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FILTERED COMPONENT SELECTION

System On Chip (SoC)

Review System On Chip (SoC) Embedded components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
A2F500M3G-CS288 Microchip Technology

A2F500M3G-CS288

IC SOC CORTEX-M3 80MHZ 288CSP

Microchip Technology

4,079
Datasheet SmartFusion® 288-TFBGA, CSPBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DMA, POR, WDT EBI/EMI, Ethernet, I2C, SPI, UART/USART 80MHz ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 0°C ~ 85°C (TJ) - - 288-CSP (11x11)
A2F500M3G-FG256 Microchip Technology

A2F500M3G-FG256

IC SOC CORTEX-M3 80MHZ 256FBGA

Microchip Technology

1,982
Datasheet SmartFusion® 256-LBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DMA, POR, WDT EBI/EMI, Ethernet, I2C, SPI, UART/USART 80MHz ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M2S025T-FCS325 Microchip Technology

M2S025T-FCS325

IC SOC CORTEX-M3 166MHZ 325BGA

Microchip Technology

4,671
Datasheet SmartFusion®2 325-TFBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2S025T-FCSG325 Microchip Technology

M2S025T-FCSG325

IC SOC CORTEX-M3 166MHZ 325BGA

Microchip Technology

4,409
Datasheet SmartFusion®2 325-TFBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2S025-VF400 Microchip Technology

M2S025-VF400

IC SOC CORTEX-M3 166MHZ 400VFBGA

Microchip Technology

3,035
Datasheet SmartFusion®2 400-LFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)
M2S025-VF256 Microchip Technology

M2S025-VF256

IC SOC CORTEX-M3 166MHZ 256FBGA

Microchip Technology

4,949
Datasheet SmartFusion®2 256-LFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules 0°C ~ 85°C (TJ) - - 256-FPBGA (14x14)
M2S025-VFG256 Microchip Technology

M2S025-VFG256

IC SOC CORTEX-M3 166MHZ 256FBGA

Microchip Technology

2,640
Datasheet SmartFusion®2 256-LBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A2F200M3F-1FGG484I Microchip Technology

A2F200M3F-1FGG484I

IC SOC CORTEX-M3 100MHZ 484FBGA

Microchip Technology

1,351
Datasheet SmartFusion® 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DMA, POR, WDT EBI/EMI, Ethernet, I2C, SPI, UART/USART 100MHz ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A2F200M3F-1FG484I Microchip Technology

A2F200M3F-1FG484I

IC SOC CORTEX-M3 100MHZ 484FBGA

Microchip Technology

1,837
Datasheet SmartFusion® 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DMA, POR, WDT EBI/EMI, Ethernet, I2C, SPI, UART/USART 100MHz ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2S025-1FCS325 Microchip Technology

M2S025-1FCS325

IC SOC CORTEX-M3 166MHZ 325BGA

Microchip Technology

4,132
Datasheet SmartFusion®2 325-TFBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
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FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

PART MATCHING & SOURCING

Need Help Narrowing Down the Right System On Chip (SoC) Part?

Send your target specifications, preferred manufacturer, quantity or reference part number. Our team can help check matching options, availability and quotation details for your sourcing requirement.

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