Memory
Explore Memory parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AS7C34096A-20JINIC SRAM 4MBIT PARALLEL 36SOJ |
4,139 |
|
Datasheet | - | 36-BSOJ (0.400", 10.16mm Width) | Tube | Active | Not Verified | Volatile | SRAM | SRAM - Asynchronous | 4Mbit | 512K x 8 | Parallel | - | 20ns | 20 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 36-SOJ |
|
D2516AN9EXGXNI-UITEMP 4GB 96 BALL FBGA DDR4 3200 |
1,471 |
|
Datasheet | - | 96-FBGA | Tray | Active | - | - | DRAM | SDRAM - DDR4 | 16bit | 256 x 16 | - | - | - | - | 1.2V | -40°C ~ 95°C | - | - | - | - |
|
FEMC008GSTE9-T14-16IC FLASH 64MBIT EMMC 153FBGA |
1,787 |
|
Datasheet | XTRA III | 153-VFBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (MLC) | 64Gbit | 8G x 8 | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 153-FBGA (11.5x13) |
|
TH58NVG3S0HTA00IC FLASH 8GBIT PARALLEL 48TSOP I |
1,689 |
|
Datasheet | - | 48-TFSOP (0.724", 18.40mm Width) | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 8Gbit | 1G x 8 | Parallel | - | 25ns | 25 ns | 2.7V ~ 3.6V | 0°C ~ 70°C (TA) | - | - | Surface Mount | 48-TSOP I |
|
TH58BVG3S0HTA00IC FLASH 8GBIT PARALLEL 48TSOP I |
4,892 |
|
Datasheet | Benand™ | 48-TFSOP (0.724", 18.40mm Width) | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 8Gbit | 1G x 8 | Parallel | - | 25ns | 25 ns | 2.7V ~ 3.6V | 0°C ~ 70°C (TA) | - | - | Surface Mount | 48-TSOP I |
|
AS4C256M16D4A-62BINIC DRAM 4GBIT POD 96FBGA |
4,816 |
|
Datasheet | - | 96-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - DDR4 | 4Gbit | 256M x 16 | POD | 1.6 GHz | 15ns | 18 ns | 1.14V ~ 1.26V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 96-FBGA (7.5x13) |
|
S29GL512T12TFVV10IC FLASH 512MBIT PARALLEL 56TSOP |
1,117 |
|
Datasheet | GL-T | 56-TFSOP (0.724", 18.40mm Width) | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 512Mbit | 64M x 8 | Parallel | - | 60ns | 120 ns | 1.65V ~ 3.6V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 56-TSOP |
|
|
MR256A08BCYS35IC RAM 256KBIT PARALLEL 44TSOP2 |
2,254 |
|
Datasheet | - | 44-TSOP (0.400", 10.16mm Width) | Tray | Active | Not Verified | Non-Volatile | RAM | MRAM (Magnetoresistive RAM) | 256Kbit | 32K x 8 | Parallel | - | 35ns | 35 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 44-TSOP2 |
|
CY14B101J2-SXIIC NVSRAM 1MBIT I2C 3.4MHZ 8SOIC |
2,660 |
|
Datasheet | - | 8-SOIC (0.154", 3.90mm Width) | Tube | Active | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mbit | 128K x 8 | I2C | 3.4 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-SOIC |
|
FM8G00EMCV3RBFIINDUSTRIAL TEMP. -40C TO +85C 11 |
4,110 |
|
Datasheet | - | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
S29GL512T11TFV020IC FLASH 512MBIT PARALLEL 56TSOP |
2,535 |
|
Datasheet | GL-T | 56-TFSOP (0.724", 18.40mm Width) | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 512Mbit | 64M x 8 | Parallel | - | 60ns | 110 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 56-TSOP |
|
S26KL256SDABHV020IC FLASH 256MBIT HYPERBUS 24FBGA |
2,721 |
|
Datasheet | HYPERFLASH™ KL | 24-VBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 256Mbit | 32M x 8 | HyperBus | 100 MHz | - | 96 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 24-FBGA (6x8) |
|
EMMC32G-TS0A-01011IC FLASH 256GBIT EMMC 153WFBGA |
3,381 |
|
Datasheet | e•MMC™ | 153-VFBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (TLC) | 256Gbit | 32G x 8 | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -25°C ~ 85°C | - | - | Surface Mount | 153-FBGA (11.5x13) |
|
IS25WP01GG-RHLEIC FLASH 1GBIT SPI/QUAD |
4,456 |
|
Datasheet | - | 24-TBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NOR (SLC) | 1Gbit | 128M x 8 | SPI - Quad I/O, QPI, DTR | 133 MHz | 70µs | 6 ns | 1.65V ~ 1.95V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 24-TFBGA (6x8) |
|
AS4C128M16MD4V-062BANIC DRAM 2GBIT LVSTL 200FBGA |
1,574 |
|
Datasheet | - | 200-WFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 128M x 16 | LVSTL | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Automotive | AEC-Q100 | Surface Mount | 200-FBGA (10x14.5) |
|
FM16G0EMCV3RBFCCOMMERCIAL TEMP. -25C TO +85C 11 |
3,606 |
|
Datasheet | - | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
D0811PM2FDGUKW-UIC DRAM 8GBIT 200FBGA |
3,892 |
|
Datasheet | LPDDR4 | - | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 8Gbit | 512M x 16 | - | - | - | - | - | -40°C ~ 95°C | - | - | Surface Mount | 200-FBGA (10x14.5) |
|
CY7C1361C-100BZXEIC SRAM 9MBIT PAR 165FBGA |
4,620 |
|
Datasheet | - | 165-LBGA | Tray | Active | Not Verified | Volatile | SRAM | SRAM - Synchronous, SDR | 9Mbit | 256K x 36 | Parallel | 100 MHz | - | 8.5 ns | 3.135V ~ 3.6V | -40°C ~ 125°C (TA) | - | - | Surface Mount | 165-FBGA (13x15) |
|
SFEM004GB2ED1TO-I-5E-111-STDIC FLASH 32GBIT EMMC 153BGA |
3,646 |
|
Datasheet | EM-30 | 153-TFBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (TLC) | 32Gbit | 4G x 8 | eMMC | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | - | - | Surface Mount | 153-BGA (11.5x13) |
|
AS4C512M32MD4V-053BINIC DRAM 16GBIT LVSTLE 200FBGA |
1,826 |
|
Datasheet | - | 200-VFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 16Gbit | 512M x 32 | LVSTLE_06 | 1.866 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | - | - | Surface Mount | 200-FBGA (10x15) |
Frequently Asked Questions
What are Memory components used for?
Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Memory part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.