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RFI and EMI - Contacts, Fingerstock and Gaskets

Explore RFI and EMI - Contacts, Fingerstock and Gaskets parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
3021305 Würth Elektronik

3021305

RFI FOF GASKET PU ADH

Würth Elektronik

3,707
Datasheet WE-LT Bag Active Fabric Over Foam Rectangle 0.512" (13.00mm) 39.370" (1.00m) 0.197" (5.00mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive -40°C ~ 85°C
4105PA51H01800 Laird Technologies EMI

4105PA51H01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

1,496
Datasheet 51H Bulk Active Fabric Over Foam D-Shape 0.500" (12.70mm) 18.000" (457.20mm) 0.374" (9.50mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
SG020157R-48.00 Leader Tech Inc.

SG020157R-48.00

RFI FOF GASKET

Leader Tech Inc.

3,453
Datasheet - Bulk Active Fabric Over Foam Rectangle 0.157" (3.99mm) 4.00' (1.22m) 0.020" (0.51mm) - - - - -
0077004302 Laird Technologies EMI

0077004302

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

3,386
Datasheet Low Profile Box Active Fingerstock - 0.450" (11.43mm) 15.984" (406.00mm) 0.080" (2.03mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Adhesive 121°C
0C97054202 Laird Technologies EMI

0C97054202

RFI FINGERSTOCK BECU UNPLAT ADH

Laird Technologies EMI

2,378
Datasheet Foldover Bulk Active Fingerstock - 0.250" (6.35mm) 12.000" (304.80mm) 0.080" (2.03mm) Beryllium Copper Unplated - Adhesive 121°C
3021717 Würth Elektronik

3021717

RFI FOF GASKET PU ADH

Würth Elektronik

1,006
Datasheet WE-LT Bag Active Fabric Over Foam Square 0.669" (17.00mm) 39.370" (1.00m) 0.669" (17.00mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive -40°C ~ 85°C
0C97055002 Laird Technologies EMI

0C97055002

RFI FINGERSTOCK BECU ADH 25FT

Laird Technologies EMI

1,392
Datasheet Twist Strip Active Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper Unplated - Adhesive 121°C
5401-0001-40-300 Leader Tech Inc.

5401-0001-40-300

RFI GASKET SILV

Leader Tech Inc.

4,240
Datasheet 5401 Bulk Active Gasket Round 0.040" (1.02mm) 25.00' (7.60m) - Silver/Aluminum Fluorosilicone Elastomer - - - -55°C ~ 160°C
3029050030050 Würth Elektronik

3029050030050

RFI GASKET SOLDER

Würth Elektronik

582
Datasheet WE-SMGS Tape & Reel (TR) Active Gasket Rectangle 0.118" (3.00mm) 0.197" (5.00mm) 0.197" (5.00mm) - - - Solder -20°C ~ 90°C
S7231-45R Harwin Inc.

S7231-45R

RFI SHLD FINGER CU GOLD SOLDER

Harwin Inc.

3,351
Datasheet EZ BoardWare Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.039" (1.00mm) 0.098" (2.50mm) 0.050" (1.28mm) Copper Alloy Gold Flash Solder -40°C ~ 85°C
331171302030 Würth Elektronik

331171302030

RFI SHLD FINGER BECU GOLD SOLDER

Würth Elektronik

303
Datasheet WE-SECF Tape & Reel (TR) Active Shield Finger - 0.079" (2.00mm) 0.118" (3.00mm) 0.118" (3.00mm) Beryllium Copper Gold Flash Solder -40°C ~ 100°C
3029060080100 Würth Elektronik

3029060080100

RFI GASKET SOLDER

Würth Elektronik

432
Datasheet WE-SMGS Tape & Reel (TR) Active Gasket Rectangle 0.315" (8.00mm) 0.236" (6.00mm) 0.394" (10.00mm) - - - Solder -20°C ~ 90°C
30205005 Würth Elektronik

30205005

RFI FOF GASKET PU ADH

Würth Elektronik

2,730
Datasheet WE-LT Bag Active Fabric Over Foam Rectangle 0.197" (5.00mm) 39.370" (1.00m) 0.020" (0.50mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive -40°C ~ 85°C
4912PA51H01800 Laird Technologies EMI

4912PA51H01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

4,238
Datasheet 51H Bulk Active Fabric Over Foam D-Shape 0.150" (3.80mm) 18.000" (457.20mm) 0.091" (2.30mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
30504 Würth Elektronik

30504

RFI GASKET SLV NI/CU

Würth Elektronik

1,650
Datasheet WE-ST Bag Active Gasket Sleeve - 0.157" (4.00mm) 39.370" (1.00m) - Nickel-Copper (NI/CU) Glass Fiber - - - -60°C ~ 160°C
3021002 Würth Elektronik

3021002

RFI FOF GASKET PU ADH

Würth Elektronik

3,018
Datasheet WE-LT Bag Active Fabric Over Foam Rectangle 0.394" (10.00mm) 39.370" (1.00m) 0.079" (2.00mm) Polyurethane Foam, Rayon Paper - - Non-Conductive Adhesive -40°C ~ 85°C
4228PA51H01800 Laird Technologies EMI

4228PA51H01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

1,654
Datasheet 51H Bulk Active Fabric Over Foam D-Shape 0.150" (3.80mm) 18.000" (457.20mm) 0.150" (3.80mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
4548PA51H01800 Laird Technologies EMI

4548PA51H01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

3,301
Datasheet 51H Bulk Active Fabric Over Foam D-Shape 0.252" (6.40mm) 18.000" (457.20mm) 0.059" (1.50mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
38205603 Würth Elektronik

38205603

RFI GASKET PU ADH

Würth Elektronik

3,246
Datasheet WE-LT Bulk Active Gasket Rectangle 0.220" (5.60mm) 3.28' (1.00m) 0.118" (3.00mm) Polyurethane Foam, Rayon Paper - - Adhesive -40°C ~ 85°C
4522PA51H01800 Laird Technologies EMI

4522PA51H01800

RFI FOF GASKET PU ADH

Laird Technologies EMI

3,434
Datasheet 51H Bulk Active Fabric Over Foam Square 0.157" (4.00mm) 18.000" (457.20mm) 0.157" (4.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
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What are RFI and EMI - Contacts, Fingerstock and Gaskets components used for?

RFI and EMI - Contacts, Fingerstock and Gaskets components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

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