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FILTERED COMPONENT SELECTION

Memory

Review Memory Memory components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Programmable Memory Type Memory Format Technology Memory Size Memory Organization Memory Interface Clock Frequency Write Cycle Time - Word, Page Access Time Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
W978H2KBVX2I TR Winbond Electronics

W978H2KBVX2I TR

IC DRAM 256MBIT HSUL 12 134VFBGA

Winbond Electronics

3,616
Datasheet - 134-VFBGA Tape & Reel (TR) Not For New Designs Not Verified Volatile DRAM SDRAM - Mobile LPDDR2-S4B 256Mbit 8M x 32 HSUL_12 400 MHz 15ns 5.5 ns 1.14V ~ 1.3V, 1.7V ~ 1.95V -40°C ~ 85°C (TC) - - Surface Mount 134-VFBGA (10x11.5)
W978H6KBVX2E TR Winbond Electronics

W978H6KBVX2E TR

IC DRAM 256MBIT HSUL 12 134VFBGA

Winbond Electronics

1,856
Datasheet - 134-VFBGA Tape & Reel (TR) Not For New Designs Not Verified Volatile DRAM SDRAM - Mobile LPDDR2-S4B 256Mbit 16M x 16 HSUL_12 400 MHz 15ns 5.5 ns 1.14V ~ 1.3V, 1.7V ~ 1.95V -25°C ~ 85°C (TC) - - Surface Mount 134-VFBGA (10x11.5)
W978H2KBVX1E TR Winbond Electronics

W978H2KBVX1E TR

IC DRAM 256MBIT HSUL 12 134VFBGA

Winbond Electronics

1,432
Datasheet - 134-VFBGA Tape & Reel (TR) Not For New Designs Not Verified Volatile DRAM SDRAM - Mobile LPDDR2-S4B 256Mbit 8M x 32 HSUL_12 533 MHz 15ns 5.5 ns 1.14V ~ 1.3V, 1.7V ~ 1.95V -25°C ~ 85°C (TC) - - Surface Mount 134-VFBGA (10x11.5)
W978H2KBVX2E TR Winbond Electronics

W978H2KBVX2E TR

IC DRAM 256MBIT HSUL 12 134VFBGA

Winbond Electronics

4,594
Datasheet - 134-VFBGA Tape & Reel (TR) Not For New Designs Not Verified Volatile DRAM SDRAM - Mobile LPDDR2-S4B 256Mbit 8M x 32 HSUL_12 400 MHz 15ns 5.5 ns 1.14V ~ 1.3V, 1.7V ~ 1.95V -25°C ~ 85°C (TC) - - Surface Mount 134-VFBGA (10x11.5)
W978H6KBVX1E TR Winbond Electronics

W978H6KBVX1E TR

IC DRAM 256MBIT HSUL 12 134VFBGA

Winbond Electronics

1,674
Datasheet - 134-VFBGA Tape & Reel (TR) Not For New Designs Not Verified Volatile DRAM SDRAM - Mobile LPDDR2-S4B 256Mbit 16M x 16 HSUL_12 533 MHz 15ns 5.5 ns 1.14V ~ 1.3V, 1.7V ~ 1.95V -25°C ~ 85°C (TC) - - Surface Mount 134-VFBGA (10x11.5)
W978H2KBVX1I TR Winbond Electronics

W978H2KBVX1I TR

IC DRAM 256MBIT HSUL 12 134VFBGA

Winbond Electronics

1,587
Datasheet - 134-VFBGA Tape & Reel (TR) Not For New Designs Not Verified Volatile DRAM SDRAM - Mobile LPDDR2-S4B 256Mbit 8M x 32 HSUL_12 533 MHz 15ns 5.5 ns 1.14V ~ 1.3V, 1.7V ~ 1.95V -40°C ~ 85°C (TC) - - Surface Mount 134-VFBGA (10x11.5)
W9864G2JB-6 Winbond Electronics

W9864G2JB-6

IC DRAM 64MBIT 90-TFBG

Winbond Electronics

1,050
Datasheet - 90-TFBGA Tray Not For New Designs Not Verified Volatile DRAM SDRAM 64Mbit 2M x 32 - 166 MHz - 5 ns 3V ~ 3.6V 0°C ~ 70°C (TA) - - Surface Mount 90-TFBGA (8x13)
W9864G2JB-6I Winbond Electronics

W9864G2JB-6I

IC DRAM 64MBIT 90-TFBGA

Winbond Electronics

3,367
Datasheet - 90-TFBGA Tray Not For New Designs Not Verified Volatile DRAM SDRAM 64Mbit 2M x 32 - 166 MHz - 5 ns 3V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 90-TFBGA (8x13)
W63AH2NBVADI Winbond Electronics

W63AH2NBVADI

IC DRAM 1GBIT HSUL 12 178VFBGA

Winbond Electronics

1,906
Datasheet - 178-VFBGA Tray Active Not Verified Volatile DRAM SDRAM - Mobile LPDDR3 1Gbit 32M x 32 HSUL_12 1.066 GHz 15ns 5.5 ns 1.14V ~ 1.3V, 1.7V ~ 1.95V -40°C ~ 85°C (TC) - - Surface Mount 178-VFBGA (11x11.5)
W66BQ2NQUAGJ TR Winbond Electronics

W66BQ2NQUAGJ TR

IC DRAM 2GBIT LVSTL 06 200WFBGA

Winbond Electronics

3,739
Datasheet - 200-WFBGA Tape & Reel (TR) Active - Volatile DRAM SDRAM - Mobile LPDDR4X 2Gbit 64M x 32 LVSTL_06 1.867 GHz 18ns 3.6 ns 1.06V ~ 1.17V, 1.7V ~ 1.95V -40°C ~ 105°C (TC) - - Surface Mount 200-WFBGA (10x14.5)
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FAQ

Frequently Asked Questions

What are Memory components used for?

Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Memory part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

PART MATCHING & SOURCING

Need Help Narrowing Down the Right Memory Part?

Send your target specifications, preferred manufacturer, quantity or reference part number. Our team can help check matching options, availability and quotation details for your sourcing requirement.

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