Memory
Explore Memory parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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EMMC256-TY29-5B111IC FLASH 2TBIT EMMC 153WFBGA |
287 |
|
Datasheet | - | 153-WFBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (TLC) | 2Tbit | 256G x 8 | eMMC | - | - | - | 1.8V, 3.3V | -25°C ~ 85°C | - | - | Surface Mount | 153-WFBGA (11.5x13) |
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EMMC256-TY29-5B101IC FLASH 2TBIT EMMC 153FBGA |
147 |
|
Datasheet | - | 153-BGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (TLC) | 2Tbit | 256G x 8 | eMMC | - | - | - | - | -25°C ~ 85°C | - | - | Surface Mount | 153-FBGA (11.5x13) |
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EMMC256-TY29-5B102IC FLASH 2TBIT EMMC 153FBGA |
2,949 |
|
Datasheet | e•MMC™ | 153-VFBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (TLC) | 2Tbit | 256G x 8 | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -25°C ~ 85°C | - | - | Surface Mount | 153-FBGA (11.5x13) |
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MT62F2G32D4DS-026 WT:BIC DRAM 64GBIT PAR 200WFBGA |
900 |
|
Datasheet | - | 200-WFBGA | Box | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR5 | 64Gbit | 2G x 32 | Parallel | 3.2 GHz | - | - | 1.05V | - | - | - | Surface Mount | 200-WFBGA (10x14.5) |
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Q6422XM3BDGVK-UIC DRAM 64GBIT PAR 200FBGA |
144 |
|
Datasheet | LPDDR4X | 200-VFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 64Gbit | 4G x 16 | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 200-FBGA (10x14.5) |
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MTFC256GBCAQTC-ITIC FLASH 2TBIT MMC |
479 |
|
Datasheet | - | - | Tray | Active | - | - | FLASH | - | 2Tbit | 256G x 8 | eMMC | - | - | - | - | - | - | - | - | - |
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IS21TF128G-JQLIIC FLASH 1TBIT EMMC 100LFBGA |
2,398 |
|
Datasheet | - | 100-LBGA | Bulk | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (TLC) | 1Tbit | 128G x 8 | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 100-LFBGA (14x18) |
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MT53E1536M32D4DE-046 AIT:CIC DRAM 48GBIT 2.133GHZ WFBGA |
1,279 |
|
Datasheet | - | 200-TFBGA | Tray | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 48Gbit | 1.5G x 32 | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -40°C ~ 95°C (TC) | Automotive | AEC-Q100 | Surface Mount | 200-TFBGA (10x14.5) |
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MX66U51235FME-13GIC FLASH 512MBIT SPI/QUAD 16SOP |
2,557 |
|
Datasheet | MXSMIO™ | 16-SOIC (0.295", 7.50mm Width) | Tube | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 512Mbit | 64M x 8 | SPI - Quad I/O | 108 MHz | 30µs, 3ms | - | 1.65V ~ 2V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 16-SOP |
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THGJFLT1E45BATPIC FLASH 4TBIT UFS 153BGA |
152 |
|
Datasheet | e•MMC™ | 153-WFBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (TLC) | 4Tbit | 512G x 8 | UFS 4.0 | 2.32 GHz | - | - | 2.4V ~ 2.7V | -25°C ~ 85°C | - | - | Surface Mount | 153-WFBGA (11.5x13) |
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DS1350WP-100+IC NVSRAM 4MBIT PAR 34PWRCAP |
4,798 |
|
Datasheet | - | 34-PowerCap™ Module | Tray | Active | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 4Mbit | 512K x 8 | Parallel | - | 100ns | 100 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | - | - | Surface Mount | 34-PowerCap Module |
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EMMC256-IY29-5B101IC FLASH 2TBIT EMMC 5.1 153FBGA |
152 |
|
Datasheet | I-Temp e•MMC™ | 153-BGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (TLC) | 2Tbit | 256G x 8 | eMMC_5.1 | - | - | - | - | -40°C ~ 85°C | - | - | Surface Mount | 153-FBGA (11.5x13) |
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DS1265AB-70IND+IC NVSRAM 8MBIT PARALLEL 36EDIP |
1,618 |
|
Datasheet | - | 36-DIP Module (0.610", 15.49mm) | Tube | Active | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 8Mbit | 1M x 8 | Parallel | - | 70ns | 70 ns | 4.75V ~ 5.25V | -40°C ~ 85°C (TA) | - | - | Through Hole | 36-EDIP |
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CY14B116N-ZSP25XIIC NVSRAM 16MBIT PAR 54TSOP II |
183 |
|
Datasheet | - | 54-TSOP (0.400", 10.16mm Width) | Tray | Active | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 16Mbit | 1M x 16 | Parallel | - | 25ns | 25 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 54-TSOP II |
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DS1250Y-100IND+IC NVSRAM 4MBIT PARALLEL 32EDIP |
4,698 |
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Datasheet | - | 32-DIP Module (0.600", 15.24mm) | Tube | Active | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 4Mbit | 512K x 8 | Parallel | - | 100ns | 100 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | - | - | Through Hole | 32-EDIP |
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DS1250W-100IND+IC NVSRAM 4MBIT PARALLEL 32EDIP |
1,634 |
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Datasheet | - | 32-DIP Module (0.600", 15.24mm) | Tube | Active | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 4Mbit | 512K x 8 | Parallel | - | 100ns | 100 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Through Hole | 32-EDIP |
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DS1250AB-70IND+IC NVSRAM 4MBIT PARALLEL 32EDIP |
1,077 |
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Datasheet | - | 32-DIP Module (0.600", 15.24mm) | Tube | Active | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 4Mbit | 512K x 8 | Parallel | - | 70ns | 70 ns | 4.75V ~ 5.25V | -40°C ~ 85°C (TA) | - | - | Through Hole | 32-EDIP |
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DS1250YP-70IND+IC NVSRAM 4MBIT PAR 34PWRCAP |
3,483 |
|
Datasheet | - | 34-PowerCap™ Module | Tube | Active | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 4Mbit | 512K x 8 | Parallel | - | 70ns | 70 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 34-PowerCap Module |
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SM662PEF BESTIC FLASH 4TBIT EMMC 100BGA |
152 |
|
Datasheet | Ferri-eMMC® | 100-LBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (TLC) | 4Tbit | 512G x 8 | eMMC | - | - | - | - | -40°C ~ 85°C | - | - | Surface Mount | 100-BGA (14x18) |
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MT62F4G32D8DV-026 WT:BIC DRAM 128GBIT PAR FBGA |
1,046 |
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Datasheet | - | - | Box | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | 4G x 32 | Parallel | 3.2 GHz | - | - | - | -25°C ~ 85°C | - | - | - | - |
Frequently Asked Questions
What are Memory components used for?
Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Memory part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
