Memory
Review Memory Memory components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.
If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MTFC32GAMAKAM-WT ES TRIC FLASH 256GBIT MMC |
4,041 |
|
Datasheet | e•MMC™ | - | Tape & Reel (TR) | Obsolete | Not Verified | Non-Volatile | FLASH | FLASH - NAND | 256Gbit | 32G x 8 | MMC | - | - | - | - | -25°C ~ 85°C (TA) | - | - | - | - |
|
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MT62F1G32D2DS-026 WT:C TRIC DRAM 32GBIT PAR 200WFBGA |
4,869 |
|
Datasheet | - | 200-WFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR5 | 32Gbit | 1G x 32 | Parallel | 3.2 GHz | - | - | 1.05V | -25°C ~ 85°C | - | - | Surface Mount | 200-WFBGA (10x14.5) |
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MT62F1G32D2DS-026 WT:B TRIC DRAM 32GBIT PAR 200WFBGA |
3,752 |
|
Datasheet | - | 200-WFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR5 | 32Gbit | 1G x 32 | Parallel | 3.2 GHz | - | - | 1.05V | -25°C ~ 85°C | - | - | Surface Mount | 200-WFBGA (10x14.5) |
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MTFC64GASAQHD-AIT TRIC FLASH 512GBIT EMMC 153VFBGA |
3,150 |
|
Datasheet | - | 153-VFBGA | Tape & Reel (TR) | Last Time Buy | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 512Gbit | 64G x 8 | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Automotive | AEC-Q104 | Surface Mount | 153-VFBGA (11.5x13) |
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MT62F1G32D2DS-023 WT:B TRIC DRAM 32GBIT PAR 200WFBGA |
3,496 |
|
Datasheet | - | 200-WFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR5 | 32Gbit | 1G x 32 | Parallel | 3.2 GHz | - | - | 1.05V | -25°C ~ 85°C | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
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MT62F1G32D2DS-023 WT:C TRIC DRAM 32GBIT PAR 200WFBGA |
3,030 |
|
Datasheet | - | 200-WFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR5 | 32Gbit | 1G x 32 | Parallel | 3.2 GHz | - | - | 1.05V | -25°C ~ 85°C | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
MT25QL02GCBB8E12-0AAT TRIC FLASH 2GBIT SPI 24TPBGA |
2,856 |
|
Datasheet | - | 24-TBGA | Tape & Reel (TR) | Active | Verified | Non-Volatile | FLASH | FLASH - NOR | 2Gbit | 256M x 8 | SPI - Quad I/O | 133 MHz | 8ms, 2.8ms | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Automotive | AEC-Q100 | Surface Mount | 24-T-PBGA (6x8) |
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MT25QU02GCBB8E12-0AAT TRIC FLASH 2GBIT SPI 24TPBGA |
3,464 |
|
Datasheet | - | 24-TBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 2Gbit | 256M x 8 | SPI - Quad I/O | 133 MHz | 8ms, 2.8ms | - | 1.7V ~ 2V | -40°C ~ 105°C (TC) | Automotive | AEC-Q100 | Surface Mount | 24-T-PBGA (6x8) |
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MTFC64GASAQHD-AITIC FLASH 512GBIT EMMC 153VFBGA |
3,260 |
|
Datasheet | - | 153-VFBGA | Box | Last Time Buy | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 512Gbit | 64G x 8 | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Automotive | AEC-Q104 | Surface Mount | 153-VFBGA (11.5x13) |
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MT62F1G32D2DS-026 WT:CIC DRAM 32GBIT PAR 200WFBGA |
2,277 |
|
Datasheet | - | 200-WFBGA | Box | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR5 | 32Gbit | 1G x 32 | Parallel | 3.2 GHz | - | - | 1.05V | -25°C ~ 85°C | - | - | Surface Mount | 200-WFBGA (10x14.5) |
Frequently Asked Questions
What are Memory components used for?
Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Memory part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
