RFI and EMI - Contacts, Fingerstock and Gaskets
Review RFI and EMI - Contacts, Fingerstock and Gaskets RF and Wireless components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.
If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Shape | Width | Length | Height | Material | Plating | Plating - Thickness | Attachment Method | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
97078002DCON 25P BF |
2,460 |
|
Datasheet | * | Bulk | Active | - | - | - | - | - | - | - | - | - | - |
|
|
0097078002RFI FINGERSTOCK BECU UNPLAT SLOT |
2,728 |
|
Datasheet | - | Bulk | Active | Fingerstock | - | 0.690" (17.53mm) | 2.280" (57.91mm) | 0.025" (0.64mm) | Beryllium Copper | Unplated | - | Slot | 121°C |
|
|
4570AQ01L09600GK,NICU,NRSG,NF,V0,REC .015X.200 |
1,259 |
|
Datasheet | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - |
|
|
0077001219RFI FINGERSTOCK BECU NICKEL ADH |
1,109 |
|
Datasheet | No Snag | Bulk | Active | Fingerstock | - | 0.320" (8.13mm) | 24.000" (609.60mm) | 0.110" (2.79mm) | Beryllium Copper | Nickel | 299.21µin (7.60µm) | Adhesive | 121°C |
|
|
4078PAX1R03937RFI FOF GASKET PU ADH |
4,772 |
|
Datasheet | EcoTemp™ 85 X1R | Bulk | Active | Fabric Over Foam | D-Shape | 0.360" (9.14mm) | 39.370" (1.00m) | 0.120" (3.05mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | -40°C ~ 85°C |
|
|
8866-0130-72DSTRHOL,CUSTMATL 2.54X2.39X1.00X |
3,534 |
|
Datasheet | Electroseal™ EcE72 | Bulk | Active | - | - | - | - | - | - | - | - | - | - |
|
|
4123PAX1R03937RFI FOF GASKET PU ADH |
2,353 |
|
Datasheet | EcoTemp™ 85 X1R | Bulk | Active | Fabric Over Foam | D-Shape | 0.354" (8.99mm) | 39.370" (1.00m) | 0.150" (3.80mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | -40°C ~ 85°C |
|
|
4181PAX1R03937RFI FOF GASKET PU ADH |
4,165 |
|
Datasheet | EcoTemp™ 85 X1R | Bulk | Active | Fabric Over Foam | D-Shape | 0.394" (10.01mm) | 39.370" (1.00m) | 0.080" (2.03mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | -40°C ~ 85°C |
|
|
4208PAX1R03937RFI FOF GASKET PU ADH |
4,764 |
|
Datasheet | EcoTemp™ 85 X1R | Bulk | Active | Fabric Over Foam | Rectangle | 0.395" (10.03mm) | 39.370" (1.00m) | 0.040" (1.02mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | -40°C ~ 85°C |
|
|
0C97054102RFI FINGERSTOCK BECU UNPLAT ADH |
4,339 |
|
Datasheet | Foldover | Bulk | Active | Fingerstock | - | 0.380" (9.65mm) | 16.000" (406.40mm) | 0.120" (3.05mm) | Beryllium Copper | Unplated | - | Adhesive | 121°C |
Frequently Asked Questions
What are RFI and EMI - Contacts, Fingerstock and Gaskets components used for?
RFI and EMI - Contacts, Fingerstock and Gaskets components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right RFI and EMI - Contacts, Fingerstock and Gaskets part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find RFI and EMI - Contacts, Fingerstock and Gaskets parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
