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FILTERED COMPONENT SELECTION

System On Chip (SoC)

Review System On Chip (SoC) Embedded components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
M2S010-TQG144I Microchip Technology

M2S010-TQG144I

IC SOC CORTEX-M3 166MHZ 144TQFP

Microchip Technology

481
Datasheet SmartFusion®2 144-LQFP Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB - CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules -40°C ~ 100°C (TJ) - - 144-TQFP (20x20)
A2F200M3F-FGG256I Microchip Technology

A2F200M3F-FGG256I

IC SOC CORTEX-M3 80MHZ 256FBGA

Microchip Technology

434
Datasheet SmartFusion® 256-LBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DMA, POR, WDT EBI/EMI, Ethernet, I2C, SPI, UART/USART 80MHz ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M2S010TS-1VFG256I Microchip Technology

M2S010TS-1VFG256I

IC SOC CORTEX-M3 166MHZ 256FBGA

Microchip Technology

1,823
Datasheet SmartFusion®2 256-LBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 10K Logic Modules -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M2S025-FCSG325I Microchip Technology

M2S025-FCSG325I

IC SOC CORTEX-M3 166MHZ 325BGA

Microchip Technology

239
Datasheet SmartFusion®2 325-TFBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
A2F500M3G-1FGG484 Microchip Technology

A2F500M3G-1FGG484

IC SOC CORTEX-M3 100MHZ 484FBGA

Microchip Technology

180
Datasheet SmartFusion® 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DMA, POR, WDT EBI/EMI, Ethernet, I2C, SPI, UART/USART 100MHz ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A2F500M3G-FGG484I Microchip Technology

A2F500M3G-FGG484I

IC SOC CORTEX-M3 80MHZ 484FBGA

Microchip Technology

1,291
Datasheet SmartFusion® 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DMA, POR, WDT EBI/EMI, Ethernet, I2C, SPI, UART/USART 80MHz ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2S090T-FCS325I Microchip Technology

M2S090T-FCS325I

IC SOC CORTEX-M3 166MHZ 325BGA

Microchip Technology

441
Datasheet SmartFusion®2 325-TFBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 90K Logic Modules -40°C ~ 100°C (TJ) - - 325-FCBGA (11x13.5)
M2S090-FGG484I Microchip Technology

M2S090-FGG484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

123
Datasheet SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 90K Logic Modules -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2S090TS-1FG484I Microchip Technology

M2S090TS-1FG484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

4,813
Datasheet SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 90K Logic Modules -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2S150-FCVG484I Microchip Technology

M2S150-FCVG484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

2,423
Datasheet SmartFusion®2 484-BFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules -40°C ~ 100°C (TJ) - - 484-FBGA (19x19)
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FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

PART MATCHING & SOURCING

Need Help Narrowing Down the Right System On Chip (SoC) Part?

Send your target specifications, preferred manufacturer, quantity or reference part number. Our team can help check matching options, availability and quotation details for your sourcing requirement.

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