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ELECTRONIC COMPONENTS

System On Chip (SoC)

Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
1SX250HU3F50I2LG Intel

1SX250HU3F50I2LG

IC FPGA STRATIX 10 2397FBGA

Intel

4,386
Datasheet Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements -40°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
1SX250HU2F50E2LG Intel

1SX250HU2F50E2LG

IC FPGA STRATIX 10 2397FBGA

Intel

2,403
Datasheet Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements 0°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
AGFC019R24C2E1VB Intel

AGFC019R24C2E1VB

IC FPGA AGILEX-F 2340BGA

Intel

1,857
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFC019R24C2E1V Intel

AGFC019R24C2E1V

AGFC019R24C2E1V

Intel

1,075
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFD019R24C2E1VB Intel

AGFD019R24C2E1VB

IC FPGA AGILEX-F 2340BGA

Intel

2,804
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFD019R24C2E1V Intel

AGFD019R24C2E1V

AGFD019R24C2E1V

Intel

1,796
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFA023R24C3E4X Intel

AGFA023R24C3E4X

IC FPGA AGILEX-F 2340BGA

Intel

3,569
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
1SX280HN1F43E1VGAS Intel

1SX280HN1F43E1VGAS

IC FPGA STRATIX 10 1760FBGA

Intel

3,458
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements 0°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX280HN1F43E1VG Intel

1SX280HN1F43E1VG

IC FPGA STRATIX 10 1760FBGA

Intel

1,582
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements 0°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX280HN1F43E1VGS3 Intel

1SX280HN1F43E1VGS3

IC FPGA STRATIX 10 1760FBGA

Intel

4,536
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements 0°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
AGFB023R24C3E4X Intel

AGFB023R24C3E4X

IC FPGA AGILEX-F 2340BGA

Intel

4,936
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
XCZU67DR-2FFVE1156I AMD

XCZU67DR-2FFVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

2,072
Datasheet Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB - - 533MHz, 1.333GHz Zynq® UltraScale+™ RFSoC -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU67DR-2FSVE1156I AMD

XCZU67DR-2FSVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

2,552
Datasheet Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB - - 533MHz, 1.333GHz Zynq® UltraScale+™ RFSoC -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
AGFA027R24C2E3VR2 Intel

AGFA027R24C2E3VR2

IC FPGA AGILEX-F 2340FBGA

Intel

1,545
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFA027R24C3I3E Intel

AGFA027R24C3I3E

IC FPGA AGILEX-F 2340FBGA

Intel

3,071
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements -40°C ~ 100°C (TJ) - - -
AGFA027R24C2E3V Intel

AGFA027R24C2E3V

IC FPGA AGILEX-F 2340FBGA

Intel

1,719
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB027R24C2E3VR2 Intel

AGFB027R24C2E3VR2

IC FPGA AGILEX-F 2340FBGA

Intel

2,384
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB027R24C2E3V Intel

AGFB027R24C2E3V

IC FPGA AGILEX-F 2340FBGA

Intel

1,761
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB027R24C3I3E Intel

AGFB027R24C3I3E

IC FPGA AGILEX-F 2340FBGA

Intel

4,655
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements -40°C ~ 100°C (TJ) - - -
AGIB027R31B3E3E Intel

AGIB027R31B3E3E

IC FPGA AGILEX-I 3184FBGA

Intel

4,991
Datasheet Agilex I - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
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FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

BOM & COMPONENT SOURCING

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