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ELECTRONIC COMPONENTS

System On Chip (SoC)

Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
AGFD023R31C3E3V Intel

AGFD023R31C3E3V

IC FPGA AGILEX-F 3184FBGA

Intel

1,774
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
1SX250LU3F50E2VG Intel

1SX250LU3F50E2VG

IC SOC CORTEX-A53 1.5GHZ 2397BGA

Intel

1,492
Datasheet Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements 0°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
1SX250LU3F50I3VG Intel

1SX250LU3F50I3VG

IC SOC CORTEX-A53 1.5GHZ 2397BGA

Intel

1,140
Datasheet Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements -40°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
1SX250HU3F50I3VG Intel

1SX250HU3F50I3VG

IC FPGA STRATIX 10 2397FBGA

Intel

4,222
Datasheet Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements -40°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
1SX250HU3F50E2VG Intel

1SX250HU3F50E2VG

IC FPGA STRATIX 10 2397FBGA

Intel

4,690
Datasheet Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements 0°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
AGFA019R25A2E2V Intel

AGFA019R25A2E2V

IC FPGA AGILEX-F 2581FBGA

Intel

1,784
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFA019R25A2E3E Intel

AGFA019R25A2E3E

IC FPGA AGILEX-F 2581FBGA

Intel

1,850
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB019R25A2E3E Intel

AGFB019R25A2E3E

IC FPGA AGILEX-F 2581FBGA

Intel

2,900
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB019R25A2E2V Intel

AGFB019R25A2E2V

IC FPGA AGILEX-F 2581FBGA

Intel

3,952
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFA027R24C3E3V Intel

AGFA027R24C3E3V

IC FPGA AGILEX-F 2340FBGA

Intel

2,060
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
XCZU55DR-1FSVE1156I AMD

XCZU55DR-1FSVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

1,446
Datasheet Zynq® UltraScale+™ RFSoC DR 1156-BBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - - DDR, DMA, PCIe, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq® UltraScale+™ RFSoC -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU55DR-1FFVE1156I AMD

XCZU55DR-1FFVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

4,049
Datasheet Zynq® UltraScale+™ RFSoC DR 1156-BBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - - DDR, DMA, PCIe, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq® UltraScale+™ RFSoC -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
AGFB027R24C3E3V Intel

AGFB027R24C3E3V

IC FPGA AGILEX-F 2340FBGA

Intel

2,908
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFA014R24B1E1V Intel

AGFA014R24B1E1V

IC FPGA AGILEX-F 2486FBGA

Intel

1,391
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.4M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB014R24B1E1V Intel

AGFB014R24B1E1V

IC FPGA AGILEX-F 2486FBGA

Intel

1,233
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.4M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFA022R24C3I3V Intel

AGFA022R24C3I3V

IC FPGA AGILEX-F 2340FBGA

Intel

4,993
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements -40°C ~ 100°C (TJ) - - -
AGFB022R24C3I3V Intel

AGFB022R24C3I3V

IC FPGA AGILEX-F 2340FBGA

Intel

4,268
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements -40°C ~ 100°C (TJ) - - -
AGFA019R24C2E3V Intel

AGFA019R24C2E3V

IC FPGA AGILEX-F 2340BGA

Intel

1,361
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFA019R24C3I3E Intel

AGFA019R24C3I3E

IC FPGA AGILEX-F 2340BGA

Intel

1,000
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB019R24C2E3V Intel

AGFB019R24C2E3V

IC FPGA AGILEX-F 2340BGA

Intel

3,918
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
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FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

BOM & COMPONENT SOURCING

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