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FILTERED COMPONENT SELECTION

Thermal Management

Review Thermal Management Power Management (PMIC) components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Function Sensor Type Sensing Temperature Accuracy Topology Output Type Output Alarm Output Fan Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
SE98ATP,547 NXP USA Inc.

SE98ATP,547

IC TEMP SENSOR DDR 8-HWSON

NXP USA Inc.

37,770
Datasheet - 8-WFDFN Exposed Pad Tape & Reel (TR) Active Temp Monitoring System (Sensor) Internal -40°C ~ 125°C ±4°C(Max) ADC (Sigma Delta), Register Bank I2C/SMBus Yes Yes 1.7V ~ 3.6V -40°C ~ 125°C - - Surface Mount 8-HWSON (2x3)
SE97BTP,547 NXP USA Inc.

SE97BTP,547

IC TEMP SENSOR DIMM 8HWSON

NXP USA Inc.

104,389
Datasheet - 8-WFDFN Exposed Pad Tape & Reel (TR) Active Temp Monitoring System (Sensor), DIMM DDR Memory Internal -40°C ~ 125°C ±3°C(Max) ADC (Sigma Delta), Comparator, Register Bank I2C/SMBus Yes Yes 3V ~ 3.6V -40°C ~ 125°C - - Surface Mount 8-HWSON (2x3)
SE98APW,118 NXP USA Inc.

SE98APW,118

IC TEMP SENSOR DDR 8-TSSOP

NXP USA Inc.

3,375
Datasheet - 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Tape & Reel (TR) Obsolete Temp Monitoring System (Sensor) Internal -40°C ~ 125°C ±4°C(Max) ADC (Sigma Delta), Register Bank I2C/SMBus Yes Yes 1.7V ~ 3.6V -40°C ~ 125°C - - Surface Mount 8-TSSOP
SE97TP/S900,547 NXP USA Inc.

SE97TP/S900,547

IC TEMP SENSOR DIMM 3.3V 8-HWSON

NXP USA Inc.

4,143
Datasheet - 8-WFDFN Exposed Pad Tape & Reel (TR) Obsolete Temp Monitoring System (Sensor), DIMM DDR Memory Internal -40°C ~ 125°C ±3°C ADC (Sigma Delta), Comparator, Register Bank 2-Wire Serial, I2C/SMBUS Yes Yes 3V ~ 3.6V -40°C ~ 125°C - - Surface Mount 8-HWSON (2x3)
SE98ATP,147 NXP USA Inc.

SE98ATP,147

IC TEMPERATURE SENSOR DDR 8HWSON

NXP USA Inc.

2,744
Datasheet - 8-WFDFN Exposed Pad Tape & Reel (TR) Obsolete Temp Monitoring System (Sensor) Internal -40°C ~ 125°C ±4°C(Max) ADC (Sigma Delta), Register Bank I2C/SMBus Yes Yes 1.7V ~ 3.6V -40°C ~ 125°C - - Surface Mount 8-HWSON (2x3)
SE97TP,128 NXP USA Inc.

SE97TP,128

IC TEMP SENSOR DIMM 3.3V 8-HWSON

NXP USA Inc.

3,269
Datasheet - 8-WFDFN Exposed Pad Tape & Reel (TR) Obsolete Temp Monitoring System (Sensor), DIMM DDR Memory Internal -40°C ~ 125°C ±3°C ADC (Sigma Delta), Comparator, Register Bank 2-Wire Serial, I2C/SMBUS Yes Yes 3V ~ 3.6V -40°C ~ 125°C - - Surface Mount 8-HWSON (2x3)
NE1619DS,112 NXP USA Inc.

NE1619DS,112

IC TEMP MONITOR 16SSOP

NXP USA Inc.

1,413
Datasheet - 16-SSOP (0.154", 3.90mm Width) Tube Obsolete Temp Monitoring System (Sensor) Internal and External 0°C ~ 125°C, External Sensor ±3°C Local(Max), ±5°C Remote(Max) ADC, Multiplexer, Register Bank SMBus Yes No 2.8V ~ 5.5V 0°C ~ 125°C - - Surface Mount 16-SSOP
SE97TP,147 NXP USA Inc.

SE97TP,147

IC TEMP SENSOR DIMM 3.3V 8-HWSON

NXP USA Inc.

4,692
Datasheet - 8-WFDFN Exposed Pad Tape & Reel (TR) Obsolete Temp Monitoring System (Sensor), DIMM DDR Memory Internal -40°C ~ 125°C ±3°C ADC (Sigma Delta), Comparator, Register Bank 2-Wire Serial, I2C/SMBUS Yes Yes 3V ~ 3.6V -40°C ~ 125°C - - Surface Mount 8-HWSON (2x3)
SE98ATL,147 NXP USA Inc.

SE98ATL,147

IC TEMP SENSOR DDR 3.6V 8-HXSON

NXP USA Inc.

1,388
Datasheet - 8-XFDFN Exposed Pad Cut Tape (CT) Obsolete Temp Monitoring System (Sensor) Internal -40°C ~ 125°C ±4°C(Max) ADC (Sigma Delta), Register Bank I2C/SMBus Yes Yes 1.7V ~ 3.6V -40°C ~ 125°C - - Surface Mount 8-HXSON (2x3)
SE97TL,147 NXP USA Inc.

SE97TL,147

IC TEMP SENSOR DDR 3.3V 8-HXSON

NXP USA Inc.

4,190
Datasheet - 8-XFDFN Exposed Pad Tape & Reel (TR) Obsolete Temp Monitoring System (Sensor), DIMM DDR Memory Internal -40°C ~ 125°C ±3°C(Max) ADC (Sigma Delta), Comparator, Register Bank I2C/SMBus Yes Yes 3V ~ 3.6V -40°C ~ 125°C - - Surface Mount 8-HXSON (2x3)
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FAQ

Frequently Asked Questions

What are Thermal Management components used for?

Thermal Management components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Thermal Management part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Thermal Management parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

PART MATCHING & SOURCING

Need Help Narrowing Down the Right Thermal Management Part?

Send your target specifications, preferred manufacturer, quantity or reference part number. Our team can help check matching options, availability and quotation details for your sourcing requirement.

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