
|
Datasheet | - | 144-LQFP | Box | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 144-LQFP (20x20) |
|
|
PLCHIP-P10-51220X5P10 PLC ON A CHIP 5 PACK, LQFP- |
3,854 |
|
Datasheet | - | 144-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 144-LQFP (20x20) |
|
PLCHIP-P13-51220X5P13 PLC ON A CHIP 5 PACK, LQFP-2 |
3,389 |
|
Datasheet | - | 208-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 208-LQFP (28x28) |
|
XAZU2EG-1SFVA625IIC SOC CORTEX-A53 625FCBGA |
1,367 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 625-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 1.2MB | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
|
|
PLCHIP-P10-51220X10P10 PLC ON A CHIP 10 PACK, LQFP |
4,383 |
|
Datasheet | - | 144-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 144-LQFP (20x20) |
|
|
XCZU5EG-L2SFVC784EIC SOC CORTEX-A53 784FCBGA |
2,751 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
10E00025005X0SMARC 2.1 Module |
2,249 |
|
Datasheet | - | Module | Bulk | Active | MPU | Intel® Atom® X5-E3940 | 32GB | 4GB | HDMI, LVDS, SATA | Ethernet, I2C, MMC/SD/SDIO, PCIe, SPI, UART, USB | - | - | -5°C ~ 60°C | - | - | - |
|
XC7Z014S-1CLG400CIC SOC CORTEX-A9 667MHZ 400BGA |
2,627 |
|
Datasheet | Zynq®-7000 | 400-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix™-7 FPGA, 65K Logic Cells | 0°C ~ 85°C (TJ) | - | - | 400-CSPBGA (17x17) |
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|
XC7Z030-1SBG485CIC SOC CORTEX-A9 667MHZ 485FCBGA |
1,787 |
|
Datasheet | Zynq®-7000 | 484-FBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 125K Logic Cells | 0°C ~ 85°C (TJ) | - | - | 484-FCBGA (19x19) |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
