System On Chip (SoC)
Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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XCZU1CG-1SBVA484IIC ZUP MPSOC CG A53 FPGA 484BGA |
3,886 |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 500MHz, 1.2GHz | - | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
|
5CSEMA5F31I7NIC SOC CORTEX-A9 800MHZ 896FBGA |
3,860 |
|
Datasheet | Cyclone® V SE | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 85K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 896-FBGA (31x31) |
|
XC7Z030-1FBG484IIC SOC CORTEX-A9 667MHZ 484FCBGA |
3,208 |
|
Datasheet | Zynq®-7000 | 484-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (23x23) |
|
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XCZU2EG-L1SBVA484IIC SOC CORTEX-A53 484FCBGA |
1,399 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 484-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
|
MPFS250TS-1FCG1152IIC SOC RISC-V 1152FCBGA |
3,592 |
|
Datasheet | PolarFire® | 1152-BBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 100°C | - | - | 1152-FCBGA (35x35) |
|
SOM-2532DCBX-U0A1SBC 2.0GHZ 4 CORE 0GB/16GB RAM |
3,018 |
|
Datasheet | SMARC | Module | Bulk | Active | MPU | Intel® Atom® x6425E | 32GB | 16GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 2GHz | - | -40°C ~ 85°C | - | - | - |
|
XC7Z100-2FFG1156IIC SOC CORTEX-A9 800MHZ 1156BGA |
3,737 |
|
Datasheet | Zynq®-7000 | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 444K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
|
XCZU9EG-2FFVB1156EIC SOC CORTEX-A53 1156FCBGA |
3,255 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
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M2S010-VFG400IC SOC CORTEX-M3 166MHZ 400VFBGA |
3,364 |
|
Datasheet | SmartFusion®2 | 400-LFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 10K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 400-VFBGA (17x17) |
|
XC7Z014S-1CLG484CIC SOC CORTEX-A9 667MHZ 484BGA |
4,028 |
|
Datasheet | Zynq®-7000 | 484-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix™-7 FPGA, 65K Logic Cells | 0°C ~ 85°C (TJ) | - | - | 484-CSPBGA (19x19) |
|
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5CSEMA5F31C8NIC SOC CORTEX-A9 600MHZ 896FBGA |
1,045 |
|
Datasheet | Cyclone® V SE | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz | FPGA - 85K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 896-FBGA (31x31) |
|
5CSEBA6U23C7NIC SOC CORTEX-A9 800MHZ 672UBGA |
4,358 |
|
Datasheet | Cyclone® V SE | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 672-UBGA (23x23) |
|
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5CSEMA5F31C6NIC SOC CORTEX-A9 925MHZ 896FBGA |
1,351 |
|
Datasheet | Cyclone® V SE | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 85K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 896-FBGA (31x31) |
|
XCZU1CG-1SFVA625IIC ZUP MPSOC CG A53 FPGA 635BGA |
4,047 |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 625-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 500MHz, 1.2GHz | - | -40°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
|
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5CSXFC5C6U23I7NIC SOC CORTEX-A9 800MHZ 672UBGA |
3,032 |
|
Datasheet | Cyclone® V SX | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 85K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 672-UBGA (23x23) |
|
XCZU2CG-2UBVA530EIC SOC CORTEX-A53 530BGA |
4,755 |
|
Datasheet | - | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
|
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XCZU2EG-1UBVA530IIC SOC CORTEX-A53 530BGA |
1,720 |
|
Datasheet | - | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
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MPFS250T-FCVG784EIC SOC RISC-V 784FCBGA |
2,395 |
|
Datasheet | PolarFire® | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | 0°C ~ 100°C | - | - | 784-FCBGA (23x23) |
|
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XCZU2CG-2UBVA530IIC SOC CORTEX-A53 530BGA |
1,336 |
|
Datasheet | - | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
|
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5CSTFD5D5F31I7NIC SOC CORTEX-A9 800MHZ 896FBGA |
4,299 |
|
Datasheet | Cyclone® V ST | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 85K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 896-FBGA (31x31) |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
