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Power Management - Specialized

Explore Power Management - Specialized parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Applications Current - Supply Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
MAX16948AGEE/V+ Analog Devices Inc./Maxim Integrated

MAX16948AGEE/V+

AUTOMOTIVE DUAL REMOTE ANTENNA C

Analog Devices Inc./Maxim Integrated

3,269
Datasheet - 16-LSSOP (0.154", 3.90mm Width) Exposed Pad Tube Active Systems, Remote Power 2.1mA 4.5V ~ 28V -40°C ~ 105°C Automotive - Surface Mount 16-QSOP-EP
MC33FS8430G1ESR2 NXP USA Inc.

MC33FS8430G1ESR2

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

1,375
Datasheet * - Tape & Reel (TR) Active - - - - - - - -
MC33FS8430G2ESR2 NXP USA Inc.

MC33FS8430G2ESR2

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

4,068
Datasheet * - Tape & Reel (TR) Active - - - - - - - -
MC33FS8430G0ESR2 NXP USA Inc.

MC33FS8430G0ESR2

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

3,215
Datasheet * 56-VFQFN Exposed Pad Tape & Reel (TR) Active - - - - - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS8430G4ESR2 NXP USA Inc.

MC33FS8430G4ESR2

SYSTEM BASIS CHIP FS8430

NXP USA Inc.

2,874
Datasheet * - Tape & Reel (TR) Active - - - - - - - -
BM92T10MWV-ZE2 Rohm Semiconductor

BM92T10MWV-ZE2

USB TYPE-C PD CONTROL LSI, RECEI

Rohm Semiconductor

3,724
Datasheet - 40-VFQFN Exposed Pad Tape & Reel (TR) Obsolete USB, Type-C Controller - 4.75V ~ 20V -30°C ~ 105°C - - Surface Mount UQFN040V5050
MFS8406AMBP4ES NXP USA Inc.

MFS8406AMBP4ES

SAFETY POWER MANAGEMENT IC, QFN4

NXP USA Inc.

1,001
Datasheet - 48-VFQFN Exposed Pad Tray Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC35FS4507NAE NXP USA Inc.

MC35FS4507NAE

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

4,830
Datasheet - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33VR5500V0KSR2 NXP USA Inc.

MC33VR5500V0KSR2

1 BUCK, QM, INFOTAINMENT

NXP USA Inc.

4,150
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active SMPS Start-Up 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33VR5500V1KSR2 NXP USA Inc.

MC33VR5500V1KSR2

1 BUCK, QM, INFOTAINMENT

NXP USA Inc.

1,259
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active SMPS Start-Up 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MFS8612BMDA0ES NXP USA Inc.

MFS8612BMDA0ES

IC FS86 SYSTEM BASIS CHIP ASIL

NXP USA Inc.

4,848
Datasheet - 48-VFQFN Exposed Pad Tray Active Camera - 4.5V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-QFN (7x7)
MC33FS6503CAER2 NXP USA Inc.

MC33FS6503CAER2

SYSTEM BASIS CHIP DCDC 0.8A VCO

NXP USA Inc.

3,462
Datasheet - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC33FS6521CAE NXP USA Inc.

MC33FS6521CAE

SYSTEM BASIS CHIP DCDC 2.2A VCO

NXP USA Inc.

1,765
Datasheet - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC35FS4508NAER2 NXP USA Inc.

MC35FS4508NAER2

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

1,439
Datasheet - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MVR5510AVMANEPR2 NXP USA Inc.

MVR5510AVMANEPR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

4,902
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MVR5510AVMALEPR2 NXP USA Inc.

MVR5510AVMALEPR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

3,192
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS6507LAE NXP USA Inc.

MC33FS6507LAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

4,253
Datasheet - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33PF8100FJESR2 NXP USA Inc.

MC33PF8100FJESR2

POWER MANAGEMENT IC, I.MX8, PRE-

NXP USA Inc.

2,693
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active Processor 10µA 2.5V ~ 5.5V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100F3ESR2 NXP USA Inc.

MC33PF8100F3ESR2

POWER MANAGEMENT IC, I.MX8, PRE-

NXP USA Inc.

3,704
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active Processor 10µA 2.5V ~ 5.5V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
LTC3109EGN#TRPBF Analog Devices Inc.

LTC3109EGN#TRPBF

IC BOOST CONVERTER PMU 20SSOP

Analog Devices Inc.

1,443
Datasheet - 20-SSOP (0.154", 3.90mm Width) Tape & Reel (TR) Active Energy Harvesting 6mA 30mV ~ 500mV -40°C ~ 125°C - - Surface Mount 20-SSOP
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FAQ

Frequently Asked Questions

What are Power Management - Specialized components used for?

Power Management - Specialized components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Power Management - Specialized part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

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Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

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