Memory
Review Memory Memory components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.
If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
IS42S16320F-6TLIIC DRAM 512MBIT PAR 54TSOP II |
4,457 |
|
Datasheet | - | 54-TSOP (0.400", 10.16mm Width) | Tube | Active | Not Verified | Volatile | DRAM | SDRAM | 512Mbit | 32M x 16 | Parallel | 167 MHz | - | 5.4 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 54-TSOP II |
|
IS42S32160F-75ETLIC DRAM 512MBIT PAR 86TSOP II |
2,373 |
|
Datasheet | - | 86-TFSOP (0.400", 10.16mm Width) | Tube | Active | Not Verified | Volatile | DRAM | SDRAM | 512Mbit | 16M x 32 | Parallel | 133 MHz | - | 6 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | - | - | Surface Mount | 86-TSOP II |
|
IS21EF08GP-JQLI8GB, 100 BALL FBGA, 3.3V, ROHS, |
3,443 |
|
Datasheet | - | 100-LBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (MLC) | 64Gbit | 8G x 8 | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 100-LFBGA (14x18) |
|
IS46DR16640B-25DBLA2IC DRAM 1GBIT PARALLEL 84TWBGA |
2,018 |
|
Datasheet | - | 84-TFBGA | Tray | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - DDR2 | 1Gbit | 64M x 16 | Parallel | 400 MHz | 15ns | 400 ps | 1.7V ~ 1.9V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 84-TWBGA (8x12.5) |
|
IS61WV102416EDBLL-10TLI-TRIC SRAM 16MBIT PARALLEL 48TSOP I |
1,416 |
|
Datasheet | - | 48-TFSOP (0.724", 18.40mm Width) | Tape & Reel (TR) | Active | Not Verified | Volatile | SRAM | SRAM - Asynchronous | 16Mbit | 1M x 16 | Parallel | - | 10ns | 10 ns | 2.4V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-TSOP I |
|
IS45S16320F-6BLA1-TRIC DRAM 512MBIT PAR 54TFBGA |
3,814 |
|
Datasheet | - | 54-TFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM | 512Mbit | 32M x 16 | Parallel | 167 MHz | - | 5.4 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 54-TW-BGA (8x13) |
|
IS61NLP25636B-200B3LI-TRIC SRAM 9MBIT PARALLEL 165TFBGA |
3,211 |
|
Datasheet | - | 165-TBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | SRAM | SRAM - Synchronous, SDR | 9Mbit | 256K x 36 | Parallel | 200 MHz | - | 3.1 ns | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 165-TFBGA (13x15) |
|
IS43LD16128B-25BLIIC DRAM 2GBIT PARALLEL 134TFBGA |
2,362 |
|
Datasheet | - | 134-TFBGA | Tray | Obsolete | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4 | 2Gbit | 128M x 16 | Parallel | 400 MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TC) | - | - | Surface Mount | 134-TFBGA (10x11.5) |
|
|
IS45S16320F-6TLA1-TRIC DRAM 512MBIT PAR 54TSOP II |
4,476 |
|
Datasheet | - | 54-TSOP (0.400", 10.16mm Width) | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM | 512Mbit | 32M x 16 | Parallel | 167 MHz | - | 5.4 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 54-TSOP II |
|
|
IS46LQ16256B-062BLA2AUTOMOTIVE (TC: -40 TO +105C), 4 |
2,957 |
|
Datasheet | - | 200-VFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | 256M x 16 | LVSTL | 1.6 GHz | - | - | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Automotive | AEC-Q100 | Surface Mount | 200-VFBGA (10x14.5) |
Frequently Asked Questions
What are Memory components used for?
Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Memory part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
