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System On Chip (SoC)

Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
5CSXFC6C6U23C6N Intel

5CSXFC6C6U23C6N

IC SOC CORTEX-A9 925MHZ 672UBGA

Intel

2,089
Datasheet Cyclone® V SX 672-FBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 64KB DMA, POR, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 925MHz FPGA - 110K Logic Elements 0°C ~ 85°C (TJ) - - 672-UBGA (23x23)
5CSXFC6C6U23I7NTS Intel

5CSXFC6C6U23I7NTS

IC SOC CORTEX-A9 925MHZ 672UBGA

Intel

4,514
Datasheet Cyclone® V SX 672-FBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 64KB DMA, POR, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 925MHz FPGA - 110K Logic Elements -40°C ~ 100°C (TJ) - - 672-UBGA (23x23)
88MW322-A0-NXUE/AZ NXP Semiconductors

88MW322-A0-NXUE/AZ

88MW322 - 88MW32X 802.11n Wi-Fi

NXP Semiconductors

9,970
Datasheet - 88-VFQFN Exposed Pad Bulk Active MPU ARM® Cortex®-M4F - 512kB DMA, PWM I2C, SPI, SSP, UART 200MHz - -30°C ~ 85°C - - 88-QFN (10x10)
TA7S04-60QC Triscend

TA7S04-60QC

RISC MICROPROCESSOR, 32-BIT, 60M

Triscend

214
Datasheet * - Bulk Active - - - - - - - - - - - -
TA7S20-60GC Triscend

TA7S20-60GC

RISC MICROPROCESSOR, 32-BIT, 60M

Triscend

106
Datasheet * - Bulk Active - - - - - - - - - - - -
UPD63F810GM(A)-8EV-A Renesas

UPD63F810GM(A)-8EV-A

UPD63F810GM - CD TUNER IC

Renesas

198
Datasheet * - Bulk Active - - - - - - - - - - - -
MSC7104ZQF Freescale Semiconductor - NXP

MSC7104ZQF

MSC7104 - INTEGRATED GPON OPTICA

Freescale Semiconductor - NXP

1,560
Datasheet - 456-BBGA Bulk Obsolete MPU PowerPC e300 - - DDR2, JTAG Ethernet, I2C, SPI, UART/USART 266MHz - - - - 456-PBGA (35x35)
5CSXFC6C6U23C8N Intel

5CSXFC6C6U23C8N

IC SOC CORTEX-A9 600MHZ 672UBGA

Intel

4,226
Datasheet Cyclone® V SX 672-FBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 64KB DMA, POR, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz FPGA - 110K Logic Elements 0°C ~ 85°C (TJ) - - 672-UBGA (23x23)
XC7Z030-1FBG676I AMD

XC7Z030-1FBG676I

IC SOC CORTEX-A9 667MHZ 676FCBGA

AMD

3,344
Datasheet Zynq®-7000 676-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Kintex™-7 FPGA, 125K Logic Cells -40°C ~ 100°C (TJ) - - 676-FCBGA (27x27)
XC7Z030-2SBG485I AMD

XC7Z030-2SBG485I

IC SOC CORTEX-A9 800MHZ 485FCBGA

AMD

2,785
Datasheet Zynq®-7000 484-FBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 800MHz Kintex™-7 FPGA, 125K Logic Cells -40°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
XC7Z030-1FFG676I AMD

XC7Z030-1FFG676I

IC SOC CORTEX-A9 667MHZ 676FCBGA

AMD

2,001
Datasheet Zynq®-7000 676-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Kintex™-7 FPGA, 125K Logic Cells -40°C ~ 100°C (TJ) - - 676-FCBGA (27x27)
5CSXFC6D6F31C6N Intel

5CSXFC6D6F31C6N

IC SOC CORTEX-A9 925MHZ 896FBGA

Intel

1,281
Datasheet Cyclone® V SX 896-BGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ - 64KB DMA, POR, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 925MHz FPGA - 110K Logic Elements 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
MPFS250T-FCG1152I Microchip Technology

MPFS250T-FCG1152I

IC SOC RISC-V 1152FCBGA

Microchip Technology

2,615
Datasheet PolarFire® 1152-BBGA, FCBGA Tray Active MPU, FPGA RISC-V 128kB 2.2MB DMA, PCI, PWM CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG - FPGA - 254K Logic Modules -40°C ~ 100°C - - 1152-FCBGA (35x35)
MPFS250TS-FCG1152I Microchip Technology

MPFS250TS-FCG1152I

IC SOC RISC-V 1152FCBGA

Microchip Technology

2,103
Datasheet PolarFire® 1152-BBGA, FCBGA Tray Active MPU, FPGA RISC-V 128kB 2.2MB DMA, PCI, PWM CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG - FPGA - 254K Logic Modules -40°C ~ 100°C - - 1152-FCBGA (35x35)
XCZU3EG-1SFVC784I AMD

XCZU3EG-1SFVC784I

IC SOC CORTEX-A53 784FCBGA

AMD

3,112
Datasheet Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells -40°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XCZU9EG-2FFVB1156I AMD

XCZU9EG-2FFVB1156I

IC SOC CORTEX-A53 1156FCBGA

AMD

2,860
Datasheet Zynq® UltraScale+™ MPSoC EG 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 599K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
M2S005-VFG400I Microchip Technology

M2S005-VFG400I

IC SOC CORTEX-M3 166MHZ 400VFBGA

Microchip Technology

2,688
Datasheet SmartFusion®2 400-LFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 128KB 64KB DDR CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 5K Logic Modules -40°C ~ 100°C (TJ) - - 400-VFBGA (17x17)
MIMX9352XVVXMAB NXP USA Inc.

MIMX9352XVVXMAB

MIMX9352XVVXMAB

NXP USA Inc.

3,897
Datasheet - 306-LFBGA Tray Active - - - - - - - - - - - 306-LFBGA (11x11)
MPFS025T-FCSG325I Microchip Technology

MPFS025T-FCSG325I

IC SOC RISC-V 325BGA

Microchip Technology

3,210
Datasheet PolarFire® 325-TFBGA Tray Active MPU, FPGA RISC-V 128KB 230.4KB DMA, PCI, PWM CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG - FPGA - 23K Logic Modules -40°C ~ 100°C - - 325-BGA (11x11)
M2S025-FGG484 Microchip Technology

M2S025-FGG484

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

3,253
Datasheet SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 25K Logic Modules 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
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FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

BOM & COMPONENT SOURCING

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