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FILTERED COMPONENT SELECTION

Memory

Review Memory Memory components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Programmable Memory Type Memory Format Technology Memory Size Memory Organization Memory Interface Clock Frequency Write Cycle Time - Word, Page Access Time Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
W35N01JWTBIG Winbond Electronics

W35N01JWTBIG

IC FLASH 1GBIT SPI/OCT 24TFBGA

Winbond Electronics

4,438
Datasheet - 24-TBGA Tray Active - Non-Volatile FLASH FLASH - NAND (SLC) 1Gbit 128M x 8 SPI - Octal I/O 166 MHz - - 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 24-TFBGA (8x6)
W35N01JWTBIT Winbond Electronics

W35N01JWTBIT

IC FLASH 1GBIT SPI/OCT 24TFBGA

Winbond Electronics

3,233
Datasheet - 24-TBGA Tray Active - Non-Volatile FLASH FLASH - NAND (SLC) 1Gbit 128M x 8 SPI - Octal I/O 166 MHz - - 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 24-TFBGA (8x6)
W979H2KBVX1I Winbond Electronics

W979H2KBVX1I

IC DRAM 512MBIT HSUL 12 134VFBGA

Winbond Electronics

2,493
Datasheet - 134-VFBGA Tray Not For New Designs Not Verified Volatile DRAM SDRAM - Mobile LPDDR2-S4B 512Mbit 16M x 32 HSUL_12 533 MHz 15ns - 1.14V ~ 1.3V, 1.7V ~ 1.95V -40°C ~ 85°C (TC) - - Surface Mount 134-VFBGA (10x11.5)
W979H2KBVX1E Winbond Electronics

W979H2KBVX1E

IC DRAM 512MBIT HSUL 12 134VFBGA

Winbond Electronics

1,766
Datasheet - 134-VFBGA Tray Not For New Designs Not Verified Volatile DRAM SDRAM - Mobile LPDDR2-S4B 512Mbit 16M x 32 HSUL_12 533 MHz 15ns - 1.14V ~ 1.3V, 1.7V ~ 1.95V -25°C ~ 85°C (TC) - - Surface Mount 134-VFBGA (10x11.5)
W25N02KWTBIU Winbond Electronics

W25N02KWTBIU

IC FLASH 2GBIT SPI/QUAD 24TFBGA

Winbond Electronics

2,839
Datasheet SpiFlash® 24-TBGA Tray Active Not Verified Non-Volatile FLASH FLASH - NAND (SLC) 2Gbit 256M x 8 SPI - Quad I/O 104 MHz 700µs 8 ns 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 24-TFBGA (8x6)
W25N02KWTBIR Winbond Electronics

W25N02KWTBIR

IC FLASH 2GBIT SPI/QUAD 24TFBGA

Winbond Electronics

2,151
Datasheet SpiFlash® 24-TBGA Tray Active Not Verified Non-Volatile FLASH FLASH - NAND (SLC) 2Gbit 256M x 8 SPI - Quad I/O 104 MHz 700µs 8 ns 1.7V ~ 1.95V -40°C ~ 85°C (TA) - - Surface Mount 24-TFBGA (8x6)
W632GU8QB09I Winbond Electronics

W632GU8QB09I

IC DRAM 2GBIT PAR 78VFBGA

Winbond Electronics

4,617
Datasheet - 78-VFBGA Tray Active - Volatile DRAM SDRAM - DDR3L 2Gbit 256M x 8 Parallel 1.067 GHz 15ns 20 ns 1.283V ~ 1.45V -40°C ~ 95°C (TC) - - Surface Mount 78-VFBGA (8x10.5)
W25N02KVZEIU Winbond Electronics

W25N02KVZEIU

IC FLASH 2GBIT SPI/QUAD 8WSON

Winbond Electronics

4,105
Datasheet SpiFlash® 8-WDFN Exposed Pad Tube Active Not Verified Non-Volatile FLASH FLASH - NAND (SLC) 2Gbit 256M x 8 SPI - Quad I/O 104 MHz 700µs 7 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 8-WSON (8x6)
W634GU8RB09I TR Winbond Electronics

W634GU8RB09I TR

IC DRAM 4GBIT PAR 78VFBGA

Winbond Electronics

4,374
Datasheet - 78-VFBGA Tape & Reel (TR) Active - Volatile DRAM SDRAM - DDR3L 4Gbit 512M x 8 Parallel 1.067 GHz 15ns 20 ns 1.283V ~ 1.45V -40°C ~ 95°C (TC) - - Surface Mount 78-VFBGA (8x10.5)
W63AH2NBVADE Winbond Electronics

W63AH2NBVADE

IC DRAM 1GBIT HSUL 12 178VFBGA

Winbond Electronics

2,828
Datasheet - 178-VFBGA Tray Active Not Verified Volatile DRAM SDRAM - Mobile LPDDR3 1Gbit 32M x 32 HSUL_12 1.066 GHz 15ns - 1.14V ~ 1.3V, 1.7V ~ 1.95V -25°C ~ 85°C (TC) - - Surface Mount 178-VFBGA (11x11.5)
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FAQ

Frequently Asked Questions

What are Memory components used for?

Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Memory part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

PART MATCHING & SOURCING

Need Help Narrowing Down the Right Memory Part?

Send your target specifications, preferred manufacturer, quantity or reference part number. Our team can help check matching options, availability and quotation details for your sourcing requirement.

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