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FILTERED COMPONENT SELECTION

Memory

Review Memory Memory components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Programmable Memory Type Memory Format Technology Memory Size Memory Organization Memory Interface Clock Frequency Write Cycle Time - Word, Page Access Time Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
W25Q01JVTBIM Winbond Electronics

W25Q01JVTBIM

IC FLASH 1GBIT SPI/QUAD 24TFBGA

Winbond Electronics

4,274
Datasheet SpiFlash® 24-TBGA Tray Active Not Verified Non-Volatile FLASH FLASH - NOR 1Gbit 128M x 8 SPI - Quad I/O, QPI, DTR 133 MHz 3.5ms 7.5 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 24-TFBGA (8x6)
W25Q01JVSFIM Winbond Electronics

W25Q01JVSFIM

IC FLASH 1GBIT SPI/QUAD 16SOIC

Winbond Electronics

4,984
Datasheet SpiFlash® 16-SOIC (0.295", 7.50mm Width) Tray Active Not Verified Non-Volatile FLASH FLASH - NOR 1Gbit 128M x 8 SPI - Quad I/O 133 MHz 3.5ms 7.5 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 16-SOIC
W25Q01JVSFIN Winbond Electronics

W25Q01JVSFIN

IC FLASH 1GBIT SPI/QUAD 16SOIC

Winbond Electronics

3,916
Datasheet SpiFlash® 16-SOIC (0.295", 7.50mm Width) Tray Active - Non-Volatile FLASH FLASH - NOR (SLC) 1Gbit 128M x 8 SPI - Quad I/O 133 MHz 3.5ms 7.5 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 16-SOIC
W66CL2NQUAGJ Winbond Electronics

W66CL2NQUAGJ

IC DRAM 4GBIT LVSTL 11 200WFBGA

Winbond Electronics

3,083
Datasheet - 200-WFBGA Tray Not For New Designs Not Verified Volatile DRAM SDRAM - Mobile LPDDR4 4Gbit 128M x 32 LVSTL_11 1.866 GHz 18ns 3.5 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-WFBGA (10x14.5)
W25Q01NWTBIQ TR Winbond Electronics

W25Q01NWTBIQ TR

IC FLASH 1GBIT SPI/QUAD 24TFBGA

Winbond Electronics

3,540
Datasheet SpiFlash® 24-TBGA Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH - NOR 1Gbit 128M x 8 SPI - Quad I/O, QPI 133 MHz 3ms 7 ns 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 24-TFBGA (8x6)
W25Q01NWTBIM TR Winbond Electronics

W25Q01NWTBIM TR

IC FLASH 1GBIT SPI/QUAD 24TFBGA

Winbond Electronics

3,086
Datasheet SpiFlash® 24-TBGA Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH - NOR 1Gbit 128M x 8 SPI - Quad I/O, QPI 133 MHz 3ms 7 ns 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 24-TFBGA (8x6)
W66CM2NQUAGJ Winbond Electronics

W66CM2NQUAGJ

IC DRAM 4GBIT LVSTL 11 200WFBGA

Winbond Electronics

4,081
Datasheet - 200-WFBGA Tray Not For New Designs Not Verified Volatile DRAM SDRAM - Mobile LPDDR4X 4Gbit 128M x 32 LVSTL_11 1.866 GHz 18ns 3.5 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-WFBGA (10x14.5)
W25Q01NWSFIQ TR Winbond Electronics

W25Q01NWSFIQ TR

IC FLASH 1GBIT SPI/QUAD 16SOIC

Winbond Electronics

4,024
Datasheet SpiFlash® 16-SOIC (0.295", 7.50mm Width) Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH - NOR 1Gbit 128M x 8 SPI - Quad I/O, QPI 133 MHz 3ms 7 ns 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 16-SOIC
W25Q01NWSFIM TR Winbond Electronics

W25Q01NWSFIM TR

IC FLASH 1GBIT SPI/QUAD 16SOIC

Winbond Electronics

4,825
Datasheet SpiFlash® 16-SOIC (0.295", 7.50mm Width) Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH - NOR 1Gbit 128M x 8 SPI - Quad I/O, QPI 133 MHz 3ms 7 ns 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 16-SOIC
W972GG8KS-18 Winbond Electronics

W972GG8KS-18

IC DRAM 2GBIT 60-WBGA

Winbond Electronics

4,098
Datasheet - 60-TFBGA Tray Active Not Verified Volatile DRAM SDRAM - DDR2 2Gbit 256M x 8 - 533 MHz 15ns 58.125 ns 1.7V ~ 1.9V 0°C ~ 85°C (TC) - - Surface Mount 60-WBGA (8x9.5)
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FAQ

Frequently Asked Questions

What are Memory components used for?

Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Memory part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

PART MATCHING & SOURCING

Need Help Narrowing Down the Right Memory Part?

Send your target specifications, preferred manufacturer, quantity or reference part number. Our team can help check matching options, availability and quotation details for your sourcing requirement.

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