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FILTERED COMPONENT SELECTION

Memory

Review Memory Memory components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Programmable Memory Type Memory Format Technology Memory Size Memory Organization Memory Interface Clock Frequency Write Cycle Time - Word, Page Access Time Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
W29N04KWBIBF Winbond Electronics

W29N04KWBIBF

IC FLASH 4GBIT ONFI 63VFBGA

Winbond Electronics

3,097
Datasheet - 63-VFBGA Tray Active - Non-Volatile FLASH FLASH - NAND (SLC) 4Gbit 256M x 16 ONFI - 25ns, 700µs 25 ns 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 63-VFBGA (9x11)
W29N04GVSIAF Winbond Electronics

W29N04GVSIAF

IC FLASH 4GBIT ONFI 48TSOP

Winbond Electronics

4,636
Datasheet - 48-TFSOP (0.724", 18.40mm Width) Tray Active Not Verified Non-Volatile FLASH FLASH - NAND (SLC) 4Gbit 512M x 8 ONFI - 25ns, 700µs 25 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 48-TSOP
W97BH2MBVA2J Winbond Electronics

W97BH2MBVA2J

IC DRAM 2GBIT HSUL 12 134VFBGA

Winbond Electronics

1,884
Datasheet - 134-VFBGA Tray Active Not Verified Volatile DRAM SDRAM - Mobile LPDDR2-S4B 2Gbit 64M x 32 HSUL_12 400 MHz 15ns - 1.14V ~ 1.3V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 134-VFBGA (10x11.5)
W66BL6NBUAHJ Winbond Electronics

W66BL6NBUAHJ

IC DRAM 2GBIT LVSTL 11 200WFBGA

Winbond Electronics

3,071
Datasheet - 200-WFBGA Tray Not For New Designs Not Verified Volatile DRAM SDRAM - Mobile LPDDR4 2Gbit 128M x 16 LVSTL_11 2.133 GHz 18ns 3.5 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-WFBGA (10x14.5)
W29N04GZBIBA Winbond Electronics

W29N04GZBIBA

IC FLASH 4GBIT ONFI 63VFBGA

Winbond Electronics

4,411
Datasheet - 63-VFBGA Tray Active Not Verified Non-Volatile FLASH FLASH - NAND (SLC) 4Gbit 512M x 8 ONFI - 25ns, 700µs 35 ns 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 63-VFBGA (9x11)
W29N04GZBIBF Winbond Electronics

W29N04GZBIBF

IC FLASH 4GBIT PARALLEL 63VFBGA

Winbond Electronics

3,604
Datasheet SpiFlash® 63-VFBGA Tray Active - Non-Volatile FLASH FLASH - NAND (SLC) 4Gbit 512M x 8 Parallel - 35ns, 700µs 25 ns 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 63-VFBGA (9x11)
W66BM6NBUAHJ Winbond Electronics

W66BM6NBUAHJ

IC DRAM 2GBIT LVSTL 11 200WFBGA

Winbond Electronics

3,252
Datasheet - 200-WFBGA Tray Not For New Designs Not Verified Volatile DRAM SDRAM - Mobile LPDDR4X 2Gbit 128M x 16 LVSTL_11 2.133 GHz 18ns 3.5 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-WFBGA (10x14.5)
W29N04KZSIBF Winbond Electronics

W29N04KZSIBF

IC FLASH 4GBIT ONFI 48TSOP

Winbond Electronics

4,051
Datasheet - 48-TFSOP (0.724", 18.40mm Width) Tray Active Not Verified Non-Volatile FLASH FLASH - NAND (SLC) 4Gbit 512M x 8 ONFI - 25ns, 700µs 25 ns 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 48-TSOP
W29N04KZSIBG Winbond Electronics

W29N04KZSIBG

IC FLASH 4GBIT ONFI 48TSOP

Winbond Electronics

1,191
Datasheet - 48-TFSOP (0.724", 18.40mm Width) Tray Active Not Verified Non-Volatile FLASH FLASH - NAND (SLC) 4Gbit 512M x 8 ONFI - 35ns, 700µs 25 ns 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 48-TSOP
W29N04KZBIBG Winbond Electronics

W29N04KZBIBG

IC FLASH 4GBIT ONFI 63VFBGA

Winbond Electronics

4,879
Datasheet - 63-VFBGA Tray Active Not Verified Non-Volatile FLASH FLASH - NAND (SLC) 4Gbit 512M x 8 ONFI - 35ns, 700µs 25 ns 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 63-VFBGA (9x11)
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FAQ

Frequently Asked Questions

What are Memory components used for?

Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Memory part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

PART MATCHING & SOURCING

Need Help Narrowing Down the Right Memory Part?

Send your target specifications, preferred manufacturer, quantity or reference part number. Our team can help check matching options, availability and quotation details for your sourcing requirement.

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