System On Chip (SoC)
Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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XCZU42DR-L1FFVE1156IIC ZUP RFSOC A53 FPGA LP 1156BGA |
4,483 |
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Datasheet | Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
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XCZU42DR-2FFVE1156EIC ZUP RFSOC A53 FPGA 1156BGA |
2,317 |
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Datasheet | Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
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AGFC019R25A2E4FIC FPGA AGILEX-F 2581FBGA |
1,139 |
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Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
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AGFC019R25A3I3EIC FPGA AGILEX-F 2581FBGA |
1,745 |
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Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
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AGFC019R25A2E3VIC FPGA AGILEX-F 2581FBGA |
4,307 |
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Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
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AGFD019R25A2E3VIC FPGA AGILEX-F 2581FBGA |
3,301 |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
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AGFD019R25A3I3EIC FPGA AGILEX-F 2581FBGA |
2,586 |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
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AGFD019R25A2E4FIC FPGA AGILEX-F 2581FBGA |
2,026 |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
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AGFA022R31C3E3VIC FPGA AGILEX-F 3184FBGA |
1,373 |
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Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
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AGFB022R31C3E3VIC FPGA AGILEX-F 3184FBGA |
3,786 |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
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AGFB014R24D2I3VIC FPGA AGILEX-F 2340FBGA |
1,811 |
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Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.4M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
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1SX250HH3F55E1VGIC FPGA STRATIX 10 2912FBGA |
4,697 |
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Datasheet | Stratix® 10 SX | 2912-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2912-FBGA, FC (55x55) |
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1SX110HN1F43I2LGIC FPGA STRATIX 10 1760FBGA |
1,055 |
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Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 1100K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
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1SX110HN1F43I2LGASIC FPGA STRATIX 10 1760FBGA |
2,185 |
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Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 1100K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
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1SX250LN3F43E1VGIC SOC CORTEX-A53 1.5GHZ 1760BGA |
2,761 |
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Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 1760-FBGA, FC (42.5x42.5) |
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1SX250HN3F43E1VGIC FPGA STRATIX 10 1760FBGA |
2,250 |
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Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
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XCVC1502-1MSEVSVA1596IC VERSAL AI-CORE FPGA 1596BGA |
1,969 |
|
Datasheet | Versal™ AI Core | 1596-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ AI Core FPGA, 800k Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1596-FCBGA (37.5x37.5) |
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XCVE1752-1MSENSVG1369IC VERSAL AI-CORE FPGA 1369BGA |
2,093 |
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Datasheet | Versal™ AI Core | 1369-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ AI Edge FPGA, 1M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1369-FCBGA (35x35) |
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AGFA008R24C2I1VIC FPGA AGILEX-F 2340FBGA |
3,561 |
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Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
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AGFA008R24C2I1VBIC FPGA AGILEX-F 2340BGA |
2,526 |
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Datasheet | Agilex F | 2340-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2340-BGA (45x42) |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.