JIEXIN Electronics — Your one-stop global supplier of chips and electronic components.
ELECTRONIC COMPONENTS

RFI and EMI - Contacts, Fingerstock and Gaskets

Explore RFI and EMI - Contacts, Fingerstock and Gaskets parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
3020802 Würth Elektronik

3020802

RFI FOF GASKET PU ADH

Würth Elektronik

4,137
Datasheet WE-LT Tray Active Fabric Over Foam Rectangle 0.315" (8.00mm) 39.370" (1.00m) 0.079" (2.00mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive -40°C ~ 85°C
3021001 Würth Elektronik

3021001

RFI FOF GASKET PU ADH

Würth Elektronik

3,235
Datasheet WE-LT Tray Active Fabric Over Foam Rectangle 0.394" (10.00mm) 39.370" (1.00m) 0.039" (1.00mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive -40°C ~ 85°C
77-12-3150-02400 Parker Chomerics

77-12-3150-02400

RFI FOF GASKET NI/CU ADH

Parker Chomerics

1,165
Datasheet SOFT-SHIELD® 3500 Box Active Fabric Over Foam Square 0.375" (9.53mm) 24.000" (609.60mm) 0.375" (9.53mm) Nickel-Copper over Urethane Foam - - Adhesive -40°C ~ 70°C
3020505 Würth Elektronik

3020505

RFI FOF GASKET PU ADH

Würth Elektronik

4,411
Datasheet WE-LT Tray Active Fabric Over Foam Square 0.197" (5.00mm) 39.370" (1.00m) 0.197" (5.00mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive -40°C ~ 85°C
0077005602 Laird Technologies EMI

0077005602

RFI FINGERSTOCK BECU NICKEL SLOT

Laird Technologies EMI

1,562
Datasheet Variable Slot Mount Box Active Fingerstock - 0.320" (8.13mm) 15.984" (406.00mm) 0.110" (2.79mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Slot 121°C
3021005 Würth Elektronik

3021005

RFI FOF GASKET PU ADH

Würth Elektronik

4,920
Datasheet WE-LT Bag Active Fabric Over Foam Rectangle 0.394" (10.00mm) 39.370" (1.00m) 0.197" (5.00mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive -40°C ~ 85°C
3021010 Würth Elektronik

3021010

RFI FOF GASKET PU ADH

Würth Elektronik

1,578
Datasheet WE-LT Bulk Active Fabric Over Foam Rectangle 0.394" (10.00mm) 39.370" (1.00m) 0.394" (10.00mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive -40°C ~ 85°C
37-131-1011-02400 Parker Chomerics

37-131-1011-02400

RFI FOF GASKET NI/CU NICKEL ADH

Parker Chomerics

2,204
Datasheet SOFT-SHIELD® 3700 Bulk Active Fabric Over Foam Rectangle 0.197" (5.00mm) 24.000" (609.60mm) 0.075" (1.91mm) Nickel-Copper Polyester (NI/CU) Nickel - Adhesive -40°C ~ 125°C
3022010 Würth Elektronik

3022010

RFI FOF GASKET PU ADH

Würth Elektronik

1,285
Datasheet WE-LT Tray Active Fabric Over Foam Rectangle 0.787" (20.00mm) 39.370" (1.00m) 0.394" (10.00mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive -40°C ~ 85°C
0097097502 Laird Technologies EMI

0097097502

RFI FINGERSTOCK BECU HARDWARE

Laird Technologies EMI

2,813
Datasheet Longitudinal Grounding Bulk Active Fingerstock - 0.800" (20.32mm) 18.750" (476.25mm) 0.300" (7.62mm) Beryllium Copper - - Hardware 121°C
30213064 Würth Elektronik

30213064

RFI GASKET PU ADH

Würth Elektronik

2,852
Datasheet WE-LT Bulk Active Gasket Rectangle 0.500" (12.70mm) 3.28' (1.00m) 0.252" (6.40mm) Polyurethane Foam, Rayon Paper - - Adhesive -40°C ~ 85°C
0097063602 Laird Technologies EMI

0097063602

RFI FINGERSTOCK BECU NICKEL CLIP

Laird Technologies EMI

1,210
Datasheet Clip-On Symmetrical Box Active Fingerstock - 0.357" (9.07mm) 16.535" (420.00mm) 0.174" (4.42mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Clip 121°C
0097061302 Laird Technologies EMI

0097061302

RFI FINGERSTOCK BECU NICKEL CLIP

Laird Technologies EMI

4,613
Datasheet Clip-On Box Active Fingerstock - 0.300" (7.62mm) 15.984" (406.00mm) 0.100" (2.54mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Clip 121°C
4600PAH1K01800 Laird Technologies EMI

4600PAH1K01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

2,433
Datasheet Sculpted Foam UL94 Bulk Active Fabric Over Foam C-Fold 0.449" (11.40mm) 18.000" (457.20mm) 0.413" (10.50mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
0097060502 Laird Technologies EMI

0097060502

RFI FINGERSTOCK BECU CLIP

Laird Technologies EMI

1,329
Datasheet Clip-On Box Active Fingerstock - 0.380" (9.65mm) 16.000" (406.40mm) 0.270" (6.86mm) Beryllium Copper - - Clip 121°C
4060PA51G01800 Laird Technologies EMI

4060PA51G01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

2,345
Datasheet 51G Bulk Active Fabric Over Foam D-Shape 0.500" (12.70mm) 18.000" (457.20mm) 0.500" (12.70mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive -
0097053702 Laird Technologies EMI

0097053702

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

2,738
Datasheet All-Purpose Bulk Active Fingerstock - 1.130" (28.70mm) 12.008" (305.00mm) 0.410" (10.41mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Adhesive 121°C
0097052002 Laird Technologies EMI

0097052002

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

4,364
Datasheet All-Purpose Bulk Active Fingerstock - 0.370" (9.40mm) 15.984" (406.00mm) 0.140" (3.56mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Adhesive 121°C
4694AB51K09600 Laird Technologies EMI

4694AB51K09600

RFI FOF GASKET PU

Laird Technologies EMI

1,657
Datasheet 51K Bulk Active Fabric Over Foam Rectangle 0.500" (12.70mm) 96.000" (2.44m) 0.126" (3.20mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - - -
4850-12-1212-0200 Parker Chomerics

4850-12-1212-0200

RFI COND FOAM CU SILVER ADH

Parker Chomerics

3,073
Datasheet SOFT-SHIELD® 4850 Bulk Active Conductive Foam Sheet 12.000" (304.80mm) 12.000" (304.80mm) 0.079" (2.00mm) Copper Silver - Adhesive -40°C ~ 70°C
Total 4130 Record«Prev1... 6263646566676869...207Next»
FAQ

Frequently Asked Questions

What are RFI and EMI - Contacts, Fingerstock and Gaskets components used for?

RFI and EMI - Contacts, Fingerstock and Gaskets components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right RFI and EMI - Contacts, Fingerstock and Gaskets part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find RFI and EMI - Contacts, Fingerstock and Gaskets parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

BOM & COMPONENT SOURCING

Need Pricing or Stock Support for RFI and EMI - Contacts, Fingerstock and Gaskets?

Submit your required part numbers, manufacturers and quantities to receive stock availability, pricing, lead-time and sourcing support. Our team assists with active components, shortage parts, obsolete models and one-stop BOM procurement.

BOM BOM Phone +86-138 0989 9356 Email info@jx-icsource.com Cart Shopping Cart Account My Account Back To Top