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FILTERED COMPONENT SELECTION

System On Chip (SoC)

Review System On Chip (SoC) Embedded components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
M2S090T-FCS325 Microchip Technology

M2S090T-FCS325

IC SOC CORTEX-M3 166MHZ 325BGA

Microchip Technology

3,361
Datasheet SmartFusion®2 325-TFBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 90K Logic Modules 0°C ~ 85°C (TJ) - - 325-FCBGA (11x13.5)
M2S090T-FCSG325 Microchip Technology

M2S090T-FCSG325

IC SOC CORTEX-M3 166MHZ 325BGA

Microchip Technology

2,352
Datasheet SmartFusion®2 325-TFBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 90K Logic Modules 0°C ~ 85°C (TJ) - - 325-FCBGA (11x13.5)
M2S060T-1FG676 Microchip Technology

M2S060T-1FG676

IC SOC CORTEX-M3 166MHZ 676FBGA

Microchip Technology

1,609
Datasheet SmartFusion®2 676-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 60K Logic Modules 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2S060T-FG676I Microchip Technology

M2S060T-FG676I

IC SOC CORTEX-M3 166MHZ 676FBGA

Microchip Technology

1,063
Datasheet SmartFusion®2 676-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 60K Logic Modules -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2S060T-FGG676I Microchip Technology

M2S060T-FGG676I

IC SOC CORTEX-M3 166MHZ 676FBGA

Microchip Technology

3,488
Datasheet SmartFusion®2 676-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 60K Logic Modules -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2S060TS-FG676 Microchip Technology

M2S060TS-FG676

IC SOC CORTEX-M3 166MHZ 676FBGA

Microchip Technology

1,251
Datasheet SmartFusion®2 676-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 60K Logic Modules 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2S060TS-FGG676 Microchip Technology

M2S060TS-FGG676

IC SOC CORTEX-M3 166MHZ 676FBGA

Microchip Technology

2,792
Datasheet SmartFusion®2 676-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 60K Logic Modules 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2S060T-1FGG676 Microchip Technology

M2S060T-1FGG676

IC SOC CORTEX-M3 166MHZ 676FBGA

Microchip Technology

1,207
Datasheet SmartFusion®2 676-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 60K Logic Modules 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2S050T-1FG484I Microchip Technology

M2S050T-1FG484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

4,660
Datasheet SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 50K Logic Modules -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2S050T-1FGG484I Microchip Technology

M2S050T-1FGG484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

2,681
Datasheet SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 50K Logic Modules -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
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FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

PART MATCHING & SOURCING

Need Help Narrowing Down the Right System On Chip (SoC) Part?

Send your target specifications, preferred manufacturer, quantity or reference part number. Our team can help check matching options, availability and quotation details for your sourcing requirement.

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