Memory
Explore Memory parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MT62F1G64D4EK-023 AIT:B TRIC DRAM 64GBIT PAR 441TFBGA |
1,506 |
|
Datasheet | - | 441-TFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR5 | 64Gbit | 1G x 64 | Parallel | 2.133 GHz | - | - | 1.05V | -40°C ~ 95°C | Automotive | AEC-Q100 | Surface Mount | 441-TFBGA (14x14) |
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MT62F2G32D4DS-023 AIT:BIC DRAM 64GBIT PAR 200WFBGA |
4,232 |
|
Datasheet | - | 200-WFBGA | Box | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR5 | 64Gbit | 2G x 32 | Parallel | 4.266 GHz | - | - | 1.05V | - | Automotive | AEC-Q100 | Surface Mount | 200-WFBGA (10x14.5) |
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MT53B512M64D4NW-062 WT:C TRIC DRAM 32GBIT 1.6GHZ FBGA |
3,641 |
|
Datasheet | - | - | Tape & Reel (TR) | Obsolete | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 32Gbit | 512M x 64 | - | 1.6 GHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - | - |
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MT53B1024M32D4NQ-062 WT:C TRIC DRAM 32GBIT 1.6GHZ 200VFBGA |
4,509 |
|
Datasheet | - | 200-VFBGA | Tape & Reel (TR) | Obsolete | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 32Gbit | 1G x 32 | - | 1.6 GHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | Surface Mount | 200-VFBGA (10x14.5) |
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MT53D1024M32D4NQ-062 WT:D TRIC DRAM 32GBIT 1.6GHZ 200VFBGA |
2,623 |
|
Datasheet | - | 200-VFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 32Gbit | 1G x 32 | - | 1.6 GHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | Surface Mount | 200-VFBGA (10x14.5) |
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MT62F2G64D8AK-031 XT:BIC DRAM 128GBIT FBGA |
2,588 |
|
Datasheet | - | - | Tray | Active | - | - | DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | - | - | - | - | - | - | - | - | - | - | - |
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MT62F1G128D8AK-026 XT:CIC DRAM 128GBIT VFBGA |
4,071 |
|
Datasheet | - | - | Tray | Active | - | - | DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | 1G x 128 | - | - | - | - | - | - | - | - | - | - |
|
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MT62F2G64D8AS-026 XT:CIC DRAM 128GBIT VFBGA |
3,591 |
|
Datasheet | - | - | Tray | Active | - | - | DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | - | - | - | - | - | - | - | - | - | - | - |
|
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MT62F1G128DAVF-031 XT:BIC DRAM 128GBIT FBGA |
4,742 |
|
Datasheet | - | - | Tray | Active | - | - | DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | 1G x 128 | - | - | - | - | - | - | - | - | - | - |
|
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MT62F2G64D8AK-026 XT:CIC DRAM 128GBIT VFBGA |
3,936 |
|
Datasheet | - | - | Tray | Active | - | - | DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | - | - | - | - | - | - | - | - | - | - | - |
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MT62F1G128D8AK-031 XT:BIC DRAM 128GBIT FBGA |
4,458 |
|
Datasheet | - | - | Tray | Active | - | - | DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | 1G x 128 | - | - | - | - | - | - | - | - | - | - |
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EM064LXQAB313ES2RIC RAM 64MBIT XSPI 24TBGA |
1,479 |
|
Datasheet | EMxxLX | 24-TBGA | Tape & Reel (TR) | Active | - | Non-Volatile | RAM | MRAM (Magnetoresistive RAM) | 64Mbit | 8M x 8 | SPI - Quad I/O | 200 MHz | - | - | 1.65V ~ 2V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 24-TBGA (6x8) |
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EM064LXQADG13ES2RIC RAM 64MBIT XSPI 8DFN |
1,025 |
|
Datasheet | EMxxLX | 8-VDFN Exposed Pad | Tape & Reel (TR) | Active | - | Non-Volatile | RAM | MRAM (Magnetoresistive RAM) | 64Mbit | 8M x 8 | SPI - Quad I/O | 200 MHz | - | - | 1.65V ~ 2V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 8-DFN (6x8) |
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EM064LXQAB313ES2TIC RAM 64MBIT XSPI 24TBGA |
3,687 |
|
Datasheet | EMxxLX | 24-TBGA | Tray | Active | - | Non-Volatile | RAM | MRAM (Magnetoresistive RAM) | 64Mbit | 8M x 8 | SPI - Quad I/O | 200 MHz | - | - | 1.65V ~ 2V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 24-TBGA (6x8) |
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MT53E1G64D4NW-046 WT:CIC DRAM 64GBIT 432VFBGA |
2,360 |
|
Datasheet | - | 432-VFBGA | Tray | Active | Not Verified | - | DRAM | SDRAM - Mobile LPDDR4X | 64Gbit | - | - | - | - | - | - | - | - | - | Surface Mount | 432-VFBGA (15x15) |
|
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MT53E1G64D4NW-046 WT:C TRIC DRAM 64GBIT 432VFBGA |
3,742 |
|
Datasheet | - | 432-VFBGA | Tape & Reel (TR) | Active | Not Verified | - | DRAM | SDRAM - Mobile LPDDR4X | 64Gbit | - | - | - | - | - | - | - | - | - | Surface Mount | 432-VFBGA (15x15) |
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CY14B108L-ZS25XITIC NVSRAM 8MBIT PAR 44TSOP II |
2,628 |
|
Datasheet | - | 44-TSOP (0.400", 10.16mm Width) | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 8Mbit | 1M x 8 | Parallel | - | 25ns | 25 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 44-TSOP II |
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CY14B108L-ZS25XIIC NVSRAM 8MBIT PAR 44TSOP II |
4,915 |
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Datasheet | - | 44-TSOP (0.400", 10.16mm Width) | Tray | Active | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 8Mbit | 1M x 8 | Parallel | - | 25ns | 25 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 44-TSOP II |
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CY14B108N-BA25XITIC NVSRAM 8MBIT PARALLEL 48FBGA |
3,690 |
|
Datasheet | - | 48-TFBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 8Mbit | 512K x 16 | Parallel | - | 25ns | 25 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-FBGA (6x10) |
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MT29F2T08EMHAFJ4-3ITF:AIC FLASH 2TBIT PARALLEL 132VBGA |
2,707 |
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Datasheet | - | 132-VBGA | Bulk | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (TLC) | 2Tbit | 256G x 8 | Parallel | 333 MHz | - | - | 2.5V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 132-VBGA (12x18) |
Frequently Asked Questions
What are Memory components used for?
Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Memory part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
