System On Chip (SoC)
Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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AGFC023R24C3E3VIC FPGA AGILEX-F 2340BGA |
4,326 |
|
Datasheet | Agilex F | 2340-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2340-BGA (45x42) |
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AGFD023R24C3E3VIC FPGA AGILEX-F 2340BGA |
2,355 |
|
Datasheet | Agilex F | 2340-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2340-BGA (45x42) |
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AGFA022R25A3E3EIC FPGA AGILEX-F 2581FBGA |
1,798 |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
|
1SX165HN2F43I2VGIC FPGA STRATIX 10 1760FBGA |
4,924 |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 1650K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
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AGFB022R25A3E3EIC FPGA AGILEX-F 2581FBGA |
2,229 |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
|
XCVM1802-2LSEVSVA2197IC VERSAL AICORE FPGA 2197BGA |
3,372 |
|
Datasheet | Versal™ Prime | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 450MHz, 1.08GHz | Versal™ Prime FPGA, 1.9M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 2197-FCBGA (45x45) |
|
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XCVM1802-1LSIVSVA2197IC VERSAL AICORE FPGA 2197BGA |
1,176 |
|
Datasheet | Versal™ Prime | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 400MHz, 1GHz | Versal™ Prime FPGA, 1.9M Logic Cells | -40°C ~ 100°C (TJ) | - | - | 2197-FCBGA (45x45) |
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XCVM1802-1MLIVSVA2197IC VERSAL AICORE FPGA 2197BGA |
2,762 |
|
Datasheet | Versal™ Prime | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ Prime FPGA, 1.9M Logic Cells | -40°C ~ 100°C (TJ) | - | - | 2197-FCBGA (45x45) |
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XCVM1802-2MLEVSVA2197IC VERSAL AICORE FPGA 2197BGA |
1,283 |
|
Datasheet | Versal™ Prime | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ Prime FPGA, 1.9M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 2197-FCBGA (45x45) |
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AGFA008R16A2I1VIC FPGA AGILEX-F 1546FBGA |
1,130 |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
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AGFA008R16A2I1VBIC FPGA AGILEX-F 1546BGA |
4,803 |
|
Datasheet | Agilex F | 1546-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1546-BGA (37.5x34) |
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AGFB008R16A2I1VIC FPGA AGILEX-F 1546FBGA |
3,625 |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
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AGFB008R16A2I1VBIC FPGA AGILEX-F 1546BGA |
2,716 |
|
Datasheet | Agilex F | 1546-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1546-BGA (37.5x34) |
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XCVM1802-2MSIVSVD1760IC VERSAL AICORE FPGA 1760BGA |
1,706 |
|
Datasheet | Versal™ Prime | 1760-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ Prime FPGA, 1.9M Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1760-FCBGA (40x40) |
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XCVC1502-1MSENSVG1369IC VERSAL AI-CORE FPGA 1369BGA |
3,384 |
|
Datasheet | Versal™ AI Core | 1369-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ AI Core FPGA, 800k Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1369-FCBGA (35x35) |
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XCVP1202-1LSEVSVA2785IC VERSAL AI-CORE FPGA 2785BGA |
2,801 |
|
Datasheet | Versal® Premium | 2785-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 400MHz, 1GHz | Versal™ Premium FPGA, 2M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 2785-FCBGA (50x50) |
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AGFA008R24C2E4XIC FPGA AGILEX-F 2340FBGA |
2,856 |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
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XCZU19EG-3FFVD1760EIC SOC CORTEX-A53 1760FCBGA |
4,874 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 667MHz, 1.5GHz | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1760-FCBGA (42.5x42.5) |
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AGFB008R24C2E4XIC FPGA AGILEX-F 2340FBGA |
2,803 |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
|
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AGFA023R31C3E3VIC FPGA AGILEX-F 3184FBGA |
2,392 |
|
Datasheet | Agilex F | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
