System On Chip (SoC)
Review System On Chip (SoC) Embedded components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.
If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
M2S005-FGG484IIC SOC CORTEX-M3 166MHZ 484FBGA |
131 |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 64KB | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 484-FPBGA (23x23) |
|
M2S010-TQG144IC SOC CORTEX-M3 166MHZ 144TQFP |
106 |
|
Datasheet | SmartFusion®2 | 144-LQFP | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 10K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 144-TQFP (20x20) |
|
M2S025-VFG400IC SOC CORTEX-M3 166MHZ 400VFBGA |
4,710 |
|
Datasheet | SmartFusion®2 | 400-LFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 400-VFBGA (17x17) |
|
M2S025-FGG484IIC SOC CORTEX-M3 166MHZ 484FBGA |
149 |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 484-FPBGA (23x23) |
|
M2S060-FCSG325IIC SOC CORTEX-M3 166MHZ 325BGA |
814 |
|
Datasheet | SmartFusion®2 | 325-TFBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 325-FCBGA (11x11) |
|
M2S050T-FGG484IIC SOC CORTEX-M3 166MHZ 484FBGA |
1,124 |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 50K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 484-FPBGA (23x23) |
|
M2S050T-FGG896IC SOC CORTEX-M3 166MHZ 896FBGA |
4,901 |
|
Datasheet | SmartFusion®2 | 896-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 50K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 896-FBGA (31x31) |
|
MPFS250T-FCVG484EIC SOC RISC-V 484FCBGA |
1,233 |
|
Datasheet | PolarFire® | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | 0°C ~ 100°C | - | - | 484-FCBGA (19x19) |
|
MPFS250T-1FCVG484EIC SOC RISC-V 484FCBGA |
2,671 |
|
Datasheet | PolarFire® | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | 0°C ~ 100°C | - | - | 484-FCBGA (19x19) |
|
MPFS250T-FCG1152EIC SOC RISC-V 1152FCBGA |
2,883 |
|
Datasheet | PolarFire® | 1152-BBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | 0°C ~ 100°C | - | - | 1152-FCBGA (35x35) |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.