JIEXIN Electronics — Your one-stop global supplier of chips and electronic components.
ELECTRONIC COMPONENTS

Power Management - Specialized

Explore Power Management - Specialized parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Applications Current - Supply Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
MC33PF8200DBESR2 NXP USA Inc.

MC33PF8200DBESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

2,374
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200EMESR2 NXP USA Inc.

MC33PF8200EMESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

2,245
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ETESR2 NXP USA Inc.

MC33PF8200ETESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

3,104
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200A0ESR2 NXP USA Inc.

MC33PF8200A0ESR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

3,784
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DNESR2 NXP USA Inc.

MC33PF8200DNESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,610
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DMESR2 NXP USA Inc.

MC33PF8200DMESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

2,699
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DFESR2 NXP USA Inc.

MC33PF8200DFESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

2,666
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DHESR2 NXP USA Inc.

MC33PF8200DHESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,231
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ESESR2 NXP USA Inc.

MC33PF8200ESESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,160
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200CXESR2 NXP USA Inc.

MC33PF8200CXESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

3,107
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
UCD9240RGCR Texas Instruments

UCD9240RGCR

IC DGTL PWM SYSTEM CTRLR 64VQFN

Texas Instruments

2,056
Datasheet Fusion Digital Power™ 64-VFQFN Exposed Pad Tape & Reel (TR) Active Special Purpose - 3V ~ 3.6V -40°C ~ 110°C - - Surface Mount 64-VQFN (9x9)
TWL6032A2B6YFFT Texas Instruments

TWL6032A2B6YFFT

IC PWR/BATT MGMT 155DSBGA

Texas Instruments

3,957
Datasheet - 155-UFBGA, DSBGA Tape & Reel (TR) Discontinued at Digi-Key Handheld/Mobile Devices, OMAP™ 20µA 2.5V ~ 4.8V -40°C ~ 85°C - - Surface Mount 155-DSBGA (5.21x5.36)
MC35FS6512CAER2 NXP USA Inc.

MC35FS6512CAER2

FS6500

NXP USA Inc.

4,620
Datasheet - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS4501CAE NXP USA Inc.

MC35FS4501CAE

FS4500

NXP USA Inc.

2,228
Datasheet - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS6501CAE NXP USA Inc.

MC35FS6501CAE

FS6500

NXP USA Inc.

4,281
Datasheet - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC34PF8100FJEP NXP USA Inc.

MC34PF8100FJEP

POWER MANAGEMENT IC, I.MX8, PRE-

NXP USA Inc.

1,722
Datasheet - 56-VFQFN Exposed Pad Tray Active Processor 10µA 2.5V ~ 5.5V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
LT8253AHUFDM#TRPBF Analog Devices Inc.

LT8253AHUFDM#TRPBF

40V USB TYPE-C PD 60W 4-SW BUCK-

Analog Devices Inc.

2,767
Datasheet - 28-WFQFN Exposed Pad Tape & Reel (TR) Active USB, Type-C Controller 2.1mA 4V ~ 40V -40°C ~ 150°C (TJ) - - Surface Mount, Wettable Flank 28-QFN (4x5)
MC35FS6508CAER2 NXP USA Inc.

MC35FS6508CAER2

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

3,668
Datasheet - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC34FS6407NAER2 NXP USA Inc.

MC34FS6407NAER2

SYSTEM BASIS CHIP CAN 5V 0.7

NXP USA Inc.

1,043
Datasheet - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip 13mA 2.7V ~ 36V -40°C ~ 125°C (TA) - - Surface Mount 48-HLQFP (7x7)
TPS65073RSLR Texas Instruments

TPS65073RSLR

IC PWR MGMT 5CH W/2 LDO 48VQFN

Texas Instruments

1,208
Datasheet - 48-VFQFN Exposed Pad Tape & Reel (TR) Active Mobile/OMAP™ - 2.8V ~ 6.3V -40°C ~ 85°C - - Surface Mount 48-VQFN (6x6)
Total 6809 Record«Prev1... 238239240241242243244245...341Next»
FAQ

Frequently Asked Questions

What are Power Management - Specialized components used for?

Power Management - Specialized components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Power Management - Specialized part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Power Management - Specialized parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

BOM & COMPONENT SOURCING

Need Pricing or Stock Support for Power Management - Specialized?

Submit your required part numbers, manufacturers and quantities to receive stock availability, pricing, lead-time and sourcing support. Our team assists with active components, shortage parts, obsolete models and one-stop BOM procurement.

BOM BOM Phone +86-138 0989 9356 Email info@jx-icsource.com Cart Shopping Cart Account My Account Back To Top