System On Chip (SoC)

Review System On Chip (SoC) Embedded components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Package/Case	Packaging	Product Status	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Grade	Qualification	Supplier Device Package
M2S060TS-1FGG676 IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	2,375	197.01	RFQ	Datasheet	SmartFusion®2	676-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	0°C ~ 85°C (TJ)	-	-	676-FBGA (27x27)
M2S060TS-FG676I IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	3,097	197.01	RFQ	Datasheet	SmartFusion®2	676-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	-40°C ~ 100°C (TJ)	-	-	676-FBGA (27x27)
M2S060TS-FGG676I IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology	3,363	197.01	RFQ	Datasheet	SmartFusion®2	676-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	-40°C ~ 100°C (TJ)	-	-	676-FBGA (27x27)
M2S090T-1FCSG325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	2,522	197.21	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x13.5)
M2S090T-FCSG325I IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	1,524	197.21	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	-40°C ~ 100°C (TJ)	-	-	325-FCBGA (11x13.5)
M2S090TS-FCSG325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	3,054	197.21	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x13.5)
M2S090T-1FCS325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	1,696	197.21	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x13.5)
M2S090TS-FCS325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	2,320	197.21	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 90K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x13.5)
M2S050-1FG896I IC SOC CORTEX-M3 166MHZ 896FBGA Microchip Technology	2,898	202.26	RFQ	Datasheet	SmartFusion®2	896-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 50K Logic Modules	-40°C ~ 100°C (TJ)	-	-	896-FBGA (31x31)
M2S050-1FGG896I IC SOC CORTEX-M3 166MHZ 896FBGA Microchip Technology	2,575	202.26	RFQ	Datasheet	SmartFusion®2	896-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 50K Logic Modules	-40°C ~ 100°C (TJ)	-	-	896-FBGA (31x31)

FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.