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ELECTRONIC COMPONENTS

System On Chip (SoC)

Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
AGFB023R25A1E1V Intel

AGFB023R25A1E1V

IC FPGA AGILEX-F 2581FBGA

Intel

3,509
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - -
1SX250HH2F55I2LG Intel

1SX250HH2F55I2LG

IC FPGA STRATIX 10 2912FBGA

Intel

3,568
Datasheet Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements -40°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
AGFA019R24C2E4X Intel

AGFA019R24C2E4X

IC FPGA AGILEX-F 2340BGA

Intel

2,314
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
1SX250LH3F55E2LG Intel

1SX250LH3F55E2LG

IC SOC CORTEX-A53 1.5GHZ 2912BGA

Intel

3,865
Datasheet Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements 0°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
AGFB019R24C2E4X Intel

AGFB019R24C2E4X

IC FPGA AGILEX-F 2340BGA

Intel

3,387
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGIB019R31B2E3E Intel

AGIB019R31B2E3E

IC FPGA AGILEX-I 3184FBGA

Intel

4,337
Datasheet Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGIB019R31B2E2V Intel

AGIB019R31B2E2V

IC FPGA AGILEX-I 3184FBGA

Intel

2,527
Datasheet Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGIB019R31B2E2VB Intel

AGIB019R31B2E2VB

IC FPGA AGILEX-I 3184BGA

Intel

2,623
Datasheet Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFA027R25A2I3V Intel

AGFA027R25A2I3V

IC FPGA AGILEX-F 2581FBGA

Intel

4,535
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements -40°C ~ 100°C (TJ) - - -
AGFB027R25A2I3V Intel

AGFB027R25A2I3V

IC FPGA AGILEX-F 2581FBGA

Intel

1,806
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements -40°C ~ 100°C (TJ) - - -
1SX250LN2F43I2LG Intel

1SX250LN2F43I2LG

IC SOC CORTEX-A53 1.5GHZ 1760BGA

Intel

2,428
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements -40°C ~ 100°C (TJ) - - 1760-FBGA, FC (42.5x42.5)
1SX250HN2F43I2LG Intel

1SX250HN2F43I2LG

IC FPGA STRATIX 10 1760FBGA

Intel

1,719
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements -40°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
AGFC023R31C3I3E Intel

AGFC023R31C3I3E

IC FPGA AGILEX-F 3184FBGA

Intel

4,315
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFC023R31C2E3V Intel

AGFC023R31C2E3V

IC FPGA AGILEX-F 3184FBGA

Intel

3,416
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFD023R31C3I3E Intel

AGFD023R31C3I3E

IC FPGA AGILEX-F 3184FBGA

Intel

3,136
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFD023R31C2E3V Intel

AGFD023R31C2E3V

IC FPGA AGILEX-F 3184FBGA

Intel

4,434
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
1SX280HH1F55E1VG Intel

1SX280HH1F55E1VG

IC FPGA STRATIX 10 2912FBGA

Intel

3,763
Datasheet Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements 0°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
1SX280HH1F55E1VGS3 Intel

1SX280HH1F55E1VGS3

IC FPGA STRATIX 10 2912FBGA

Intel

4,513
Datasheet Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements 0°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
1SX250LU2F50E2LG Intel

1SX250LU2F50E2LG

IC SOC CORTEX-A53 1.5GHZ 2397BGA

Intel

2,276
Datasheet Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements 0°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
1SX250LU3F50I2LG Intel

1SX250LU3F50I2LG

IC SOC CORTEX-A53 1.5GHZ 2397BGA

Intel

4,843
Datasheet Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements -40°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
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FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

BOM & COMPONENT SOURCING

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