Memory
Review Memory Memory components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.
If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W25N04KVTBIUIC FLASH 4GBIT SPI/QUAD 24TFBGA |
1,537 |
|
Datasheet | SpiFlash® | 24-TBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND | 4Gbit | 512M x 8 | SPI - Quad I/O | 104 MHz | 250µs | - | 2.7V ~ 3.6V | -40°C ~ 85°C | - | - | Surface Mount | 24-TFBGA (8x6) |
|
W25M512JWEIQIC FLASH 512MBIT SPI 8WSON |
3,508 |
|
Datasheet | SpiFlash® | 8-WDFN Exposed Pad | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 512Mbit | 64M x 8 | SPI | 104 MHz | 5ms | 7 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WSON (8x6) |
|
W66BL6NBUAHJ TRIC DRAM 2GBIT LVSTL 11 200WFBGA |
3,929 |
|
Datasheet | - | 200-WFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | 128M x 16 | LVSTL_11 | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W29N04GVSIAF TRIC FLASH 4GBIT ONFI 48TSOP |
1,102 |
|
Datasheet | - | 48-TFSOP (0.724", 18.40mm Width) | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 512M x 8 | ONFI | - | 25ns, 700µs | 25 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-TSOP |
|
|
W25R512JVEIQ TRIC FLASH 512MBIT SPI 8WSON |
1,831 |
|
Datasheet | - | 8-WDFN Exposed Pad | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 512Mbit | 64M x 8 | SPI | 133 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | - | - | Surface Mount | 8-WSON (8x6) |
|
|
W29N04GVSIAA TRIC FLASH 4GBIT ONFI 48TSOP |
3,325 |
|
Datasheet | - | 48-TFSOP (0.724", 18.40mm Width) | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 512M x 8 | ONFI | - | 25ns, 700µs | 20 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-TSOP |
|
|
W35N02JWTBIFIC FLASH 2GBIT SPI/OCT 24TFBGA |
4,623 |
|
Datasheet | - | 24-TBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | SPI - Octal I/O | 166 MHz | - | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |
|
|
W35N02JWTBICIC FLASH 2GBIT SPI/OCT 24TFBGA |
4,140 |
|
Datasheet | - | 24-TBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | SPI - Octal I/O | 166 MHz | - | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |
|
|
W66BM6NBUAHJ TRIC DRAM 2GBIT LVSTL 11 200WFBGA |
4,462 |
|
Datasheet | - | 200-WFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 128M x 16 | LVSTL_11 | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
|
W29N04GZBIBA TRIC FLASH 4GBIT ONFI 63VFBGA |
3,790 |
|
Datasheet | - | 63-VFBGA | Tape & Reel (TR) | Active | - | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 512M x 8 | Parallel | - | 35ns, 700µs | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 63-VFBGA (9x11) |
Frequently Asked Questions
What are Memory components used for?
Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Memory part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
