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System On Chip (SoC)

Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
1SX280HN3F43I3XG Intel

1SX280HN3F43I3XG

IC FPGA STRATIX 10 1760FBGA

Intel

1,039
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements -40°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX280LN3F43I3XGAS Intel

1SX280LN3F43I3XGAS

IC FPGA STRATIX 10 1760FBGA

Intel

3,758
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements -40°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX280LN3F43I3XG Intel

1SX280LN3F43I3XG

IC FPGA STRATIX 10 1760FBGA

Intel

2,674
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements -40°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
XCVC1702-2MSEVSVA1596 AMD

XCVC1702-2MSEVSVA1596

IC VERSAL AI-CORE FPGA 1596BGA

AMD

1,098
Datasheet Versal™ AI Core 1596-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ AI Core FPGA, 1M Logic Cells 0°C ~ 110°C (TJ) - - 1596-FCBGA (37.5x37.5)
XCVC1702-1MSIVSVA1596 AMD

XCVC1702-1MSIVSVA1596

IC VERSAL AI-CORE FPGA 1596BGA

AMD

4,465
Datasheet Versal™ AI Core 1596-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ AI Core FPGA, 1M Logic Cells -40°C ~ 110°C (TJ) - - 1596-FCBGA (37.5x37.5)
AGFA022R24C2E3E Intel

AGFA022R24C2E3E

IC FPGA AGILEX-F 2340FBGA

Intel

2,034
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFA022R24C2E2V Intel

AGFA022R24C2E2V

IC FPGA AGILEX-F 2340FBGA

Intel

3,774
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFA022R24C2E2VB Intel

AGFA022R24C2E2VB

IC FPGA AGILEX-F 2340BGA

Intel

3,768
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB022R24C2E3E Intel

AGFB022R24C2E3E

IC FPGA AGILEX-F 2340FBGA

Intel

2,519
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB022R24C2E2V Intel

AGFB022R24C2E2V

IC FPGA AGILEX-F 2340FBGA

Intel

4,291
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB022R24C2E2VB Intel

AGFB022R24C2E2VB

IC FPGA AGILEX-F 2340BGA

Intel

4,899
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFA022R25A2I2V Intel

AGFA022R25A2I2V

IC FPGA AGILEX-F 2581FBGA

Intel

2,621
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements -40°C ~ 100°C (TJ) - - -
AGFA022R25A2I3E Intel

AGFA022R25A2I3E

IC FPGA AGILEX-F 2581FBGA

Intel

1,410
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements -40°C ~ 100°C (TJ) - - -
XCZU49DR-1FSVF1760E AMD

XCZU49DR-1FSVF1760E

IC ZUP RFSOC A53 FPGA 1760BGA

AMD

2,186
Datasheet Zynq® UltraScale+™ RFSoC 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells 0°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCZU49DR-1FFVF1760E AMD

XCZU49DR-1FFVF1760E

IC ZUP RFSOC A53 FPGA 1760BGA

AMD

1,699
Datasheet Zynq® UltraScale+™ RFSoC 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells 0°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
AGFB022R25A2I2V Intel

AGFB022R25A2I2V

IC FPGA AGILEX-F 2581FBGA

Intel

4,941
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements -40°C ~ 100°C (TJ) - - -
AGFB022R25A2I3E Intel

AGFB022R25A2I3E

IC FPGA AGILEX-F 2581FBGA

Intel

2,608
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements -40°C ~ 100°C (TJ) - - -
AGFA019R31C3E4X Intel

AGFA019R31C3E4X

IC FPGA AGILEX-F 3184FBGA

Intel

1,217
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFA023R25A1E1V Intel

AGFA023R25A1E1V

IC FPGA AGILEX-F 2581FBGA

Intel

1,262
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB019R31C3E4X Intel

AGFB019R31C3E4X

IC FPGA AGILEX-F 3184FBGA

Intel

1,659
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
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FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

BOM & COMPONENT SOURCING

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