JIEXIN Electronics — Your one-stop global supplier of chips and electronic components.
FILTERED COMPONENT SELECTION

Memory

Review Memory Memory components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Programmable Memory Type Memory Format Technology Memory Size Memory Organization Memory Interface Clock Frequency Write Cycle Time - Word, Page Access Time Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
W97BH6MBVA1E Winbond Electronics

W97BH6MBVA1E

IC DRAM 2GBIT HSUL 12 134VFBGA

Winbond Electronics

4,322
Datasheet - 134-VFBGA Tray Active Not Verified Volatile DRAM SDRAM - Mobile LPDDR2-S4B 2Gbit 128M x 16 HSUL_12 533 MHz 15ns - 1.14V ~ 1.3V, 1.7V ~ 1.95V -25°C ~ 85°C (TC) - - Surface Mount 134-VFBGA (10x11.5)
W97BH2MBVA1I Winbond Electronics

W97BH2MBVA1I

IC DRAM 2GBIT HSUL 12 134VFBGA

Winbond Electronics

2,966
Datasheet - 134-VFBGA Tray Active Not Verified Volatile DRAM SDRAM - Mobile LPDDR2-S4B 2Gbit 64M x 32 HSUL_12 533 MHz 15ns - 1.14V ~ 1.3V, 1.7V ~ 1.95V -40°C ~ 85°C (TC) - - Surface Mount 134-VFBGA (10x11.5)
W97BH2MBVA1E Winbond Electronics

W97BH2MBVA1E

IC DRAM 2GBIT HSUL 12 134VFBGA

Winbond Electronics

4,863
Datasheet - 134-VFBGA Tray Active Not Verified Volatile DRAM SDRAM - Mobile LPDDR2-S4B 2Gbit 64M x 32 HSUL_12 533 MHz 15ns - 1.14V ~ 1.3V, 1.7V ~ 1.95V -25°C ~ 85°C (TC) - - Surface Mount 134-VFBGA (10x11.5)
W634GU8QB11I Winbond Electronics

W634GU8QB11I

IC DRAM 4GBIT PAR 78VFBGA

Winbond Electronics

1,817
Datasheet - 78-VFBGA Tray Obsolete Not Verified Volatile DRAM SDRAM - DDR3L 4Gbit 512M x 8 Parallel 933 MHz 15ns 20 ns 1.283V ~ 1.45V -40°C ~ 95°C (TC) - - Surface Mount 78-VFBGA (8x10.5)
W25M512JWFIQ TR Winbond Electronics

W25M512JWFIQ TR

IC FLASH 512MBIT SPI 16SOIC

Winbond Electronics

1,720
Datasheet SpiFlash® 16-SOIC (0.295", 7.50mm Width) Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH - NOR 512Mbit 64M x 8 SPI 104 MHz 5ms 7 ns 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 16-SOIC
W66BL6NBUAGJ TR Winbond Electronics

W66BL6NBUAGJ TR

IC DRAM 2GBIT LVSTL 11 200WFBGA

Winbond Electronics

1,082
Datasheet - 200-WFBGA Tape & Reel (TR) Not For New Designs Not Verified Volatile DRAM SDRAM - Mobile LPDDR4 2Gbit 128M x 16 LVSTL_11 1.866 GHz 18ns 3.5 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-WFBGA (10x14.5)
W634GU8QB09I Winbond Electronics

W634GU8QB09I

IC DRAM 4GBIT PAR 78VFBGA

Winbond Electronics

4,336
Datasheet - 78-VFBGA Tray Obsolete Not Verified Volatile DRAM SDRAM - DDR3L 4Gbit 512M x 8 Parallel 1.06 GHz 15ns 20 ns 1.283V ~ 1.45V -40°C ~ 95°C (TC) - - Surface Mount 78-VFBGA (8x10.5)
W25M512JWBIQ TR Winbond Electronics

W25M512JWBIQ TR

IC FLASH 512MBIT SPI 24TFBGA

Winbond Electronics

4,173
Datasheet SpiFlash® 24-TBGA Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH - NOR 512Mbit 64M x 8 SPI 104 MHz 5ms 7 ns 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 24-TFBGA (6x8)
W25Q512NWBIQ Winbond Electronics

W25Q512NWBIQ

IC FLASH 512MBIT SPI 24TFBGA

Winbond Electronics

2,256
Datasheet SpiFlash® 24-TBGA Tray Active Not Verified Non-Volatile FLASH FLASH - NOR 512Mbit 64M x 8 SPI - Quad I/O, QPI, DTR 133 MHz 3ms 6 ns 1.65V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 24-TFBGA (6x8)
W25N04KVZEIU Winbond Electronics

W25N04KVZEIU

IC FLASH 4GBIT SPI/QUAD 8WSON

Winbond Electronics

2,945
Datasheet SpiFlash® 8-WDFN Exposed Pad Tray Active Not Verified Non-Volatile FLASH FLASH - NAND 4Gbit 512M x 8 SPI - Quad I/O 104 MHz 250µs - 2.7V ~ 3.6V -40°C ~ 85°C - - Surface Mount 8-WSON (8x6)
Total 2899 Record«Prev1... 140141142143144145146147...290Next»
FAQ

Frequently Asked Questions

What are Memory components used for?

Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Memory part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

PART MATCHING & SOURCING

Need Help Narrowing Down the Right Memory Part?

Send your target specifications, preferred manufacturer, quantity or reference part number. Our team can help check matching options, availability and quotation details for your sourcing requirement.

BOM BOM Phone +86-138 0989 9356 Email info@jx-icsource.com Cart Shopping Cart Account My Account Back To Top