Memory
Review Memory Memory components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.
If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W66BQ2NQQAFJ TRIC DRAM 2GBIT LVSTL 06 200TFBGA |
1,517 |
|
Datasheet | - | 200-TFBGA | Tape & Reel (TR) | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 64M x 32 | LVSTL_06 | 1.6 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W66BP2NQQAFJ TRIC DRAM 2GBIT LVSTL 11 200TFBGA |
3,498 |
|
Datasheet | - | 200-TFBGA | Tape & Reel (TR) | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | 64M x 32 | LVSTL_11 | 1.6 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
|
W25N02KVTCIRIC FLASH 2GBIT SPI/QUAD 24TFBGA |
3,142 |
|
Datasheet | SpiFlash® | 24-TBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | SPI - Quad I/O | 104 MHz | 700µs | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |
|
|
W25N02KVTCIUIC FLASH 2GBIT SPI/QUAD 24TFBGA |
3,980 |
|
Datasheet | SpiFlash® | 24-TBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | SPI - Quad I/O | 104 MHz | 700µs | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |
|
W66BQ6NBUAFJIC DRAM 2GBIT LVSTL 11 200WFBGA |
3,031 |
|
Datasheet | - | 200-WFBGA | Tray | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 128M x 16 | LVSTL_11 | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W66BP6NBUAFJIC DRAM 2GBIT LVSTL 11 200WFBGA |
1,525 |
|
Datasheet | - | 200-WFBGA | Tray | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | 128M x 16 | LVSTL_11 | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W971GG6KB25IIC DRAM 1GBIT PARALLEL 84WBGA |
4,860 |
|
Datasheet | - | 84-TFBGA | Tray | Obsolete | Not Verified | Volatile | DRAM | SDRAM - DDR2 | 1Gbit | 64M x 16 | Parallel | 200 MHz | 15ns | 57.5 ns | 1.7V ~ 1.9V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 84-WBGA (8x12.5) |
|
W979H6KBVX1EIC DRAM 512MBIT HSUL 12 134VFBGA |
1,922 |
|
Datasheet | - | 134-VFBGA | Tray | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4B | 512Mbit | 32M x 16 | HSUL_12 | 533 MHz | 15ns | - | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W979H6KBVX1IIC DRAM 512MBIT HSUL 12 134VFBGA |
2,145 |
|
Datasheet | - | 134-VFBGA | Tray | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4B | 512Mbit | 32M x 16 | HSUL_12 | 533 MHz | 15ns | - | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
|
W632GG6NB09I TRIC DRAM 2GBIT SSTL 15 96VFBGA |
4,244 |
|
Datasheet | - | 96-VFBGA | Tape & Reel (TR) | Last Time Buy | Not Verified | Volatile | DRAM | SDRAM - DDR3 | 2Gbit | 128M x 16 | SSTL_15 | 1.066 GHz | 15ns | 20 ns | 1.425V ~ 1.575V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 96-VFBGA (7.5x13) |
Frequently Asked Questions
What are Memory components used for?
Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Memory part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.